Rogers RO3010 2-Layer 50mil High-Dk Ceramic PTFE PCB with EPIG Nickel-Free Finish
1.RO3010 Material Introduction
Rogers RO3010 advanced circuit materials are ceramic-filled PTFE composites that offer a higher dielectric constant with excellent stability. They are competitively priced products with exceptional mechanical and electrical stability. This stability simplifies the design of broadband components and allows the materials to be used in a wide range of applications over a very broad range of frequencies. This material's characteristics make RO3010 laminates excellent for circuit miniaturization.
2.RO3010 Key Features and Benefits
Dielectric constant of 10.2 +/- .30 at 10 GHz/23°C Dissipation factor of 0.0022 at 10 GHz/23°C Low Coefficient of Thermal Expansion (-55 to 288 °C): 13 ppm/°C (X), 11 ppm/°C (Y), 16 ppm/°C (Z) Td > 500°C Thermal Conductivity of 0.95 W/mK Moisture Absorption of 0.05% -40°C to +85°C operation
Material exhibits dimensional stability with expansion coefficient matched to copper Economical laminate pricing for volume manufacturing processes ISO 9001 Certified Suitable for use with multi-layer board designs Excellent for circuit miniaturization due to high dielectric constant Stable electrical performance across wide frequency range
3.RO3010 Data Sheet Summary
| Specification | Value |
|---|
| Base Material | RO3010 |
| Layer Count | Double sided |
| Board Dimensions | 89.65mm × 94.3mm |
| Minimum Trace/Space | 5/6 mils |
| Minimum Hole Size | 0.25mm |
| Blind Vias | No |
| Finished Board Thickness | 1.3mm |
| Finished Cu Weight (Outer Layers) | 1 oz (1.4 mils) |
| Via Plating Thickness | 20 μm |
| Surface Finish | EPIG (Nickel-free) |
| Top Silkscreen | Black |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% prior to shipment |
4.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1 – 35 μm
Rogers RO3010 Substrate – 1.27 mm (50mil)
Copper layer 2 – 35 μm
5.PCB Statistics
Components: 21
Total Pads: 45
Thru Hole Pads: 31
Top SMT Pads: 14
Bottom SMT Pads: 0
Vias: 29
Nets: 2
6.Primary Application Areas
Automotive radar applications
Global positioning satellite antennas
Cellular telecommunications systems – power amplifiers and antennas
Patch antenna for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
7. Quality Assurance
Artwork supplied: Gerber RS-274-X
Accepted standard: IPC-Class-2
Availability: Worldwide
8.RO3010™ High Frequency Laminate – Product Introduction
RO3010™ laminates are ceramic-filled PTFE composites designed for commercial microwave and RF applications. RO3010 laminates offer a dielectric constant of 10.2 and are an ideal solution for circuit miniaturization at a very competitive price.
RO3010 laminates have excellent mechanical properties and consistent electrical properties. This consistency greatly simplifies the design of wide bandwidth components and allows the material to be used across a broad range of frequencies. The properties of this material make it an ideal choice for circuit miniaturization.
9.Key Features
| Feature | Value |
|---|
| Dielectric Constant (Dk) | 10.2 ± 0.30 |
| Dissipation Factor (Df) | 0.0022 @ 10 GHz |
| CTE - X axis | 13 ppm/°C |
| CTE - Y axis | 11 ppm/°C |
| CTE - Z axis | 16 ppm/°C |
10.Benefits
Excellent dimensional stability, coefficient of thermal expansion matched to copper ISO 9001 certified Suitable for multi-layer board designs, can be used in hybrid constructions with different dielectric constants Low dielectric loss, can be used in applications up to 77 GHz
11.RO3010™ Data Sheet
| Property | Typical Value | Direction | Units | Conditions | Test Method |
|---|
| Dielectric Constant (process) | 10.2 ± 0.30 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 |
| Dissipation Factor (process) | 0.0022 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of Dielectric Constant | -3 | - | ppm/°C | -50 to 150°C | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 10⁸ | - | Mohm·cm | - | ASTM D257 |
| Surface Resistivity | 10⁷ | - | Mohm | - | ASTM D257 |
| Electrical Strength | 250 | Z | V/mil | - | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 1850 | X,Y | kpsi | - | ASTM D638 |
| Flexural Strength | 16000 | X,Y | psi | - | IPC-TM-650 2.4.4 |
| Coefficient of Thermal Expansion - x | 13 | X | ppm/°C | -55 to 288°C | IPC-TM-650 2.4.41 |
| Coefficient of Thermal Expansion - y | 11 | Y | ppm/°C | -55 to 288°C | IPC-TM-650 2.4.41 |
| Coefficient of Thermal Expansion - z | 16 | Z | ppm/°C | -55 to 288°C | IPC-TM-650 2.4.41 |
| Thermal Conductivity | 0.50 | Z | W/m/K | 80°C | ASTM C518 |
| Decomposition Temperature (Td) | 500 | - | °C TGA | - | ASTM D3850 |
| Density | 2.0 | - | g/cm³ | - | ASTM D792 |
| Moisture Absorption | 0.04 | - | % | D/24/23 | ASTM D570 |
| Copper Peel Strength | 6.0 (1.05) | - | lb/in (N/mm) | after solder float | IPC-TM-650 2.4.8 |
| Lead-Free Process Compatible | Yes | - | - | - | - |
12.Standard Thicknesses, Panel Sizes & Claddings
Standard Thicknesses (±10%)
| Thickness (inch) | Thickness (mm) |
|---|
| 0.005" | 0.127 mm | | 0.010" | 0.254 mm |
| 0.015" | 0.381 mm | | 0.020" | 0.508 mm |
| 0.030" | 0.762 mm | | 0.060" | 1.524 mm |
Standard Panel Sizes
10" × 10" (254 mm × 254 mm) 10" × 20" (254 mm × 508 mm) 18" × 12" (457 mm × 305 mm) 18" × 24" (457 mm × 610 mm)
Standard Copper Claddings
13.Typical Applications
Automotive radar (77 GHz) Patch antennas GPS antennas Cellular base station antennas Power amplifiers RF identification (RFID) tags Satellite communications systems
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