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Wangling F4BME217 2-Layer Bare Copper PCB
PCB Material:Wangling F4BME217 (PTFE + Woven Fiberglass) / 1.3mm
MOQ:1PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-10 working days
Payment Method:T/T, Paypal
 

Wangling F4BME217 2-Layer 1.3mm Bare Copper PCB – Microwave & RF Applications


1. Introduction to Wangling F4BME217 PCB

Wangling's F4BME217 is a high-performance PTFE composite laminate engineered for demanding RF and microwave applications. Precision-formulated from woven fiberglass cloth, PTFE resin, and film, it delivers superior, consistent electrical properties.


This next-generation material significantly outperforms its predecessor, F4B220, offering lower dielectric loss, higher insulation resistance, and enhanced stability. It serves as a reliable, high-performance domestic substitute for comparable imported laminates.


F4BME217 is clad with Reverse-Treated Foil (RTF) copper. This configuration provides superior low-PIM performance, enables more precise etching for fine-line circuits, and reduces conductor loss, making it ideal for high-precision designs.


This 2-layer rigid PCB is constructed entirely with Wangling F4BME217 as the core material, making it ideal for demanding microwave, RF, radar, and satellite communication applications.


F4BME217 PCB 1mm thick 2L bare copper


2. Key Features of Wangling F4BME217 PCB

Dielectric constant of 2.17 at 10 GHz (Dk range 2.17 to 3.0 available, customizable)

Low dissipation factor of 0.001 at 10 GHz and 0.0014 at 20 GHz

Low PIM value of ≤ -159 dBc (F4BME with RTF copper)

High electrical strength of >23 KV/mm (Z direction)

Low moisture absorption of ≤0.08%

Flammability rating: UL 94 V-0

Anti-radiation and low outgassing properties

Wide operating temperature range: -55°C to +260°C


3. Benefits of Wangling F4BME217 PCB

Low dielectric loss for high-frequency performance

High insulation resistance and enhanced stability

Superior low-PIM performance with RTF copper

More precise etching for fine-line circuits

Reduced conductor loss

Excellent dimensional stability

Low thermal expansion coefficient and reduced temperature drift

Cost-effective domestic substitute for imported laminates


4.Wangling F4BME217 PCB Construction Details

ItemSpecification
Base materialWangling F4BME217 (PTFE + woven fiberglass)
Copper foil typeReverse-Treated Foil (RTF)
Layer countDouble sided
Board dimensions102mm x 83mm = 1 PCS, +/- 0.15mm
Minimum Trace/Space5/6 mils
Minimum Hole Size0.25mm
Blind viasNo
Finished board thickness1.3mm
Finished Cu weight1 oz (1.4 mils) outer layers
Via plating thickness20 μm
Surface finishBare copper
Top SilkscreenNo
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo
100% Electrical testUsed prior to shipment

5. PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 - 35 μm (1 oz)

F4BME217 Core - 1.0 mm (39.37 mil)

Copper_layer_2 - 35 μm (1 oz)


6. PCB Statistics

Components: 15

Total Pads: 42

Thru Hole Pads: 17

Top SMT Pads: 25

Bottom SMT Pads: 0

Vias: 28

Nets: 7


7. Primary Application Areas

Microwave, RF, and radar

Phase shifters and passive components

Power dividers, couplers, and combiners

Feed networks and phased array antennas

Satellite communication and base station antennas


8.Quality Assurance

Type of artwork supplied: Gerber RS-274-X

Accepted standard: IPC-Class-3

Availability: Worldwide


9. Wangling F4BME217 Low-Loss PTFE Composite – Product Introduction

F4BME217 is a high-performance PTFE composite laminate engineered for demanding RF and microwave applications. Precision-formulated from woven fiberglass cloth, PTFE resin, and film, it delivers superior, consistent electrical properties. This next-generation material significantly outperforms its predecessor, F4B220, offering lower dielectric loss, higher insulation resistance, and enhanced stability. It serves as a reliable, high-performance domestic substitute for comparable imported laminates.

