Rogers TMM10 2-Layer 15mil High-Dk Thermoset PCB with EPIG Nickel-Free Finish
1.Introduction
Rogers TMM 10 thermoset microwave materials offer the benefits of both PTFE and ceramic based substrates, but is not limited by the same mechanical properties and production techniques.
2.Key Features
Dielectric Constant (Dk) of 9.20 +/- .230
Dissipation factor of .0022 at 10GHz
Thermal coefficient of Dk of -38 ppm/°K
Coefficient of thermal expansion matched to copper
Decomposition Temperature (Td) of 425 °C TGA
Coefficient of Thermal Expansion - x y z : 21ppm/K, 21ppm/K, 20ppm/K
Thermal Conductivity of 0.76W/mk
Available in a thickness range of .0015 to .500 inches +/- .0015”
3.Benefits
Mechanical properties resist creep and cold flow
Resistant to process chemicals, reducing damage during fabrication
Material does not require a sodium napthanate treatment prior to electroless plating
Based on a thermoset resin, allowing for reliable wire-bonding
4.PCB Details
| Specification |
Value |
| Base Material | TMM10 |
| Layer Count | Double sided |
| Board Dimensions | 85mm × 120mm (±0.15mm) |
| Minimum Trace/Space | 5/7 mils |
| Minimum Hole Size | 0.4mm |
| Blind Vias | No |
| Finished Board Thickness | 0.5mm |
| Finished Cu Weight (Outer Layers) | 1oz (1.4 mils) |
| Via Plating Thickness | 20 μm |
| Surface Finish | EPIG (Electroless Palladium Immersion Gold, Nickel-free) |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | No |
| Electrical Test | 100% prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1 – 35 μm
Rogers TMM10 Core – 0.381 mm (15mil)
Copper layer 2 – 35 μm
6.PCB Statistics
Components: 25
Total Pads: 36
Thru Hole Pads: 12
Top SMT Pads: 24
Bottom SMT Pads: 0
Vias: 25
Nets: 2
7.Typical Applications
Chip testers
Dielectric polarizers
Satellite communication systems
GPS antennas, and patch antennas
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
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