TC350 Rogers RF PCB Built on 30mil Double Sided Core With Immersion Gold for Tower Mounted Amplifiers
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Overview of Rogers' TC350
Rogers' TC350 is a composite material made from woven fiberglass reinforced, ceramic-filled, and PTFE-based components, specifically designed for printed circuit board (PCB) applications. It aims to enhance heat transfer with "Best-In-Class" thermal conductivity while minimizing dielectric and insertion losses. This reduction in losses leads to improved amplifier and antenna efficiencies.
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Features and Benefits
1.Enhanced Thermal Conductivity: The superior thermal conductivity of TC350 enables higher power handling, reduces hot spots, and enhances device reliability. This results in lower junction temperatures and prolongs the lifespan of active components, which is vital for improving power amplifier reliability, increasing mean time between failures (MTBF), and lowering warranty costs.
2.Excellent Dielectric Constant Stability: TC350 exhibits strong dielectric constant stability across a wide temperature range. This stability assists power amplifier and antenna designers in maximizing gain and minimizing bandwidth loss due to dielectric constant drift as operating temperatures fluctuate.
3.Strong Bond to Copper: TC350 forms a robust bond with microwave-grade, low-profile copper, resulting in reduced insertion loss due to skin effect losses, particularly at higher RF and microwave frequencies.
PCB Capabilities
Our PCB Capability (TC350) |
|
PCB Material: |
Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite |
Designation: |
TC350 |
Dielectric constant: |
3.5±0.05 |
Thermal Conductivity |
0.72 W/m-K |
Dissipation Factor |
Df .002@10 GHz |
Layer count: |
Single Layer, Double Layer, Multi-layer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
PCB thickness: |
10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion silver, Immersion tin, ENEPIG, Pure gold etc.. |
Typical Applications
1.Microwave combiners and power dividers
2.Power amplifiers, filters, and couplers
3.Tower-mounted amplifiers (TMA) and tower-mounted boosters (TMB)
4.Thermally cycled antennas sensitive to dielectric drift
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Typical Properties of TC350
Typical Properties:TC350 |
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Property |
Units |
Value |
Test Merthod |
1. Electrical Properties |
|
||
Dielectric Constant (may vary by thickness) |
|
|
|
@1 MHz |
－ |
3.50 |
IPC TM-650 2.5.5.3 |
@1.8 GHz |
－ |
3.50 |
RESONANT CAVITY |
@10 GHz |
－ |
3.50 |
IPC TM-650 2.5.5.5 |
Dissipation Factor |
|
|
|
@1 MHz |
－ |
0.0015 |
IPC TM-650 2.5.5.3 |
@1.8 GHz |
－ |
0.0018 |
RESONANT CAVITY |
@10 GHz |
－ |
0.0020 |
IPC TM-650 2.5.5.5 |
Temperature Coefficient of Dielectric |
－ |
|
|
TC r @ 10 GHz (-40-150°C) |
ppm/ºC |
-9 |
IPC TM-650 2.5.5.5 |
Volume Resistivity |
|
|
|
C96/35/90 |
MΩ-cm |
7.4x106 |
IPC TM-650 2.5.17.1 |
E24/125 |
MΩ-cm |
1.4x108 |
|
Surface Resistivity |
|
|
|
C96/35/90 |
MΩ |
3.2x107 |
IPC TM-650 2.5.17.1 |
E24/125 |
MΩ |
4.3x108 |
IPC TM-650 2.5.17.1 |
Electrical Strength |
Volts/mil (kV/mm) |
780 (31) |
IPC TM-650 2.5.6.2 |
Dielectric Breakdown |
kV |
40 |
IPC TM-650 2.5.6 |
Arc Resistance |
sec |
>240 |
IPC TM-650 2.5.1 |
2.Thermal Properties |
|
||
Decomposition Temperature (Td) |
|
|
|
Initial |
°C |
520 |
IPC TM-650 2.4.24.6 |
5% |
°C |
567 |
IPC TM-650 2.4.24.6 |
T260 |
min |
>60 |
IPC TM-650 2.4.24.1 |
T288 |
min |
>60 |
IPC TM-650 2.4.24.1 |
T300 |
min |
>60 |
IPC TM-650 2.4.24.1 |
Thermal Expansion, CTE (x,y) 50-150ºC |
ppm/ºC |
7, 7 |
IPC TM-650 2.4.41 |
Thermal Expansion, CTE (z) 50-150ºC |
ppm/ºC |
23 |
IPC TM-650 2.4.24 |
% z-axis Expansion (50-260ºC) |
% |
1.2 |
IPC TM-650 2.4.24 |
3. Mechanical Properties |
|
||
Peel Strength to Copper (1 oz/35 micron) |
|
|
|
After Thermal Stress |
lb/in (N/mm) |
7 (1.2) |
IPC TM-650 2.4.8 |
At Elevated Temperatures (150ºC) |
lb/in (N/mm) |
9 (1.6) |
IPC TM-650 2.4.8.2 |
After Process Solutions |
lb/in (N/mm) |
7 (1.2) |
IPC TM-650 2.4.8 |
Young’s Modulus |
kpsi (MPa) |
|
IPC TM-650 2.4.18.3 |
Flexural Strength (Machine/Cross) |
kpsi (MPa) |
14/10 (97/69) |
IPC TM-650 2.4.4 |
Tensile Strength (Machine/Cross) |
kpsi (MPa) |
11/8 (76/55) |
IPC TM-650 2.4.18.3 |
Compressive Modulus |
kpsi (MPa) |
|
ASTM D-3410 |
Poisson’s Ratio |
－ |
|
ASTM D-3039 |
4. Physical Properties |
|
||
Water Absorption |
% |
0.05 |
IPC TM-650 2.6.2.1 |
Density, ambient 23ºC |
g/cm3 |
2.30 |
ASTM D792 Method A |
Thermal Conductivity |
W/mK |
0.72 |
ASTM D5470 |
Specific Heat |
J/gK |
0.90 |
ASTM D5470 |
Flammability |
class |
V-0 |
UL-94 |
NASA Outgassing, 125ºC, ≤10- 6 torr |
|
|
|
Total Mass Loss |
% |
0.02 |
NASA SP-R-0022A |
Collected Volatiles |
% |
0.01 |
NASA SP-R-0022A |
Water Vapor Recovered |
% |
0.01 |
NASA SP-R-0022A |