TSM-DS3 2-Layer 0.8mm PCB – Low-Loss Ceramic-Filled 30mil Core with Immersion Gold Finish

1. Introduction to TSM-DS3

TSM-DS3 is a ceramic-filled reinforced material with very low fiberglass content (~5%) that rivals epoxies in fabricating large-format complex multilayers. It is a thermally stable, industry-leading low-loss core (Df = 0.0011 at 10 GHz) that can be manufactured with the predictability and consistency of the best fiberglass-reinforced epoxies. TSM-DS3 was developed for high-power applications (TC = 0.65 W/m·K) where it is necessary for the dielectric material to conduct heat away from other heat sources in a PWB design. It also features very low coefficients of thermal expansion for demanding thermal cycling environments.

2. Key Features

Dielectric constant of 3.0 with tight tolerance ±0.05 at 10 GHz/23°C
Dissipation factor of 0.0014 at 10GHz
High thermal conductivity (unclad): 0.65 W/m·K
Low moisture absorption: 0.07%
Matched to copper CTE: X-axis 10 ppm/°C, Y-axis 16 ppm/°C, Z-axis 23 ppm/°C

3. Benefits

Low fiberglass content (~5%)
Dimensional stability rivals epoxy
Enables large-format, high-layer-count PCBs
Supports complex PCB builds with high yield, consistency, and predictability
Temperature-stable Dk (±0.25% from -30°C to 120°C)
Compatible with resistive foils

4. PCB Construction Details

5. PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 - 35 μm
TSM-DS3 - 0.762 mm (30 mil)
Copper_layer_2 - 35 μm

6. PCB Statistics:

Components: 42
Total Pads: 114
Thru Hole Pads: 78
Top SMT Pads: 36
Bottom SMT Pads: 0
Vias: 51
Nets: 2

7. Typical Applications

Couplers
Phased array antennas
Radar manifolds
mmWave antenna/automotive systems
Oil drilling equipment
Semiconductor/ATE testing

8. Quality Assurance

Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide