RO4533 Antenna High Frequency PCB - 60mil Rogers 4533 Double Layer Immersion Gold Circuit Board for Cellular and WiMAX Applications
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
The RO4533 Antenna High Frequency PCB is a double-sided circuit board built on Rogers RO4533 laminates, a cost-effective and high-performance material designed for antenna applications. This PCB features a 60mil (1.524mm) core with 1oz copper finish and immersion gold surface treatment on both the top and bottom layers, including vias. The boards are manufactured in compliance with IPC 6012 Class 2 standards using supplied Gerber data. Each shipment includes 25 boards, securely packed for delivery.
With a dielectric constant (Dk) of 4.38, Kappa 438 laminates align seamlessly with FR-4 industry standards, making it easy to upgrade your existing designs for enhanced performance and reliability.
PCB Specifications
| PCB SIZE | 55 x 92mm=1up |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 17um(0.5 oz)+plate TOP layer |
| Rogers RO4533 1.524mm | |
| copper ------- 17um(0.5 oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 10 mil / 10 mil |
| Minimum / Maximum Holes: | 0.3 mm / 4.0 mm |
| Number of Different Holes: | 3 |
| Number of Drill Holes: | 159 |
| Number of Milled Slots: | 1 |
| Number of Internal Cutouts: | 2 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | Rogers RO4533 1.524mm |
| Final foil external: | 1.0 oz |
| Final foil internal: | N/A |
| Final height of PCB: | 1.6 mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold, 91% |
| Solder Mask Apply To: | N/A |
| Solder Mask Color: | N/A |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | N/A |
| Colour of Component Legend | N/A |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated through hole(PTH), minimum size 0.3mm. |
| FLAMIBILITY RATING | 94V-0 |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Typical Applications
1.Cellular Infrastructure Base Station Antennas
2.WiMAX Antenna Networks
Our Advantages
1.Certifications: ISO9001, ISO14001, IATF16949, ISO13485, and UL Certified.
2.Experience: Over 18 years of expertise in high-frequency PCB manufacturing.
3.Flexible Orders: No minimum order quantity (MOQ) required; small quantity orders are welcome.
4.Team Commitment: A team driven by passion, discipline, responsibility, and honesty.
5.Reliability: On-time delivery rate >98%, customer complaint rate <1%.
6.Production Capacity: 16,000㎡ workshop, 30,000㎡ monthly output, and 8,000 types of PCBs produced monthly.
7.R&D Support: Strong PCB capabilities to support research, development, sales, and marketing.
8.Quality Standards: IPC Class 2 and IPC Class 3 compliant.
Typical Values (RO4533, RO4534, RO4535)
| Property | RO4533 | Direction | Units | Condition | Test Method |
| Dielectric Constant, er Process | 3.3 ± 0.08 | Z | - | 10 GHz/23℃ 2.5 GHz | IPC-TM-650,2.5.5.5 |
| Dissipation Factor | 0.002 | Z | - | 2.5 GHz/23℃ | IPC-TM-650, 2.5.5.5 |
| 0.0025 | 10 GHz/23℃ | ||||
| PIM (Typical) | -157 | - | dBc | Reflected 43 dBm swept tones | Summitek 1900b PIM Analyzer |
| Dielectric Strength | >500 | Z | V/mil | 0.51 mm | IPC-TM-650, 2.5.6.2 |
| Dimensional Stability | <0.2 | X,Y | mm/m (mils/inch) | after etch | IPC-TM-650, 2.4.39A |
| Coefficient of Thermal Expansion | 13 | X | ppm/℃ | -55 to 288℃ | IPC-TM-650, 2.4.41 |
| 11 | Y | ||||
| 37 | Z | ||||
| Thermal Conductivity | 0.6 | - | W/(m.K) | 80℃ | ASTM C518 |
| Moisture Absorption | 0.02 | - | % | D48/50 | IPC-TM-650, 2.6.2.1 ASTM D570 |
| Tg | >280 | - | ℃ TMA | A | IPC-TM-650, 2.4.24.3 |
| Density | 1.8 | - | gm/cm3 | - | ASTM D792 |
| Copper Peel Strength | 6.9 （1.2） | - | lbs/in (N/mm) | 1 oz. EDC post solder float | IPC-TM-650, 2.4.8 |
| Flammability | NON FR | - | - | - | UL 94 |
| Lead-Free Process Compatible | Yes | - | - | - | - |