Home > Low Loss PCB > Kappa 438 Microwave PCB – Rogers 40mil 1.016mm DK 4.38 with Immersion Gold for Distributed Antenna Systems
Kappa 438 Microwave PCB – Rogers 40mil 1.016mm DK 4.38 with Immersion Gold for Distributed Antenna Systems

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Elevate Your Microwave PCB Designs with Rogers Kappa 438 Laminates

Experience exceptional high-frequency performance withRogers Kappa 438 laminates, designed for microwave PCB applications. Built on a glass-reinforced hydrocarbon ceramic system, these laminates deliver low-loss properties, cost-effective fabrication, and superior electrical performance. Fully compatible with standard FR-4 processing techniques, Kappa 438 laminates meet the UL 94 V-0 flame retardant rating and are optimized for lead-free soldering processes.


With a dielectric constant (Dk) of 4.38, Kappa 438 laminates align seamlessly with FR-4 industry standards, making it easy to upgrade your existing designs for enhanced performance and reliability.


Key Features of Kappa 438 Laminates

1.Advanced Material Composition: Built on a glass-reinforced hydrocarbon thermoset platform, ensuring durability and performance.
2.Optimized Dielectric Constant (Dk): A Dk of 4.38 ensures consistent signal integrity and minimal signal loss in high-frequency applications.
3.Precision Tolerances: Tighter Dk and thickness tolerances compared to traditional FR-4 materials.
4.Low Z-Axis CTE: A low coefficient of thermal expansion (42 ppm/°C) ensures stability under thermal stress.
5.High Glass Transition Temperature (Tg): With a Tg of >280°C (TMA), Kappa 438 excels in high-temperature environments.
6.Flame Retardant: Meets UL 94-V0 requirements, ensuring safety and compliance.


Why Choose Kappa 438 Laminates?

Ease of Manufacturing: Simplifies PCB production and assembly, fully compatible with standard FR-4 processes.
Design Flexibility: The tailored Dk allows for easy conversion of existing FR-4 designs, enabling enhanced electrical performance without major redesigns.
Consistent Performance: Ensures reliable and consistent circuit performance across a wide range of applications.
Enhanced Reliability: Improves design flexibility and plated through-hole reliability, ensuring long-term durability.
Automation-Friendly: Ideal for automated assembly processes, reducing production time and costs.



Applications of Kappa 438 Laminates

Kappa 438 laminates are perfect for a wide range of high-frequency applications, including:

1.Carrier-Grade WiFi / Licensed Assisted Access (LAA)
2.Small Cell and Distributed Antenna Systems (DAS)
3.Vehicle-to-Vehicle / Vehicle-to-Infrastructure Communications (V2X)
4.Internet of Things (IoT) Devices
*Segments: Smart Home and Wireless Meters




Our PCB Capability (Kappa 438)

PCB Capability (Kappa 438)

PCB Material:

Glass Reinforced Hydrocarbon Ceramic

Designation:

Kappa 438

Dielectric constant:

4.38 at 2.5GHz

Layer count:

Single Layer, Double Layer, Multilayer, Hybrid PCB

Copper weight:

1oz (35 µm), 2oz (70µm)

PCB thickness:

10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm),  60mil (1.524mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersoin silver, Immersion tin, OSP, ENEPIG, Pure gold etc..


Upgrade Your Microwave PCB Designs with Kappa 438 Laminates!

Whether you're working on distributed antenna systems (DAS), IoT devices, or V2X communications, Rogers Kappa 438 laminates offer the perfect combination of performance, reliability, and cost efficiency. With low-loss properties, high-temperature stability, and ease of manufacturing, Kappa 438 is the ideal choice for your next microwave PCB project.


Data Sheet of Kappa 438 Laminate

Click to expand/collapse the table

Property

Typical Value Kappa 438

Direction

Units

Condition

Test Method

Dielectric Constant, er Design

4.38

Z

-

2.5 GHz

Differential Phase Length Method

Dissipation Factor tan, d

0.005

Z

-

10 GHz/23°C

IPC-TM-650 2.5.5.5

Thermal Coefficient of Dielectric Constant e

-21

-

ppm/°C

10 GHz (-50 to 150°C)

Modified IPC-TM-650 2.5.5.5

Volume Resistivity

2.9 x 109

-

MΩ•cm

COND A

IPC-TM-650 2.5.17.1

Surface Resistivity

6.2 x 107

-

MΩ

COND A

IPC-TM-650 2.5.17.1

Electrical Strength

675

Z

V/mil

-

IPC-TM-650 2.5.6.2

Tensile Strength

16   12

MD CMD

kpsi

-

ASTM D3039/D3039-14

Flexural Strength

25  19

MD CMD

kpsi

-

IPC-TM-650 2.4.4

Dimensional Stability

 -0.48-0.59

MD CMD

mm/m

-

IPC-TM-650 2.4.39a

Coefficient of Thermal Expansion

13

X

ppm/°C

-55 to 288°C

IPC-TM-650 2.4.41

16

Y

42

Z

Thermal Conductivity

0.64

Z

W/(m.K)

80°C

ASTM D5470

Time to Delamination (T288)

>60

-

minutes

288°C

IPC-TM-650 2.4.24.1

Tg

>280

-

°C TMA

-

IPC-TM-650 2.4.24.3

Td

414

-

°C

-

IPC-TM-650 2.3.40

Moisture Absorption

0.07

-

%

24/23

IPC-TM-650 2.6.2.1

Young’s Modulus

2264 2098

MD CMD

kpsi

-

ASTM D3039/D3039-14

Flex Modulus

2337 2123

MD CMD

kpsi

-

IPC-TM-650 2.4.4

Bow

0.03

-

%

-

IPC-TM-650 2.4.22C

Twist

0.08

-

%

-

IPC-TM-650 2.4.22C

Copper Peel Strength After Thermal Stress

5.8

-

lbs/in

1 oz (35 µm) foil

IPC-TM-650 2.4.8

Flammability

V-0

-

-

-

UL 94

Specific Gravity

1.99

-

g/cm3

-

ASTM D792

Lead-Free Process Compatible

Yes

-

-

-



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