Home > Newly Shipped PCB > Rogers AD300D 2-Layer 40mil Low-Loss PTFE PCB with EPIG Nickel-Free Finish

Rogers AD300D 2-Layer PCB
PCB Material:Rogers AD300D / 40mil (1.016mm)
MOQ:1PCS
Price:2.99-119 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:6-10 working days
Payment Method:T/T, Paypal
 

Rogers AD300D 2-Layer 40mil Low-Loss PTFE PCB with EPIG Nickel-Free Finish


1.Introduction of Core

AD300D laminates are ceramic-filled, glass-reinforced PTFE-based materials designed to offer a controlled dielectric constant, low loss performance, and excellent passive intermodulation (PIM) performance. They are specifically engineered and manufactured to meet the demands of today's wireless antenna markets. This PTFE resin based material is compatible with standard PTFE fabrication and provides a cost-effective construction to improve electrical and mechanical performance.


2.Key Features

Dielectric Constant of DK 2.94 at 10GHz/23°C
Dissipation Factor of 0.0021 at 10GHz/23°C
Coefficient of Thermal Expansion: 24 ppm/°C (X-axis), 23 ppm/°C (Y-axis), and 98 ppm/°C (Z-axis) within -55 to 288°C
Thermal coefficient of dielectric constant: -73 ppm/°C
UL 94 V-0 flame retardant rating


3.Benefits

Low loss tangent (<0.002 at 10 GHz) for excellent circuit performance in all typical wireless frequency bands
Controlled dielectric constant (±0.05) for repeatable circuit performance
Very low PIM (-159 dBc at 30 mil, 1900 MHz) for excellent antenna performance and reduced yield loss due to PIM related issues
Excellent dimensional stability for repeatable circuit performance and improved manufacturing yields
Compatible with standard PTFE fabrication processes
Cost-effective construction with enhanced electrical and mechanical performance


Rogers AD300D PCB


4.PCB Construction Details

Specification Value
Base MaterialAD300D
Layer CountDouble sided
Board Dimensions67mm × 102.6mm (±0.15mm)
Minimum Trace/Space4/6 mils
Minimum Hole Size0.4mm
Blind ViasNo
Finished Board Thickness1.2mm
Finished Cu Weight (Outer Layers)1oz (1.4 mils)
Via Plating Thickness20 μm
Surface FinishEPIG (Nickel-free)
Top SilkscreenNo
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo
Electrical Test100% prior to shipment

5.PCB Stackup (2-Layer Rigid Structure)

Copper layer 1 – 35 μm
AD300D Core – 1.016 mm (40mil)
Copper layer 2 – 35 μm


6.PCB Statistics:

Components: 15
Total Pads: 41
Thru Hole Pads: 29
Top SMT Pads: 12
Bottom SMT Pads: 0
Vias: 36
Nets: 2


7.Typical Applications

Cellular infrastructure base station antenna
Automotive telematics antenna systems
Commercial satellite radio antenna


8.Quality Assurance

Artwork supplied: Gerber RS-274-X
Accepted standard: IPC-Class-2
Availability: Worldwide


 

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