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TLX-8 0.8mm Double-Sided PCB with ENIG Finish for RF and Microwave Applications
1.Introduction to Core Technologies
TLX-8 is a high-volume, fiberglass-reinforced microwave substrate manufactured by AGC Inc., specifically designed for reliable performance in a wide range of RF and microwave applications. This material is a woven fiberglass-reinforced PTFE composite that offers an excellent balance of electrical performance, mechanical strength, and environmental durability.
The material is available with a dielectric constant range of 2.45 - 2.65, allowing designers flexibility in circuit optimization. TLX-8 is particularly suitable for low-layer-count microwave designs where mechanical reinforcement is required to withstand severe environmental conditions.
2.Key Performance Characteristics:
PIM < -160 dBc for clean signal transmission
Dk 2.55 ± 0.04 at 10 GHz, ±2% variation from -55°C to 125°C
Df 0.0018 at 10 GHz for minimal signal loss
Dimensional stability: MD 0.06 mm/M, CD 0.08 mm/M after bake
Moisture absorption: 0.02%
UL 94 V-0 flame retardant
Td 553°C at 5% weight loss
Outgassing: TML 0.03%, CVCM 0.00% (NASA low-outgassing)
Peel strength: 2.63 N/mm for 1oz ED copper
Young's Modulus: MD 6,757 N/mm², CD 8,274 N/mm²
3.Benefits
Dk range 2.45-2.65 enables flexible RF component design
Stable performance in humid, high-temperature, and harsh environments
Low loss and PIM ensure high signal integrity
High thermal and mechanical durability for long-term reliability
Tight tolerances enable precise impedance control and high yields
Withstands vibration, thermal cycling, and marine conditions
NASA-qualified for space applications
Suitable for radar, communications, test equipment, and military RF systems
4.TLX-8 Data Sheet Summary
| Property |
Conditions |
Typical Value |
Unit |
Test Method |
| Dielectric Constant | @ 10 GHz | 2.55 ± 0.04 | - | IPC-650 2.5.5.3 |
| Dissipation Factor | @ 10 GHz | 0.0018 | - | IPC-650 2.5.5.5.1 |
| Outgassing - TML | 4H 257°F @ ≤5x10⁻⁵ Torr | 0.03 | % | ASTM E 595 |
| Outgassing - CVCM | 4H 257°F @ ≤5x10⁻⁵ Torr | 0.00 | % | ASTM E 595 |
| Outgassing - WVR | 4H 257°F @ ≤5x10⁻⁵ Torr | 0.01 | % | ASTM E 595 |
| Surface Resistivity | Elevated Temp. | 6.605 x 10⁸ | Mohm | IPC-650 2.5.17.1 |
| Surface Resistivity | Humidity Cond. | 3.550 x 10⁶ | Mohm | IPC-650 2.5.17.1 |
| Volume Resistivity | Elevated Temp. | 1.110 x 10¹⁰ | Mohm/cm | IPC-650 2.5.17.1 |
| Volume Resistivity | Humidity Cond. | 1.046 x 10¹⁰ | Mohm/cm | IPC-650 2.5.17.1 |
| Dimensional Stability | MD After Bake | 0.06 | mm/M | IPC-650 2.4.39 |
| Dimensional Stability | CD After Bake | 0.08 | mm/M | IPC-650 2.4.39 |
| Dimensional Stability | MD Thermal Stress | 0.09 | mm/M | IPC-650 2.4.39 |
| Dimensional Stability | CD Thermal Stress | 0.10 | mm/M | IPC-650 2.4.39 |
| Thermal Conductivity | - | 0.19 | W/m·K | ASTM F433 |
| CTE (25-260°C) - X | - | 21 | ppm/°C | IPC-650 2.4.41 |
| CTE (25-260°C) - Y | - | 23 | ppm/°C | IPC-650 2.4.41 |
| CTE (25-260°C) - Z | - | 215 | ppm/°C | IPC-650 2.4.41 |
| Td (2% Weight Loss) | TGA | 535 | °C | IPC-650 2.4.24.6 |
| Td (5% Weight Loss) | TGA | 553 | °C | IPC-650 2.4.24.6 |
| Peel Strength | 1 oz ED, Thermal Stress | 2.63 (15) | N/mm (lbs/in) | IPC-650 2.4.8 |
| Peel Strength | 1 oz RTF | 2.98 (17) | N/mm² (kpsi) | IPC-650 2.4.8 |
| Peel Strength | ½ oz ED, Thermal Stress | 1.93 (11) | N/mm² (kpsi) | IPC-650 2.4.8.3 |
| Young's Modulus | MD | 6,757 (980) | N/mm² (psi) | ASTM D 902 |
| Young's Modulus | CD | 8,274 (1,200) | N/mm² (psi) | ASTM D 902 |
| Moisture Absorption | - | 0.02 | % | IPC-650 2.6.2.1 |
| Dielectric Breakdown | - | >45 | kV | IPC-650 2.5.6 |
| Flammability Rating | - | V-0 | - | UL-94 |
5.PCB Details
| Item |
Specification |
| Product Type | Double-Sided PCB |
| Material | AGC TLX-8 |
| Board Thickness | 30 mil (0.76mm nominal, specified as 0.8mm) |
| Copper Thickness | 1oz per layer (approx. 35μm) |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Solder Mask | None (both sides) |
| Silkscreen | None (both sides) |
| Dimensions | 40.5mm x 70.6mm = 1 PC |
6.PCB Stackup (2-Layer Rigid Structure)
Top Layer (L1): 1oz copper (35μm)
Substrate: TLX-8, 0.8mm thickness
Bottom Layer (L2): 1oz copper (35μm)
7.Typical Applications
TLX-8 material is specifically designed for low-layer-count microwave and RF applications, particularly in environments requiring mechanical reinforcement and environmental durability:
Antennas: Base station antennas, patch antennas, array antennas for communication systems
Passive RF Components: Mixers, splitters, filters, combiners, and couplers
Radar Systems: Automotive radar, marine radar, and airborne radar applications
Mobile Communications: 4G/5G base station components and infrastructure
Microwave Test Equipment: Test fixtures, couplers, and calibration standards
Space and Aerospace: Satellite communication systems, altimeter substrates, and low-outgassing critical applications
Defense and Military: Warship antenna systems, electronic warfare components, and ruggedized communication equipment
Automotive: Radar sensors for ADAS and autonomous driving systems
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
9.Conclusion
This double-sided TLX-8 PCB combines AGC's proven microwave substrate technology with a clean, solder-mask-free ENIG finish, providing an ideal platform for RF and microwave designs requiring excellent electrical performance, mechanical stability, and environmental durability in a compact 40.5mm x 70.6mm form factor.
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