Rogers TC350 20mil High Frequency PCB On Double Sided Core With Immersion Gold for Filters and Couplers
(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)
Rogers' TC350 Composite Material for PCBs
Rogers' TC350 is a woven fiberglass reinforced, ceramic filled, PTFE based composite material designed for use in printed circuit boards (PCBs). TC350 is engineered to provide enhanced heat transfer through "Best-In-Class" thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher amplifier and antenna gains/efficiencies.
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Key Features & Benefits
1.Increased Thermal Conductivity: The high thermal conductivity of TC350 enables higher power handling, reduces hot spots, and improves device reliability. This results in lower junction temperatures and extends the lifespan of active components, which is critical for enhancing power amplifier reliability, increasing mean time between failures (MTBF), and reducing warranty costs.
2.Excellent Dielectric Constant Stability:TC350 maintains excellent dielectric constant stability across a wide temperature range. This property helps power amplifier and antenna designers maximize gain and minimize bandwidth loss caused by dielectric constant drift as operating temperatures change.
3.Strong Copper Bonding: TC350 enjoys a strong bond to microwave-grade, low-profile copper. This results in even lower insertion loss due to skin effect losses, which are more pronounced at higher RF and microwave frequencies.
PCB Capability
Our PCB capabilities with TC350 include:
Our PCB Capability (TC350) |
|
PCB Material: |
Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite |
Designation: |
TC350 |
Dielectric constant: |
3.5±0.05 |
Thermal Conductivity |
0.72 W/m-K |
Dissipation Factor |
Df .002@10 GHz |
Layer count: |
Single Layer, Double Layer, Multi-layer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
PCB thickness: |
10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion silver, Immersion tin, ENEPIG, Pure gold etc.. |
Typical Applications
1.Microwave combiners and power dividers
2.Power amplifiers, filters, and couplers
3.Tower-mounted amplifiers (TMA) and tower-mounted boosters (TMB)
4.Thermally cycled antennas sensitive to dielectric drift
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Typical Properties of TC350
Typical Properties:TC350 |
|||
Property |
Units |
Value |
Test Merthod |
1. Electrical Properties |
|
||
Dielectric Constant (may vary by thickness) |
|
|
|
@1 MHz |
－ |
3.50 |
IPC TM-650 2.5.5.3 |
@1.8 GHz |
－ |
3.50 |
RESONANT CAVITY |
@10 GHz |
－ |
3.50 |
IPC TM-650 2.5.5.5 |
Dissipation Factor |
|
|
|
@1 MHz |
－ |
0.0015 |
IPC TM-650 2.5.5.3 |
@1.8 GHz |
－ |
0.0018 |
RESONANT CAVITY |
@10 GHz |
－ |
0.0020 |
IPC TM-650 2.5.5.5 |
Temperature Coefficient of Dielectric |
－ |
|
|
TC r @ 10 GHz (-40-150°C) |
ppm/ºC |
-9 |
IPC TM-650 2.5.5.5 |
Volume Resistivity |
|
|
|
C96/35/90 |
MΩ-cm |
7.4x106 |
IPC TM-650 2.5.17.1 |
E24/125 |
MΩ-cm |
1.4x108 |
|
Surface Resistivity |
|
|
|
C96/35/90 |
MΩ |
3.2x107 |
IPC TM-650 2.5.17.1 |
E24/125 |
MΩ |
4.3x108 |
IPC TM-650 2.5.17.1 |
Electrical Strength |
Volts/mil (kV/mm) |
780 (31) |
IPC TM-650 2.5.6.2 |
Dielectric Breakdown |
kV |
40 |
IPC TM-650 2.5.6 |
Arc Resistance |
sec |
>240 |
IPC TM-650 2.5.1 |
2.Thermal Properties |
|
||
Decomposition Temperature (Td) |
|
|
|
Initial |
°C |
520 |
IPC TM-650 2.4.24.6 |
5% |
°C |
567 |
IPC TM-650 2.4.24.6 |
T260 |
min |
>60 |
IPC TM-650 2.4.24.1 |
T288 |
min |
>60 |
IPC TM-650 2.4.24.1 |
T300 |
min |
>60 |
IPC TM-650 2.4.24.1 |
Thermal Expansion, CTE (x,y) 50-150ºC |
ppm/ºC |
7, 7 |
IPC TM-650 2.4.41 |
Thermal Expansion, CTE (z) 50-150ºC |
ppm/ºC |
23 |
IPC TM-650 2.4.24 |
% z-axis Expansion (50-260ºC) |
% |
1.2 |
IPC TM-650 2.4.24 |
3. Mechanical Properties |
|
||
Peel Strength to Copper (1 oz/35 micron) |
|
|
|
After Thermal Stress |
lb/in (N/mm) |
7 (1.2) |
IPC TM-650 2.4.8 |
At Elevated Temperatures (150ºC) |
lb/in (N/mm) |
9 (1.6) |
IPC TM-650 2.4.8.2 |
After Process Solutions |
lb/in (N/mm) |
7 (1.2) |
IPC TM-650 2.4.8 |
Young’s Modulus |
kpsi (MPa) |
|
IPC TM-650 2.4.18.3 |
Flexural Strength (Machine/Cross) |
kpsi (MPa) |
14/10 (97/69) |
IPC TM-650 2.4.4 |
Tensile Strength (Machine/Cross) |
kpsi (MPa) |
11/8 (76/55) |
IPC TM-650 2.4.18.3 |
Compressive Modulus |
kpsi (MPa) |
|
ASTM D-3410 |
Poisson’s Ratio |
－ |
|
ASTM D-3039 |
4. Physical Properties |
|
||
Water Absorption |
% |
0.05 |
IPC TM-650 2.6.2.1 |
Density, ambient 23ºC |
g/cm3 |
2.30 |
ASTM D792 Method A |
Thermal Conductivity |
W/mK |
0.72 |
ASTM D5470 |
Specific Heat |
J/gK |
0.90 |
ASTM D5470 |
Flammability |
class |
V-0 |
UL-94 |
NASA Outgassing, 125ºC, ≤10- 6 torr |
|
|
|
Total Mass Loss |
% |
0.02 |
NASA SP-R-0022A |
Collected Volatiles |
% |
0.01 |
NASA SP-R-0022A |
Water Vapor Recovered |
% |
0.01 |
NASA SP-R-0022A |