Rogers AD250C Microwave and RF PCB - 20mil 30mil 60mil Antenna Material with Dielectric Constant (DK) of 2.50
(Printed Circuit Boards are custom-made products; the images and parameters shown are for reference only.)
General Description
The Rogers AD250C Microwave and RF PCB is a high-performance circuit board designed for antenna applications. Built on Rogers AD250C laminates, this PCB features PTFE-based composites with woven fiberglass and micro-dispersed ceramic fillers, offering a controlled dielectric constant of 2.50 ± 0.04 and a low loss tangent of 0.0014 at 10 GHz. The use of low-profile reverse-treated ED copper foil reduces conductive losses and passive intermodulation (PIM), making it ideal for telecommunication infrastructure and antenna systems. Available in 20mil, 30mil, and 60mil thicknesses, this PCB is a cost-effective solution for high-frequency applications.
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Typical Properties
| Electrical Properties | AD250C | Units | Test Conditions | Test Method | |
| PIM (30mil/60mil) | -159/-163 | dBc | Reflected 43 dBm swept tones at 1900 MHz, S1/S1 | Rogers Internal 50 ohm | |
| Dielectric Constant (process) | 2.52 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 (IPC TM-650 2.5.5.3) |
| Dielectric Constant (design) | 2.50 | - | C-24/23/50 | 10 GHz | Microstrip Differential Phase Length |
| Dissipation Factor (process) | 0.0013 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 |
| Thermal Coefficient of Dielectric Constant | -117 | ppm/ºC | 0°C to 100°C | 10 GHz | IPC TM-650 2.5.5.5 |
| Volume Resistivity | 4.8 x 108 | Mohm-cm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
| Surface Resistivity | 4.1 x 107 | Mohm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
| Electrical Strength (dielectric strength) | 979 | V/mil | - | - | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | >40 | kV | D-48/50 | X/Y direction | IPC TM-650 2.5.6 |
| Thermal Properties | |||||
| Decomposition Temperature (Td) | >500 | ˚C | 2hrs @ 105˚C | 5% Weight Loss | IPC TM-650 2.3.40 |
| Coefficient of Thermal Expansion - x | 47 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - y | 29 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - z | 196 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Thermal Conductivity | 0.33 | W/mK | - | z direction | ASTM D5470 |
| Time to Delamination | >60 | minutes | as-received | 288˚C | IPC TM-650 2.4.24.1 |
| Mechanical Properties | |||||
| Copper Peel Strength after Thermal Stress | 2.6 (14.8) |
N/mm (lbs/in) | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 |
| Flexural Strength (MD/CMD) | 8.8/6.4 (60.7/44.1) | MPa (ksi ) | 25°C ± 3°C | - | ASTM D790 |
| Tensile Strength (MD/CMD) | 6.0/5.6 (41.4/38.6) | MPa (ksi ) | 23°C/50% RH | - | ASTM D3039/D3039-14 |
| Flex Modulus (MD/CMD) | 885/778 (6,102/5,364) | MPa (ksi ) | 25°C ± 3°C | - | IPC-TM-650 Test Method 2.4.4 |
| Dimensional Stability (MD/CMD) | 0.02/0.06 | mils/inch | after etch + bake | - | IPC-TM-650 2.4.39a |
| Physical Properties | |||||
| Flammability | V-0 | - | - | - | UL-94 |
| Moisture Absorption | 0.04 | % | E1/105 +D48/50 | - | IPC TM-650 2.6.2.1 |
| Density | 2.28 | g/cm3 | C-24/23/50 | - | ASTM D792 |
| Specific Heat Capacity | 0.813 | J/g°K | 2 hours at 105°C | - | ASTM E2716 |
Typical Applications
1.Automotive Telematics Antenna Systems
2.Base Station Antenna Applications
3.Cellular Infrastructure Base Station Antennas
4.Commercial Satellite Radio Antennas
5.Digital Audio Broadcasting (DAB) Antennas
6.Radar Manifolds and Feed Networks
Our PCB Capability (AD250C)
| PCB Capability (AD250C) | |
| PCB Material: | PTFE based Woven Fiberglass/Ceramic Filled Composites |
| Designation: | AD250C |
| Dielectric constant: | 2.50 (10 GHz) |
| Dissipation factor | 0.0013 (10 GHz) |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold (ENIG), HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, Pure gold plated etc.. |
Our Advantages
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is a leading high-frequency PCB supplier and exporter based in Shenzhen, China. With over 19 years of experience, we specialize in serving industries such as cellular base station antennas, satellite systems, high-frequency passive components, microstrip and band line circuits, millimeter-wave equipment, radar systems, and digital radio frequency antennas. Our high-frequency PCBs are primarily built on materials from Rogers Corporation, Taconic, and Wangling, with dielectric constants ranging from 2.2 to 10.2.
We also offer a wide range of PCB solutions, including FR-4 circuit boards, flexible circuits, and metal core PCBs, catering to prototypes, small runs, and mass production. Our expertise extends to high-value-added projects such as HDI, quick-turn PCBs, impedance control, heavy copper boards, and backplane boards. This comprehensive product line allows us to meet diverse customer needs, from low-end to high-end applications.
Materials We Offer
Our materials include, but are not limited to:
Rogers: RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210.
RT/Duroid: RT/Duroid 5880, RT/Duroid 5870, RT/Duroid 6002, RT/Duroid 6010, RT/Duroid 6035HTC, RT/Duroid 5880LZ.
Taconic: TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35, RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8, TLX-9, TLY-3, TLY-5, TLY-5Z.
Wangling: F4B (DK2.2, DK2.65, DK2.85, DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2).
Other Materials: AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350, TC600; DiClad 880, DiClad 870, DiClad 527, IsoClad 917; Nelco N4000, N9350, N9240.