High Speed Low Loss Muti-layer PCB Materials Megtron6 (M6) Arrive!
December 5, 2024
After the delivery of several groups of high-level (18L/16L/14L) back drilling PCB boards last month, we received customer’s higher requirement on this kind of circuit board this month. We’re requested to changes the interior space from the original 6mils to 5.8mils,5 groups back drilling to 8 groups for the 18-Layer board. With the sincere efforts of all our colleagues, we finally reached a perfect end before the holidays. Our technical personnel tracked the use at the customer’s side, and just we received the good news that the customer is very satisfied with this batch of PCB boards.
Just as Christmas often accompanies around the New Year, our good news is also coming with double pairs: M6 series materials have been stored this morning. At present, the first storage list has more than 10 types of specifications, core thickness varies from 0.05mm to 0.25mm, copper thickness from H/H oz,1/1oz and 2 / 2oz. We not only fully prepared materials, but also specially set up a special team to provide high quality full service, from the early data processing (we can assist customer’s design engineers to find the best design scheme, reduce EQ to shorten the sampling cycle), the middle manufacturing process to the later use in application etc. Welcome to contact us if you have any inquiries.
Typical Value (R5775G)
Property |
Units |
Test Method |
Condition |
Typical Value |
||
THERMAL |
Glass Transition Temp ( Tg ) |
℃ |
DSC |
As received |
185 |
|
DMA |
As received |
210 |
||||
Thermal Decomposition Temp |
℃ |
TGA |
As received |
410 |
||
Time to Delam (T288) |
Without Cu |
Min |
IPC TM-650 2.4.24.1 |
As received |
> 120 |
|
With Cu |
Min |
IPC TM-650 2.4.24.1 |
As received |
> 120 |
||
CTE : α1 |
X - axis ppm / C |
ppm / C |
IPC TM-650 2.4.24 |
< Tg |
14 - 16 |
|
Y - axis ppm / C |
ppm / C |
IPC TM-650 2.4.24 |
< Tg |
14 - 16 |
||
Z - axis ppm / C |
ppm / C |
IPC TM-650 2.4.24 |
< Tg |
45 |
||
CTE : α2 |
Z - axis ppm / C |
ppm / C |
IPC TM-650 2.4.24 |
> Tg 260 |
260 |
|
ELECTRICAL |
Volume Resistivity |
MΩ - cm |
IPC TM-650 2.5.17.1 |
C-96/35/90 |
1 x 109 |
|
Surface Resistivity |
MΩ |
IPC TM-650 2.5.17.1 |
C-96/35/90 |
1 x 108 |
||
Dielectric Constant ( Dk ) |
@ 1GHz |
/ |
IPC TM-650 2.5.5.9 |
C-24/23/50 |
3.71 |
|
@ 10GHz |
/ |
IPC TM-650 2.5.5.5 |
C-24/23/50 |
3.61 |
||
Dissipation Factor ( Df ) |
@ 1GHz |
/ |
IPC TM-650 2.5.5.9 |
C-24/23/50 |
0.002 |
|
@ 10GHz |
/ |
IPC TM-650 2.5.5.5 |
C-24/23/50 |
0.004 |
||
PHYSICAL |
Water Absorption |
% |
IPC TM-650 2.6.2.1 |
D-24/23 |
0.14 |
|
Peel Strength |
1oz ( H-VLP ) |
kN / m |
IPC TM-650 2.4.8 |
As Received 0.8 |
0.8 |
|
Flammability |
/ |
UL |
C-48/23/50 |
94V-0 |
||
Stock Material List
Megtron6 (M6) Material List |
|||||
Item |
Thickness (mil) |
Thickness(mm) |
Structure |
Copper weight(oz) |
Type of copper |
R5775G |
2.0 |
0.050 |
1035*1 |
H/H |
HVLP |
R5775G |
2.6 |
0.065 |
1080*1 |
H/H |
HVLP |
R5775G |
3.0 |
0.075 |
1078*1 |
1.0/1.0 |
RTF |
R5775G |
3.0 |
0.075 |
1078*1 |
H/H |
RTF |
R5775G |
3.0 |
0.075 |
1078*1 |
1.0/1.0 |
HVLP |
R5775G |
3.0 |
0.075 |
1078*1 |
H/H |
HVLP |
R5775G |
3.9 |
0.100 |
3313*1 |
H/H |
RTF |
R5775G |
3.9 |
0.100 |
3313*1 |
1.0/1.0 |
RTF |
R5775G |
5.9 |
0.150 |
1080*2 |
2.0/2.0 |
RTF |
R5775G |
9.8 |
0.250 |
2116*2 |
H/H |
RTF |