RO4350B Low Profile (LoPro) RF Circuit Board 20.7mil Rogers High Frequency PCB With Ni/Au for Low Noise Amplifier
(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)
Product Description
RO4350B LoPro laminates utilize proprietary technology from Rogers that allows reverse treated foil to bond effectively with standard RO4350B dielectric. This results in a laminate characterized by low conductor loss, improving insertion loss and signal integrity while maintaining all the desirable attributes of the standard RO4350B laminate system.
Features and Benefits
RO4350B materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil, providing several advantages:
Lower Insertion Loss:Improved signal transmission efficiency.
Low Passive Intermodulation (PIM):Enhances overall performance in RF applications.
Increased Signal Integrity:Ensures clearer signal transmission.
High Circuit Density:Supports complex circuit designs without compromising performance.
Thermal and Design Characteristics
Low Z-axis Coefficient of Thermal Expansion:Facilitates multi-layer board capability and design flexibility.
Lead-Free Process Compatible:Supports high-temperature processing and meets environmental regulations.
CAF Resistant:Increases reliability in harsh environments.
Typical Applications
1.Digital applications such as servers, routers, and high-speed backplanes
2.Cellular base station antennas and power amplifiers
3.LNBs for direct broadcast satellites
4.RF Identification Tags
PCB Capability (RO4350B LoPro)
Our PCB Capability (RO4350B LoPro) |
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PCB Material: |
Hydrocarbon Ceramic Laminates |
Designation: |
RO4350B LoPro |
Dielectric constant: |
3.48±0.05 |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: |
10.7mil (0.272mm), 14mil (0.356mm), 17.3mil (0.439mm), 20.7mil(0.526mm), 30.7mil (0.780mm), 60.7mil(1.542mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
Typical Properties of RO4350B LoPro
Typical Properties of RO4350B LoPro |
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Property |
Typical Value |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant, Process |
3.48 ± 0.05 |
z |
-- |
10 GHz/23°C |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant, Design |
3.55 |
z |
-- |
8 to 40 GHz |
Differential Phase Length Method |
Dissipation Factor tan, d |
0.0037 0.0031 |
z |
-- |
10 GHz/23°C 2.5 GHz/23°C |
IPC-TM-650 2.5.5.5 |
Thermal Coeffifi cient of er |
50 |
z |
ppm/°C |
-50°C to 150°C |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
1.2 X 1010 |
|
MΩ•cm |
COND A |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
5.7 X 109 |
|
MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
31.2(780) |
z |
KV/mm(V/mil) |
0.51mm(0.020”) |
IPC-TM-650 2.5.6.2 |
Tensile Modulus |
11473(1664) |
Y |
MPa(kpsi) |
RT |
ASTM D638 |
Tensile Strength |
175(25.4) |
Y |
MPa(kpsi) |
RT |
ASTM D638 |
Flexural Strength |
255(37) |
|
MPa(kpsi) |
|
IPC-TM-650 2.4.4 |
Dimensional Stability |
<0.5 |
X,Y |
mm/m(mils/inch) |
after etch +E2/150°C |
IPC-TM-650 2.4.39A |
Coeffifi cient of Thermal Expansion |
14 |
x |
ppm/°C |
-55 to 288°C |
IPC-TM-650 2.1.41 |
16 |
y |
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35 |
z |
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Tg |
>280 |
|
°C TMA |
A |
IPC-TM-650 2.4.24.3 |
Td |
390 |
|
°C TGA |
|
ASTM D3850 |
Thermal Conductivity |
0.62 |
|
W/m/°K |
80°C |
ASTM C518 |
Moisture Absorption |
0.06 |
|
% |
48 hrs immersion 0.060” sample Temperature 50°C |
ASTM D570 |
Density |
1.86 |
|
gm/cm3 |
23°C |
ASTM D792 |
Copper Peel Strength |
0.88(5.0) |
|
N/mm(pli) |
after solder float 1 oz. TC Foil |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
|
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UL 94 |
Lead-Free Process Compatible |
Yes |
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