RO4003C LoPro Circuit Board Rogers 32.7mil Reverse Treated Foil PCB for Cellular Base Station Antennas
(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)
Product Description
RO4003C LoPro laminates utilize proprietary Rogers technology, allowing reverse treated foil to bond effectively with standard RO4003C dielectric. This results in a laminate characterized by low conductor loss, enhancing insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4003C laminate system.
Features and Benefits
RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil, offering numerous advantages:
Lower Insertion Loss:Improves signal transmission efficiency.
Low Passive Intermodulation (PIM):Enhances overall performance in RF applications.
Increased Signal Integrity:Ensures clearer and more reliable signal transmission.
High Circuit Density:Supports complex circuit designs without compromising performance.
Thermal and Design Characteristics
Low Z-axis Coefficient of Thermal Expansion:
Enables multi-layer board capability and greater design flexibility.
Lead-Free Process Compatible:
Supports high-temperature processing and adheres to environmental regulations.
CAF Resistant:
Increases reliability in harsh environments.
Typical Applications
1.Digital applications such as servers, routers, and high-speed backplanes
2.Cellular base station antennas and power amplifiers
3.LNBs for direct broadcast satellites
4.RF Identification Tags
Typical Properties of RO4003C LoPro
RO4003C LoPro |
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Property |
Typical Value |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant, Process |
3.38 ± 0.05 |
z |
-- |
10 GHz/23°C |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant, Design |
3.5 |
z |
-- |
8 to 40 GHz |
Differential Phase Length Method |
Dissipation Factor tan, d |
0.0027 0.0021 |
z |
-- |
10 GHz/23°C 2.5 GHz/23°C |
IPC-TM-650 2.5.5.5 |
Thermal Coeffifi cient of er |
40 |
z |
ppm/°C |
-50°C to 150°C |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
1.7 X 1010 |
|
MΩ•cm |
COND A |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
4.2 X 109 |
|
MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
31.2(780) |
z |
KV/mm(V/mil) |
0.51mm(0.020”) |
IPC-TM-650 2.5.6.2 |
Tensile Modulus |
26889(3900) |
Y |
MPa(kpsi) |
RT |
ASTM D638 |
Tensile Strength |
141(20.4) |
Y |
MPa(kpsi) |
RT |
ASTM D638 |
Flexural Strength |
276(40) |
|
MPa(kpsi) |
|
IPC-TM-650 2.4.4 |
Dimensional Stability |
<0.3 |
X,Y |
mm/m(mils/inch) |
after etch +E2/150°C |
IPC-TM-650 2.4.39A |
Coeffifi cient of Thermal Expansion |
11 |
x |
ppm/°C |
-55 to 288°C |
IPC-TM-650 2.1.41 |
14 |
y |
||||
46 |
z |
||||
Tg |
>280 |
|
°C TMA |
A |
IPC-TM-650 2.4.24.3 |
Td |
425 |
|
°C TGA |
|
ASTM D3850 |
Thermal Conductivity |
0.64 |
|
W/m/°K |
80°C |
ASTM C518 |
Moisture Absorption |
0.06 |
|
% |
48 hrs immersion 0.060” sample Temperature 50°C |
ASTM D570 |
Density |
1.79 |
|
gm/cm3 |
23°C |
ASTM D792 |
Copper Peel Strength |
1.05(6.0) |
|
N/mm(pli) |
after solder float 1 oz. TC Foil |
IPC-TM-650 2.4.8 |
Flammability |
N/A |
|
|
|
UL 94 |
Lead-Free Process Compatible |
Yes |
|
|
|
|