Rogers 15mil TMM10 High Frequency PCB With Immersion Gold and Green Solder Mask for Chip Testers
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Overview of TMM10
Rogers’ TMM10 thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high reliability in plated-thru-hole stripline and microstrip applications. These laminates combine the benefits of both ceramic and traditional PTFE microwave circuit laminates without necessitating specialized production techniques common to these materials.
TMM10 laminates feature an exceptionally low thermal coefficient of dielectric constant, typically less than 30 ppm/°C. Their isotropic coefficients of thermal expansion are closely matched to copper, which facilitates the production of high-reliability plated-through holes and minimizes etch shrinkage values. Additionally, the thermal conductivity of TMM10 laminates is approximately twice that of traditional PTFE/ceramic laminates, enhancing heat removal capabilities.
TMM10 laminates are based on thermoset resins, meaning they do not soften when heated. This property enables wire bonding of component leads to circuit traces without concerns about pad lifting or substrate deformation.
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Some Typical Applications
1.Chip Testers
2.Dielectric Polarizers and Lenses
3.Filters and Couplers
4.Global Positioning Systems Antennas
5.Patch Antennas
6.Power Amplifiers and Combiners
7.RF and Microwave Circuitry
8.Satellite Communication Systems
Our Capabilities (TMM10)y
PCB Capability (TMM10) |
|
PCB Material: |
Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: |
TMM10 |
Dielectric constant: |
9.20 ±0.23 |
Layer count: |
Single Layer, Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
PCB thickness: |
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion Silver, Immersion Tin, ENEPIG, Pure Gold, OSP etc.. |
Data Sheet of TMM10
TMM10 Typical Value |
||||||
Property |
TMM10 |
Direction |
Units |
Condition |
Test Method |
|
Dielectric Constant,εProcess |
9.20±0.23 |
Z |
|
10 GHz |
IPC-TM-650 2.5.5.5 |
|
Dielectric Constant,εDesign |
9.8 |
- |
- |
8GHz to 40 GHz |
Differential Phase Length Method |
|
Dissipation Factor (process) |
0.0022 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
|
Thermal Coefficient of dielectric constant |
-38 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
|
Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
|
Volume Resistivity |
2 x 108 |
- |
Mohm.cm |
- |
ASTM D257 |
|
Surface Resistivity |
4 x 107 |
- |
Mohm |
- |
ASTM D257 |
|
Electrical Strength(dielectric strength) |
285 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
|
Thermal Properties |
||||||
Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
|
Coefficient of Thermal Expansion - x |
21 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Coefficient of Thermal Expansion - Y |
21 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Coefficient of Thermal Expansion - Z |
20 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Thermal Conductivity |
0.76 |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
|
Mechanical Properties |
||||||
Copper Peel Strength after Thermal Stress |
5.0 (0.9) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
|
Flexural Strength (MD/CMD) |
13.62 |
X,Y |
kpsi |
A |
ASTM D790 |
|
Flexural Modulus (MD/CMD) |
1.79 |
X,Y |
Mpsi |
A |
ASTM D790 |
|
Physical Properties |
||||||
Moisture Absorption (2X2) |
1.27mm (0.050") |
0.09 |
- |
% |
D/24/23 |
ASTM D570 |
3.18mm (0.125") |
0.2 |
|||||
Specific Gravity |
2.77 |
- |
- |
A |
ASTM D792 |
|
Specific Heat Capacity |
0.74 |
- |
J/g/K |
A |
Calculated |
|
Lead-Free Process Compatible |
YES |
- |
- |
- |
- |
|