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Rogers RT/duroid 5880 2-Layer 0.85mm Immersion Gold PCB – Millimeter Wave & Radar Applications
1. Introduction to Rogers RT/duroid 5880 PCB
RT/duroid 5880 glass microfiber reinforced PTFE composites are designed for exacting stripline and microstrip circuit applications. The randomly oriented microfibers result in exceptional dielectric constant uniformity. The dielectric constant of RT/duroid 5880 laminates is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5880 laminates to Ku-band and above.
RT/duroid 5880 laminates are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes. This 2-layer rigid PCB is constructed entirely with RT/duroid 5880 as the core material, making it ideal for demanding millimeter wave, military radar, and missile guidance applications.
2. Key Features of Rogers RT/duroid 5880 PCB
Lowest electrical loss for reinforced PTFE material Dielectric Constant (Dk): 2.20 ± 0.02 at 10 GHz Dissipation Factor: 0.0004 to 0.0009 at 10 GHz Low moisture absorption: 0.02% Isotropic — uniform electrical properties in all directions Uniform electrical properties over frequency Excellent chemical resistance Flammability Rating: UL 94V-0 Lead-Free Process Compatibility
3. Benefits of Rogers RT/duroid 5880 PCB
Lowest electrical loss among reinforced PTFE materials — ideal for high-frequency and millimeter wave designs Exceptional Dk uniformity from panel to panel — consistent impedance control Stable electrical properties over wide frequency range — reliable performance from RF to Ku-band and above Low moisture absorption (0.02%) — stable performance in humid environments Isotropic material properties — predictable performance regardless of orientation Excellent chemical resistance — compatible with standard PCB fabrication processes Easy to machine and shape — cost-effective fabrication Lead-free process compatible — meets modern manufacturing standards
4. PCB Construction Details
| Item | Specification |
|---|
| Base material | Rogers RT/duroid 5880 (glass microfiber reinforced PTFE) |
| Layer count | 2-layer |
| Board dimensions | 102mm x 65mm = 1 PCS, ±0.15mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.35mm |
| Blind vias | No |
| Finished board thickness | 0.85mm (31 mil core) |
| Finished Cu weight | 1 oz (35 μm / 1.4 mils) all layers |
| Via plating thickness | 20 μm |
| Surface finish | Immersion Gold |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| 100% Electrical test | Used prior to shipment |
5. PCB Stackup (2-Layer Rigid Structure)
| Layer | Material | Thickness |
|---|
| Copper_layer_1 (Top) | Copper | 35 μm (1 oz) |
| Dielectric | RT/duroid 5880 | 0.787 mm (31 mil) |
| Copper_layer_2 (Bottom) | Copper | 35 μm (1 oz) |
6. PCB Statistics
| Parameter | Value |
|---|
| Components | 46 |
| Total Pads | 53 |
| Thru Hole Pads | 28 |
| Top SMT Pads | 25 |
| Bottom SMT Pads | 0 |
| Vias | 29 |
| Nets | 2 |
7. Rogers RT/duroid 5880 Material – Product Introduction
RT/duroid® 5880 glass microfiber reinforced PTFE composites are designed for exacting stripline and microstrip circuit applications. The randomly oriented microfibers result in exceptional dielectric constant uniformity. The dielectric constant of RT/duroid 5880 laminates is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5880 laminates to Ku-band and above.
RT/duroid 5880 laminates are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes. Normally supplied as a laminate with electrodeposited copper of ½ to 2 ounces/ft² on both sides, RT/duroid 5880 composites can also be clad with rolled copper foil for more critical electrical applications.
8. Features and Benefits Summary
| Feature | Benefit |
|---|
| Lowest electrical loss for reinforced PTFE | Extends usefulness to Ku-band and above |
| Dk 2.20 ± 0.02 @ 10 GHz | Exceptional uniformity and tight tolerance for consistent impedance |
| Df 0.0004-0.0009 @ 10 GHz | Ultra-low loss for high-frequency and millimeter wave designs |
| Low moisture absorption (0.02%) | Stable performance in humid environments |
| Isotropic material | Uniform electrical properties regardless of orientation |
| Uniform electrical properties over frequency | Reliable performance across wide frequency range |
| Excellent chemical resistance | Compatible with standard fabrication processes |
| UL 94V-0 compliant | RoHS compliant flame-retardant technology |
9. RT/duroid 5880 Typical Properties (Data Sheet)
| Property | Typical Value | Direction | Units | Condition | Test Method |
|---|
| Electrical Properties |
| Dielectric Constant, εr (Process) | 2.20 ± 0.02 | Z | — | 10 GHz/23°C | IPC-TM-650 2.5.5.5 |
| Dielectric Constant, εr (Design) | 2.20 | Z | — | 8 GHz-40 GHz | Differential Phase Length Method |
| Dissipation Factor, tan δ | 0.0004-0.0009 | Z | — | 10 GHz/23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of εr | -125 | Z | ppm/°C | -50°C to 150°C | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 2 × 10⁷ | Z | MΩ·cm | C96/35/90 | ASTM D257 |
| Surface Resistivity | 3 × 10⁷ | Z | MΩ | C96/35/90 | ASTM D257 |
| Thermal Properties |
| CTE (X-axis) | 31 | X | ppm/°C | 0-100°C | IPC-TM-650 2.4.41 |
| CTE (Y-axis) | 48 | Y | ppm/°C | 0-100°C | IPC-TM-650 2.4.41 |
| CTE (Z-axis) | 237 | Z | ppm/°C | 0-100°C | IPC-TM-650 2.4.41 |
| Thermal Conductivity | 0.20 | Z | W/(m·K) | 80°C | ASTM C518 |
| Decomposition Temp (Td) | 500 | — | °C TGA | — | ASTM D3850 |
| Specific Heat | 0.96 (0.23) | — | J/g/K (cal/g/°C) | — | Calculated |
| Mechanical & Physical Properties |
| Tensile Modulus (23°C/100°C) | 1070/450 (X), 860/380 (Y) | X,Y | MPa (kpsi) | A | ASTM D638 |
| Copper Peel Strength | 31.2 (5.5) | — | pli (N/mm) | after solder float, 1 oz EDC foil | IPC-TM-650 2.4.8 |
| Moisture Absorption | 0.02 | — | % | 0.062" (1.6mm), D48/50 | ASTM D570 |
| Density | 2.2 | — | gm/cm³ | — | ASTM D792 |
| Flammability | V-0 | — | — | — | UL 94 |
| Lead-Free Process Compatible | Yes | — | — | — | — |
10. Primary Application Areas
Commercial Airline Broadband Antennas Microstrip and Stripline Circuits Millimeter Wave Applications Military Radar Systems Missile Guidance Systems Point to Point Digital Radio Antennas Satellite Communication Systems
11. Quality Assurance
Type of artwork supplied: Gerber RS-274-X Accepted standard: IPC-Class-2 Availability: Worldwide 100% Electrical test prior to shipment
12. Standard Thicknesses, Panel Sizes & Claddings
| Parameter | Options |
|---|
| Standard Thicknesses | 0.005" (0.127mm), 0.010" (0.252mm), 0.020" (0.508mm), 0.031" (0.787mm), 0.062" (1.575mm) |
| Standard Panel Sizes | 18" x 12" (457 x 305mm), 18" x 24" (457 x 610mm), additional sizes available |
| Standard Claddings | EDC: ½ oz (18μm) HH/HH, 1 oz (35μm) H1/H1; Rolled Copper: ½ oz (18μm) 5R/5R, 1 oz (35μm) 1R/1R; Heavy metal and unclad available |
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