Rogers 4360 High Frequency PCB 16mil Double Sided RF PCB with Green Mask and Immersion Gold for Small Cell Transceivers

(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)

Introduction

RO4360G2 laminates from Rogers Corporation are advanced materials featuring a dielectric constant (Dk) of 6.15 and low loss characteristics. These glass-reinforced, hydrocarbon ceramic-filled thermoset materials provide an ideal balance of performance and processing ease. RO4360G2 extends Rogers' portfolio of high-performance materials by offering a lead-free process capable solution that improves rigidity for enhanced processability in multi-layer board constructions while reducing material and fabrication costs.

RO4360G2 laminates process similarly to FR-4 and are compatible with automated assembly. They feature a low Z-axis coefficient of thermal expansion (CTE), providing design flexibility, and maintain a high glass transition temperature (Tg) consistent with the entire RO4000 product line. These laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminate in multi-layer designs.

With a Dk of 6.15 (Design Dk 6.4), RO4360G2 laminates enable designers to reduce circuit dimensions in applications where size and cost are critical. They are an excellent value choice for engineers working on designs such as power amplifiers, patch antennas, ground-based radar, and other general RF applications.

Features and Benefits

Thermoset Resin System
1.Specially formulated to meet 6.15 Dk
2.Ease of fabrication; processes similar to FR-4
3.Material repeatability
4.Low loss
5.High thermal conductivity
6.Lower total PCB cost solution compared to competing PTFE products

Low Z-axis CTE / High Tg 1.Design flexibility
2.Plated through-hole reliability
3.Compatible with automated assembly

Environmentally Friendly
1.Lead-free process compatible

Regional Finished Goods Inventory
1.Short lead times and quick inventory turns
2.Efficient supply chain management

Typical Applications

Base Station Power Amplifiers
Small Cell Transceivers
Patch Antennas
Ground-Based Radar

PCB Capability (RO4360G2)

PCB Capability (RO4360G2)
PCB Material:	Hydrocarbon Ceramic-filled Thermoset Materials
Designation:	RO4360G2
Dielectric constant:	6.15 ±0.15
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP etc..

Data Sheet of RO4360G2