Rogers TMM13i 2-Layer 15mil High-Dk Thermoset PCB with ENIG Finish

1.Introduction to Core Technologies

The Rogers TMM13i isotropic thermoset microwave material is a ceramic thermoset polymer composite tailored for high reliability in plated thru-hole strip-line and micro-strip applications. It features an isotropic dielectric constant (Dk) and integrates the advantageous properties of both ceramic and PTFE substrates, while allowing for the convenience of soft substrate processing methods.

2.Key Performance Characteristics:

Dielectric Constant Dk of 12.85 +/- .35
Dissipation factor of .0019 at 10GHz
Thermal coefficient of Dk of -70 ppm/°K
Copper matched Coefficient of Thermal Expansion (-55 to 288 °C): X axis 19 ppm/°C, Y axis 19 ppm/°C, Z direction 20ppm/°C
Lead free Process Compatible, 94V-0 flammability

3.Benefits

Mechanical properties resist creep and cold flow
Resistant to process chemicals, reducing damage during fabrication
Material does not require a sodium napthanate treatment prior to electroless plating
Based on a thermoset resin, allowing for reliable wire-bonding
Isotropic dielectric constant for consistent electrical performance in all directions
Combines benefits of ceramic and PTFE substrates with soft substrate processing convenience

4.PCB Details

5.PCB Stackup (2-Layer Rigid Structure)

Copper layer 1 – 35 μm
TMM13i Substrate – 0.381 mm (15mil)
Copper layer 2 – 35 μm

6.PCB Statistics

Components: 25
Total Pads: 63
Thru Hole Pads: 28
Top SMT Pads: 35
Bottom SMT Pads: 0
Vias: 43
Nets: 2

7.Typical Applications

Chip testers
Dielectric polarizers, lenses
Filters, couplers
RF and microwave circuitry
Satellite communication systems

8.Quality Assurance

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide