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* PCBs are custom-made, picture & parameters for reference
TMM3 High Frequency PCB, 20mil 0.508mm Microwave PCB, DK3.27 with Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
we are excited to introduce our latest innovation in high-frequency PCB technology – the TMM3 High Frequency PCB, 20mil 0.508mm Microwave PCB with DK3.27 and Immersion Gold. Designed for demanding applications in RF and microwave circuitry, this double-layer PCB offers exceptional performance, reliability, and precision, making it an ideal choice for advanced electronic systems.
Why Choose TMM3 High Frequency PCB?
1. High-Frequency Performance: Built on a 20mil TMM3 substrate with a dielectric constant (DK) of 3.27, this PCB is optimized for high-frequency applications, ensuring minimal signal loss and superior performance.
2. Immersion Gold Surface Finish: The immersion gold surface finish provides excellent conductivity, corrosion resistance, and solderability, making it ideal for high-reliability applications.
3. IPC Class 3 Standards: Manufactured according to IPC Class 3 standards, this PCB meets the highest quality and reliability requirements.
4. Customizable Design: With a green solder mask on the top layer and an open bottom layer, this PCB is designed for flexibility and can be tailored to meet specific application needs.
5. Wide Range of Applications: From patch antennas to satellite communication systems, this PCB is versatile and suitable for a variety of high-frequency applications.
PCB Specifications
| PCB SIZE | 35 x 51mm = 1up |
|---|---|
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper - 17um(0.5 oz)+plate TOP layer |
| TMM3 0.508mm | |
| copper - 17um(0.5 oz)+plate BOT Layer | |
| Minimum Trace and Space: | 5 mil / 5 mil |
| Minimum / Maximum Holes: | 0.40 mm / 2.50 mm |
| Number of Drill Holes: | 3 |
| Surface Finish | Immersion gold, 99% |
| Solder Mask Color: | Green |
| Final height of PCB: | 0.68 mm ±0.1 |
| TEST | 100% Electrical Test prior shipment |
| SERVICE AREA | Worldwide, Globally |
Applications:
Our TMM3 High Frequency PCB is designed for a wide range of applications, including:
Patch Antennas
RF and Microwave Circuitry
Satellite Communication Systems
Global Positioning Systems (GPS) Antennas
Power Amplifiers and Combiners
Filters and Couplers
Dielectric Polarizers and Lenses
Chip Testers
Our PCB Capability (TMM3)
| PCB Capability (TMM3) | |
|---|---|
| PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
| Designation: | TMM3 |
| Dielectric constant: | 3.27 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz, 1oz, 2oz |
| PCB thickness: | 15mil,20mil,25mil,30mil,50mil,60mil,75mil,100mil,125mil,150mil,200mil,250mil,275mil,300mil,500mil |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc. |
Data Sheet of TMM3
| Property | TMM3 | Direction | Units | Condition | Test Method | |
|---|---|---|---|---|---|---|
| Dielectric Constant, ε Process | 3.27±0.032 | Z | -- | 10 GHz | IPC-TM-650 2.5.5.5 | |
| Dielectric Constant, ε Design | 3.45 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor (process) | 0.002 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +37 | - | ppm/K | -55°C-125°C | IPC-TM-650 2.5.5.5 | |
| Volume Resistivity | 2 x 10⁹ | - | Mohm.cm | - | ASTM D257 | |
| Surface Resistivity | 9 x 10⁹ | - | Mohm | - | ASTM D257 | |
| CTE - X | 15 | X | ppm/K | 0 to 140°C | ASTM E 831 | |
| CTE - Y | 15 | Y | ppm/K | 0 to 140°C | ASTM E 831 | |
| CTE - Z | 23 | Z | ppm/K | 0 to 140°C | ASTM E 831 | |
| Thermal Conductivity | 0.7 | Z | W/m/K | 80°C | ASTM C518 | |
| Moisture Absorption | 0.06-0.12 | - | % | D/24/23 | ASTM D570 | |
| Flammability | V-0 | - | - | - | UL 94 | |
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