News

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High Speed Low Loss Muti-layer PCB Materials Megtron6 (M6) Arrive!
December 5, 2024
TAGS: High Speed PCB, Low-loss Muti-layer,Materials Megtron6
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News that NVIDIA RTX 5090 graphics card adopts 14-layer PCB
December 31, 2024
TAGS: NVIDIA, RTX 5090, RTX 5070
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Happy New Year
January 1, 2025
TAGS: New Year, 2025
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Foxconn Reports Record Q4 Revenue of 64.72 billion US dollars, Setting a New Historical High
January 6, 2025
TAGS: Foxconn, Q4 Revenue, New Historical High
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2024 Zhuhai Top 100 Enterprises Report: Growth and Recognition in Key Industries
January 8, 2025
TAGS: Zhuhai Enterprises, Top 100, PCB Industries
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Holiday Closure Notice
January 12, 2025
TAGS: Holidays, 2025, New Year
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NVIDIA Reveals the Evolution Behind DLSS: Six Years of Non-Stop Work by a Supercomputer
January 21, 2025
TAGS: NVIDIA, 2025, Supercomputer
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Global Semiconductor Market Sales Exceed $600 Billion in 2024 Electronic Engineering Magazine
February 11, 2025
TAGS: Global Semiconductor Market Sales ,2024, Electronic Engineering Magazine
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DIY Lantern for the New Year: A PCB Project for 50 Yuan
February 14, 2025
TAGS: DIY Lantern ,New Year, A PCB Project
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Thin PCBs: Challenges of BGA Packaging
February 17, 2025
TAGS: Thin PCB ,BGA Packaging, The standard PCB thickness: 0.063 (1.57 mm)
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Detailed Explanation of Recommended Sizes, Adjustment Principles, and Methods for PCB Silkscreen Markings
March 6, 2025
TAGS: PCB,Silkscreen Markings,Component Assembly,Adjustment Principles,Recommended Sizes,Altium Designer,Solder Mask
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Summary of Differences Between PCB Aluminum and Copper Substrates
March 10, 2025
TAGS: PCB,Aluminum Substrate,Copper Substrate,Thermal Conductivity,Electrical Conductivity,Resistance,Weight Differences,Production Process
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Differences Between PCB Plated Holes and Via Holes
March 13, 2025
TAGS: PCB,PCB Plated Holes ,Via Holes,Electrical Connections, High-power Applications.
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Methods for Testing PCB Circuit Boards: Look, Listen, Smell, Touch
April 10, 2025
TAGS: PCB Testing, Safety Precautions, Integrated Circuits, Soldering Quality, Voltage Measurement, Debugging Methods, Fault Identification, Component Installation, Signal Injection, Heat Management
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PCB Stacking Structure & Four Key Parameters of Materials
April 20, 2025
TAGS: PCB Stacking Structure, Prepreg (PP), Dielectric Constant (Dk), Glass Transition Temperature (Tg), Dissipation Factor (Df), Core Substrate, FR4 Material, Signal Layers, Copper Foil, Impedance Calculation
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