Rogers TMM6 2-Layer 15mil Ceramic Thermoset PCB with ENEPIG Surface Finish
1.Introduction
Rogers TMM 6 thermoset microwave material is a ceramic thermoset polymer composite designed for high plated thru-hole reliability strip-line and micro-strip applications.
TMM 6 laminates offer a combination of the benefits of both ceramic and traditional PTFE microwave circuit laminates without requiring the specialized production techniques common to those materials, all at a unique dielectric constant (Dk) compared to other materials in the product family.
2.Key Features
Dielectric constant (Dk) of 6.0 +/- .08 at 10GHz
Dissipation factor of .0023 at 10GHz
Thermal coefficient of Dk of -11 ppm/°K
Coefficient of thermal expansion matched to copper
Decomposition Temperature (Td) of 425 °C TGA
Coefficient of Thermal Expansion - x y z : 18 ppm/K, 18 ppm/K, 26 ppm/K
Thermal Conductivity of 0.72W/mk
Available in a thickness range of .0015 to .500 inches +/- .0015”
3.Benefits
Mechanical properties resist creep and cold flow
Resistant to process chemicals, reducing damage during fabrication
Based on a thermoset resin, allowing for reliable wire-bonding
All common PCB processes can be used with TMM 6 materials
4.PCB Details
| Specification |
Value |
| Base Material | TMM6 |
| Layer Count | 2 layers |
| Board Dimensions | 60mm × 96mm (±0.15mm) |
| Minimum Trace/Space | 5/7 mils |
| Minimum Hole Size | 0.4mm |
| Blind Vias | No |
| Finished Board Thickness | 0.5mm |
| Finished Cu Weight (Outer Layers) | 1oz (1.4 mils) |
| Via Plating Thickness | 20 μm |
| Surface Finish | ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1 – 35 μm
Rogers TMM6 Core – 0.381 mm (15mil)
Copper layer 2 – 35 μm
6.PCB Statistics
Components: 20
Total Pads: 26
Thru Hole Pads: 9
Top SMT Pads: 17
Bottom SMT Pads: 0
Vias: 16
Nets: 2
7.Typical Applications
RF and microwave circuitry
Power amplifiers and combiners
Filters and couplers
Satellite communication systems
Global Positioning Systems Antennas
Patch Antennas
Dielectric polarizers and lenses
Chip testers
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
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