HDI Hybrid PCB 8-Layer 1.5mm RO4003C S1000-2M Advanced Impedance Control for RF and Microwave Circuits
1. Basic PCB Specifications
Basic PCB Specifications |
Parameters |
Board Type |
8 layers |
Material Type |
RO4003C + FR-4 Tg170 °C |
Solder Mask |
Both sides, Green |
Silkscreen Print |
Top side, White |
Surface Finish |
ENIG |
Total Board Thickness |
1.5mm ± 10% |
Board Size |
87.5mm x 40.6mm (1 piece) |
Minimum Hole Size |
0.2mm |
Solder Mask Thickness |
10μm |
Minimum Dielectric Thickness |
100μm |
Minimum Trace Line Width |
115μm |
Minimum Spacing |
135μm |
Blind Via |
Yes, L1-L2, L7-L8 |
Buried Via |
Yes, L2-L7 |
Back Drilled Via |
Yes, L1-L6 |
Impedance Controlled
|
- 50 ohm, differential pairs, Top layer, 4mil / 4mil trace/gap, reference layer 2 |
- 100 ohm, differential pairs, Top layer, 5mil / 6mil trace/gap, reference layer 2 |
|
- 50 ohm, single-ended, Top layer, 6mil trace, reference layer 2 |
|
All 0.3mm Vias |
Filled and capped according to IPC 4761 Type VII |
Edge Plating |
Required |
2.PCB Stack-Up (Component Side at Top)
TYPE |
LAYER NO. |
THICKNESS (μm) |
SPECIFICATION |
COPPER |
1 |
45 |
18μm BASE COPPER + 25μm PLATING |
RO4003C |
CORE |
203 |
IPC-4101/24 |
COPPER |
2 |
38 |
|
FR-4 |
PP |
100 |
IPC-4101/24 |
COPPER |
3 |
17 |
|
FR-4 S1000-2M |
CORE |
240 |
IPC-4101/24 |
COPPER |
4 |
35 |
|
FR-4 |
PP |
100 |
IPC-4101/24 |
COPPER |
5 |
35 |
|
FR-4 S1000-2M |
CORE |
240 |
IPC-4101/24 |
COPPER |
6 |
17 |
|
FR-4 |
PP |
100 |
IPC-4101/24 |
COPPER |
7 |
38 |
|
RO4003C |
CORE |
200 |
IPC-4101/24 |
COPPER |
8 |
45 |
18μm BASE COPPER + 25μm PLATING |
3. PCB Statistics
- Components: 41
- Total Pads: 73
- Thru Hole Pads: 35
- Top SMT Pads: 26
- Bottom SMT Pads: 12
- Vias: 57
- Nets: 6
4. Type of Artwork Supplied
- Gerber RS-274-X
5. Quality Standard
- IPC-Class-2
6. Availability
- Worldwide
7. Introduction to RO4003C
Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics that combine the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. This design offers superior high-frequency performance and cost-effective circuit fabrication. The result is a low-loss material that can be fabricated using standard epoxy/glass (FR-4) processes at competitive prices.
RO4003C materials possess the necessary properties for designers of RF microwave circuits, matching networks, and controlled impedance transmission lines. Its low dielectric loss allows RO4003C to be used in applications where higher operating frequencies limit the use of conventional circuit board laminates. Available in various configurations, RO4003C laminates utilize both 1080 and 1674 glass fabric styles, all meeting the same laminate electrical performance specifications. RO4003C materials are non-brominated and do not have a UL 94 V-0 rating.
8. Features of RO4003C
- Dielectric Constant: DK 3.38 ± 0.05 at 10GHz
- Dissipation Factor: 0.0027 at 10GHz
- Thermal Conductivity: 0.71 W/m/°K
- Thermal Coefficient of Dielectric Constant: +40 ppm/°C, ranging from -50°C to 150°C
- CTE Matched to Copper**: X-axis 11ppm/°C, Y-axis 14ppm/°C
- Low Z-Axis Coefficient of Thermal Expansion: 46 ppm/°C
- Tg: >280 °C
- Low Moisture Absorption: 0.06%
9. Features of S1000-2M
- Low Z-Axis CTE: 2.4 ppm/°C, excellent through-hole reliability.
- High Tg: 185 °C, high heat resistance for lead-free FR-4.
- Low Water Absorption: 0.08%, humidity resistance.
- T260: 60 minutes, T288: 30 minutes.
- UL 94-V0 Flammability Rating.
10. Some Typical Applications
- Cellular Base Station Antennas and Power Amplifiers
- RF Identification Tags
- Automotive Radar and Sensors
- LNBs for Direct Broadcast Satellites
- Computing, Communication, Automotive Electronics