Home > RF PCB > Low DK High Frequency PCB > Rogers TMM3 High Frequency Printed Circuit Board 15mil 30mil 60mil DK3.27 RF PCB With Immersion Gold
Rogers TMM3 High Frequency PCB
Material:Rogers TMM3 (Ceramic/Hydrocarbon/Thermoset) / 15-60mil
MOQ:1PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-13 working days
Payment Method:T/T, Paypal

* PCBs are custom-made, picture & parameters for reference

Rogers TMM3 High Frequency Printed Circuit Board 15mil 30mil 60mil DK3.27 RF PCB With Immersion Gold


(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Description

Rogers' TMM3 high-frequency laminates are ceramic, hydrocarbon, thermoset polymer composites designed for high PTH reliability in stripline and microstrip applications. TMM3 has a dielectric constant of 3.27 and a dissipation factor of 0.002.


TMM3 features an exceptionally low thermal coefficient of dielectric constant. Its isotropic coefficients of thermal expansion closely match those of copper, resulting in the reliable production of plated-through holes and minimal etch shrinkage. Furthermore, the thermal conductivity of TMM3 is approximately twice that of traditional PTFE/ceramic laminates, facilitating effective heat removal.


Since TMM3 is based on thermoset resins, it does not soften when heated. This allows for wire bonding of component leads to circuit traces without concerns about pad lifting or substrate deformation.


TMM3 PCB


Typical Applications

1. Chip Testers
2. Dielectric Polarizers and Lenses
3. Filters and Couplers
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power Amplifiers and Combiners
7. RF and Microwave Circuitry
8. Satellite Communication Systems


Click to expand/collapse the table
PCB Capability (TMM3)
PCB Material:Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation:TMM3
Dielectric constant:3.27
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:1oz (35µm), 2oz (70µm)
PCB thickness:15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold, ENEPIG etc.

Why Choose Us?

1. ISO9001, ISO14001, IATF16949, ISO13485, UL Certified
2. More than 18 years of high-frequency PCB experience
3. Small quantity orders available; no MOQ required
4. A team driven by passion, discipline, responsibility, and honesty
5. On-time delivery: >98%; Customer complaint rate: <1%
6. 16,000㎡ workshop, 30,000㎡ output per month, and 8,000 types of PCBs monthly
7. Robust PCB capabilities to support your R&D, sales, and marketing efforts
8. IPC Class 2 / IPC Class 3


Typical Values of TMM3

Click to expand/collapse the table
PropertyTMM3UnitsConditionTest Method
Electrical Properties
Dielectric Constant, εr Process3.27±0.032-10 GHzIPC-TM-650 2.5.5.5
Dielectric Constant, εr Design3.45-8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor (process)0.002-10 GHzIPC-TM-650 2.5.5.5
Thermal Coefficient of εr+37ppm/°K-55°C-125°CIPC-TM-650 2.5.5.5
Volume Resistivity2 x 10⁹Mohm·cm-ASTM D257
Surface Resistivity>9 x 10⁹Mohm-ASTM D257
Electrical Strength441V/mil-IPC-TM-650 2.5.6.2
Thermal Properties
Td425°C TGA-ASTM D3850
CTE - x15ppm/K0 to 140°CASTM E831
CTE - y15ppm/K0 to 140°CASTM E831
CTE - z23ppm/K0 to 140°CASTM E831
Thermal Conductivity0.7W/m/K80°CASTM C518
Mechanical Properties
Copper Peel Strength5.7 (1.0)lb/in (N/mm)after solder float 1 oz. EDCIPC-TM-650 2.4.8
Flexural Strength16.53kpsiAASTM D790
Flexural Modulus1.72MpsiAASTM D790
Physical Properties
Moisture Absorption0.06 (1.27mm), 0.12 (3.18mm)%D/24/23ASTM D570
Specific Gravity1.78-AASTM D792
Lead-Free Process CompatibleYES---

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