Hybrid PCB on RO4003C and S1000-2M 6-Layer 1.1mm Thick Low Loss Material for Microstrip and Stripline Circuits
1. Introduction to RO4003C
Rogers RO4003C materials are proprietary woven glass-reinforced hydrocarbon/ceramics, combining the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. This design aims to deliver superior high-frequency performance while maintaining cost-effective circuit fabrication. Consequently, RO4003C is a low-loss material that can be processed using standard epoxy/glass (FR-4) techniques at competitive prices.
RO4003C possesses essential properties for RF microwave circuit designers, matching networks, and controlled impedance transmission lines. Its low dielectric loss makes it suitable for applications where higher operating frequencies restrict the use of conventional circuit board laminates.
Available in various configurations, RO4003C laminates utilize both 1080 and 1674 glass fabric styles, all meeting the same laminate electrical performance specifications. Notably, RO4003C materials are non-brominated and are not rated UL 94 V-0.
2. Features of RO4003C
Dielectric Constant: DK 3.38 ± 0.05 at 10GHz
Dissipation Factor: 0.0027 at 10GHz
Thermal Conductivity: 0.71 W/m/°K
Thermal Coefficient of Dielectric Constant: +40 ppm/°C (ranging from -50°C to 150°C)
Coefficient of Thermal Expansion (CTE) matched to copper: X-axis 11 ppm/°C, Y-axis 14 ppm/°C
Low Z-axis CTE: 46 ppm/°CBR
Glass Transition Temperature (Tg): >280 °C
Low Moisture Absorption: 0.06%
2.2 Features of S1000-2M
Lower Z-axis CTE for improved through-hole reliability
Excellent mechanical processability and thermal resistance
Lead-free compatible
Tg: 180°C (DSC), compatible with UV blocking/AOI
High heat resistance
Excellent anti-CAF performance
Low water absorption
3. PCB Stackup: 6-Layer Rigid PCB
Copper Layer 1: 35 µm
RO4003C: 0.305 mm (12 mil)
Copper Layer 2: 35 µm
Prepreg: 1080 RC63% 0.0644 mm (2.5 mil)B>
Copper Layer 3: 35 µm
S1000-2M: 0.203 mm (3 mil)
Copper Layer 4: 35 µm
Prepreg: 1080 RC63% 0.0644 mm (2.5 mil)
Copper Layer 5: 35 µm
RO4003C: 0.305 mm (12 mil)
Copper Layer 6: 35 µm
4. PCB Construction Details
PCB Construction Details |
Parameters |
Board Dimensions |
62.5 mm x 57.8 mm = 1 PCS, ± 0.15 mm |
Minimum Trace/Space |
4/7 mils |
Minimum Hole Size |
0.3 mm |
Blind Vias |
None |
Finished Board Thickness |
1.1 mm |
Finished Copper Weight |
1 oz (1.4 mils) for inner/outer layers |
Via Plating Thickness |
20 µm |
Surface Finish |
Immersion Silver |
Top Silkscreen |
White |
Bottom Silkscreen |
None |
Top Solder Mask |
Matte Blue |
Bottom Solder Mask |
Matte Blue |
Impedance Control |
4 mil / 7 mil traces/gaps on the top layer, 90 ohm |
Print Series Number |
Yes |
Via Filling and Capping |
0.3 mm vias are filled and capped |
Electrical Testing |
100% Electrical Testing conducted prior to shipment |
5. PCB Statistics
Components: 22
Total Pads: 39
Through Hole Pads: 21
Top SMT Pads: 18
Bottom SMT Pads: 0
Vias: 21
Nets: 5
6. Type of Artwork Supplied
Gerber RS-274-X
7. Accepted Standard
IPC-Class-2
8. Availability
Worldwide
9. Typical Applications
Commercial Airline Broadband Antennas
Microstrip and Stripline Circuits
Millimeter Wave Applications
Radar Systems
Guidance Systems
Point-to-Point Digital Radio Antennas