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Home > Low Loss PCB > Rogers 60mil RT/duroid 6035HTC High Frequency PCB on Double Sided Copper With Green Mask for High Power RF Amplifiers
Rogers 6035 High Frequency PCB Built On Dual Layer 30mil Core With Immersion Gold for Power Dividers

(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)


Product Description

RT/duroid 6035HTC high frequency circuit materials from Rogers Corporation are ceramic-filled PTFE composites designed for high-power RF and microwave applications. They feature a thermal conductivity that is nearly 2.4 times greater than that of standard RT/duroid 6000 products. Coupled with copper foil (electrodeposited and reverse treated) offering excellent long-term thermal stability, RT/duroid 6035HTC laminates are an outstanding choice for high-power applications.



Features and Benefits

High Thermal Conductivity:
1.Enhanced dielectric heat dissipation enables lower operating temperatures for high-power applications.


Low Loss Tangent:
1.Provides excellent high-frequency performance.


Thermally Stable Low Profile and Reverse Treat Copper Foil:
1.Results in lower insertion loss and excellent thermal stability of traces.
Advanced Filler System:
1.Offers improved drillability and extended tool life compared to alumina-containing circuit materials.


Typical Applications

1.High Power RF and Microwave Amplifiers
2.Power Amplifiers, Couplers, Filters
3.Combiners, Power Dividers



PCB Capability (RT/duroid 6035HTC)

PCB Capability (RT/duroid 6035HTC)

PCB Material:

Ceramic-filled PTFE composites

Designation:

RT/duroid 6035HTC

Dielectric constant:

3.50±0.05

Layer count:

Double Layer, Multilayer, Hybrid PCB

Copper weight:

1oz (35µm), 2oz (70µm)

PCB thickness:

10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersion silver, Immersion tin, Pure gold, ENEPIG, OSP etc..


Data Sheet of RT/duroid 6035HTC

Click to expand/collapse the table

Property

Typical Value RT/duroid 6035HTC

Direction

Unit

Condition

Test Method

Dielectric Constant, εr Process

3.50 ± 0.05

Z

-

10 GHz/23°C

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant, εr
Design

3.6

Z

-

8 GHz - 40 GHz

Differential Phase Length Method         

Dissipation Factor,

0.0013

Z

-

10 GHz/23°C

IPC-TM-650, 2.5.5.5

Thermal Coefficient of εr

-66

Z

ppm/°C

-50°C to 150°C

mod IPC-TM-650, 2.5.5.5

Dielectric Strength

835

-

V/Mil

15 mil thickness

IPC-TM-650, 2.5.6.2

Breakdown Voltage

12.59

-

kV

15 mil thickness

IPC-TM-650, 2.5.6

Volume Resistivity

108

-

MΩ•cm

COND A

IPC-TM-650, 2.5.17.1

Surface Resistivity

108

-

MΩ

COND A

IPC-TM-650, 2.5.17.1

Tensile Modulus

329
244

    MD
CMD

kpsi

40 hrs @ 23°C/50RH

ASTM D638

Dimensional Stability

-0.11
-0.08

     CMD
MD

mm/m
(mils/inch)

0.030” 1 oz EDC foil
Thickness
after etch +E4/105

IPC-TM-650, 2.4.39A

Coefficient of Thermal
Expansion (-55 to 288 °C)

19

X

ppm/°C

23°C/50% RH

IPC-TM-650 2.4.41

19

Y

39

Z

Thermal Conductivity

1.44

-

W/m/K

80°C

ASTM C518

Moisture Absorption

0.06

-

%

D24/23

IPC-TM-650 2.6.2.1 ASTM D570     

Density

2.2

-

gm/cm3

23°C

ASTM D-792

Copper Peel Strength

7.9

-

pli

20 sec.@ 288°C

IPC-TM-650 2.4.8

Flammability

V-0

-

-

-

UL  94

Lead-Free Process
Compatible

YES

 

 

 



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