The electrical and mechanical properties of F4BME217 are precisely tuned by adjusting the ratio of PTFE to fiberglass cloth within the composite. This allows for controlled dielectric constants while maintaining low loss characteristics and enhanced dimensional stability. A higher dielectric constant is achieved by increasing the fiberglass content, which improves dimensional stability, lowers the thermal expansion coefficient, and reduces temperature drift. This adjustment involves a balanced trade-off, as a higher fiberglass ratio may result in a marginal increase in dielectric loss.

F4BME217 is clad with Reverse-Treated Foil (RTF) copper. This configuration provides superior low-PIM performance, enables more precise etching for fine-line circuits, and reduces conductor loss, making it ideal for high-precision designs.



CCL (3) F4BME217


10. Features and Benefits Summary

FeatureBenefit
Dk 2.17 at 10 GHz (range 2.17-3.0, customizable)Flexible design options for various RF applications
Low dissipation factor (0.001 at 10 GHz, 0.0014 at 20 GHz)Low dielectric loss for high-frequency performance
RTF copper foil (F4BME)Superior low-PIM performance (≤ -159 dBc)
RTF copper foil (F4BME)More precise etching for fine-line circuits
RTF copper foil (F4BME)Reduced conductor loss
High fiberglass content optionImproved dimensional stability
High fiberglass content optionLower CTE and reduced temperature drift
Anti-radiation and low outgassingSuitable for aerospace and satellite applications
UL 94 V-0 flammability ratingSafe for commercial applications
Cost-effective domestic substituteReliable alternative to imported laminates

11. Wangling F4BME217 Data Sheet

PropertyTest ConditionUnitF4BME217 Typical Value
Dielectric Constant (typical)10 GHz-2.17
Dielectric Constant Tolerance--±0.04
Dissipation Factor (typical)10 GHz-0.001
Dissipation Factor (typical)20 GHz-0.0014
Temperature Coefficient of Dk-55°C to 150°Cppm/°C-150
Peel Strength (1 oz F4BME)-N/mm>1.6
Volume ResistivityNormal stateMΩ·cm≥6 × 10⁶
Surface ResistivityNormal state≥1 × 10⁶
Electrical Strength (Z direction)5KV, 500V/sKV/mm>23
Breakdown Voltage (XY direction)5KV, 500V/sKV>30
CTE (XY direction)-55°C to 288°Cppm/°C25-34
CTE (Z direction)-55°C to 288°Cppm/°C240
Thermal Stress260°C, 10s, 3 cycles-No delamination
Moisture Absorption20±2°C, 24 hours%≤0.08
DensityRoom temperatureg/cm³2.17
Operating Temperature Range-°C-55 to +260
Thermal Conductivity (Z direction)-W/(m·K)0.24
PIM Value (F4BME only)-dBc≤ -159
Flammability-UL-94V-0
Material Composition--PTFE + woven fiberglass
Copper Foil (F4BME)--Reverse-Treated Foil (RTF)

12. Some Typical Applications

Microwave, RF, and radar

Phase shifters and passive components

Power dividers, couplers, and combiners

Feed networks and phased array antennas

Satellite communication and base station antennas


13. Standard Thicknesses, Panel Sizes & Claddings

Standard Thicknesses (Dielectric thickness or total thickness with copper, customer must specify)

Thickness (mm)Tolerance (mm)Thickness (mm)Tolerance (mm)
0.1 (dielectric)±0.010.8±0.05
0.127 (dielectric)±0.011.0±0.05
0.2±0.021.5±0.06
0.25±0.021.524±0.06
0.5±0.041.575±0.06
0.508±0.042.0±0.08
0.762±0.052.5±0.08
3.0±0.096.0±0.12
4.0±0.108.0±0.15
5.0±0.1010.0±0.18
--12.0±0.20

Available Copper Foils

F4BME (RTF copper): 0.5 oz (0.018 mm), 1 oz (0.035 mm)

Standard Panel Sizes

460 x 610 mm

500 x 600 mm

850 x 1200 mm

914 x 1220 mm

1000 x 1200 mm

Custom Panel Sizes (contact factory)

300 x 250 mm, 350 x 380 mm, 500 x 500 mm, 840 x 840 mm, 1000 x 1500 mm

Note: For thickness ≥4.0mm or ≤0.2mm, panel size cannot exceed 500 x 610mm.

Metal-Backed Options (Aluminum or Copper Base)

Models: F4BME217-AL (aluminum base), F4BME217-CU (copper base)


 

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