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Rogers AD250C 4-Layer Hybrid PCB
PCB Material:Rogers AD250C + FR-4 Hybrid / 1.8mm
MOQ:1PCS
Price:4.99-159 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-11 working days
Payment Method:T/T, Paypal
 

Rogers AD250C 4-Layer 60mil Hybrid PCB with Immersion Tin


1.Introduction of Core

Rogers' AD250C antenna laminates are high-performance, specialty materials designed specifically to meet the needs of today's wireless antenna markets.


These laminates are made from glass-reinforced, PTFE-based materials that offer a controlled dielectric constant, low loss performance, and excellent passive intermodulation (PIM) characteristics. The woven glass reinforcement enhances circuit processability, enabling efficient circuit board production with high yields.


AD250C antenna materials come with options for standard electrodeposited (ED) or reverse treated ED copper foil, allowing for choices that help minimize circuit losses and improve antenna PIM.


2.Key Features

Dielectric Constant of DK 2.5 +/-0.04 at 10GHz
Dissipation Factor of 0.0013 at 10GHz
Thermal Conductivity 0.33 W/m/°K
X axis CTE of 47 ppm/°C, Y CTE of 29 ppm/°C, Z CTE of 196 ppm/°C
High Tg value of >280 °C
Low water absorption of 0.04%
UL 94 V-0 rated


3.Benefits

Low loss tangent (<0.002 at 10 GHz) for excellent circuit performance in all typical wireless frequency bands
Controlled dielectric constant (±0.05) for repeatable circuit performance
Very low PIM (-159 dBc at 30 mil, 1900 MHz) for excellent antenna performance and reduced yield loss due to PIM related issues
Excellent dimensional stability for repeatable circuit performance and improved manufacturing yields
Glass-reinforced PTFE construction for enhanced processability
Hybrid construction with FR-4 for cost-effective multilayer designs


Rogers AD250C Hybrid PCB


4.PCB Construction Details

Specification Value
Base MaterialAD250C + TG170 FR-4
Layer Count4-layer
Board Dimensions79.6mm × 103.4mm (±0.15mm)
Minimum Trace/Space7/5 mils
Minimum Hole Size0.4mm
Blind/Buried ViasNo
Finished Board Thickness1.8mm
Finished Cu Weight1oz each layer
Via Plating Thickness20 μm
Surface FinishImmersion Tin
Top SilkscreenWhite
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo
Electrical Test100% prior to shipment

5.PCB Stackup (4-Layer Rigid Structure)

4-layer rigid PCB
Copper layer 1 – 35 μm
AD250C substrate – 1.524 mm (60mil)
Copper layer 2 – 35 μm
FR-4 Prepreg – 0.2mm
Copper layer 3 – 35 μm
TG170 FR-4 Core – 0.102 mm (4mil)
Copper layer 4 – 35 μm


6.PCB Statistics:

Components: 29
Total Pads: 72
Thru Hole Pads: 41
Top SMT Pads: 31
Bottom SMT Pads: 0
Vias: 82
Nets: 2


7.Typical Applications

Cellular infrastructure base station antenna
Automotive telematics antenna systems
Commercial satellite radio antenna


8.Quality Assurance

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide


 

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