Home > High Speed PCB > Rogers DiClad 880 High Frequency PCB - 20mil 30mil 60mil with Gold, Tin, and Silver Finishes
Rogers DiClad 880 High Frequency PCB - 20mil 30mil 60mil with Gold, Tin, and Silver Finishes

(Printed Circuit Boards are custom-made products; the images and parameters shown are for reference only.)


Brief Introduction

The Rogers DiClad 880 High Frequency PCB is a high-performance circuit board designed for applications requiring low dielectric constant and low loss tangent. Built on Rogers DiClad 880 laminates, this PCB features woven fiberglass-reinforced PTFE composites (without ceramic fillers), offering excellent dimensional stability and uniform electrical properties. The dielectric constant (Dk) and dissipation factor (Df) are precisely controlled by adjusting the ratio of woven fiberglass to PTFE, ensuring consistent performance across a wide frequency range. Available with gold, tin, and silver surface finishes, it is ideal for high-frequency and RF applications.



Features

1.Extremely Low Loss Tangent (0.0009): Ensures minimal signal loss, ideal for high-frequency applications.
2.Excellent Dimensional Stability: Maintains consistent performance across the XY direction.
3.Product Performance Uniformity: Uniform electrical and mechanical properties across the board.


Benefits

1.Highly Uniform Electrical Properties: Consistent performance across a wide frequency range.
2.Consistent Mechanical Performance: Reliable operation in demanding environments.
3.Excellent Chemical Resistance: Resistant to chemicals used in PCB manufacturing processes.


Typical Applications

1.Commercial Phased Array Networks
2.Digital Radio Antennas
3.Filters, Couplers, and LNAs (Low Noise Amplifiers)
4.Low Loss Base Station Antennas
5.Radar Feed Networks
6.Missile Guidance Systems


Our PCB Capability (DiClad 880)

PCB Capability (DiClad 880) 
PCB Material: Woven Fiberglass Reinforced, PTFE-based Composites
Designation: DiClad 880
Dielectric constant: 2.20  (10 GHz)
Dissipation factor 0.0009 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 20mil (0.508mm), 30mil (0.762mm),  60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold (ENIG), HASL,  Immersion silver, Immersion tin, OSP, ENEPIG, Bare Copper, Pure gold plated etc..

Our Advantages

1.Engineering Design Support: Prevents issues during pre-production.
2.Certified Manufacturing: ISO9001, ISO14001, ISO13485, and UL certified.
3.AOI Inspection: Ensures high-quality production with automated optical inspection.
4.Comprehensive PCB Capabilities: Supports R&D, sales, and marketing.
5.High On-Time Delivery Rate: Over 98% on-time delivery.
6.Any Layer HDI PCBs: Advanced technology for high-density interconnects.
7.Large Production Facility: 16,000㎡ workshop with a monthly output of 30,000㎡ and 8,000 types of PCBs.
8.Quick Turnaround: Fast CADCAM checking and free PCB quotations.
9.Diverse Shipping Options: FedEx, DHL, TNT, and EMS available.
10.Flexible Ordering: No minimum order quantity (MOQ); low-cost prototypes and small runs.


Appendix: Typical Properties of DiClad 880

Click to expand/collapse the table

Property Test Method Condition DiClad 880
Dielectric Constant  @ 10 GHz IPC TM-650 2.5.5.5 C23/50 2.17, 2.20
Dielectric Constant  @ 1 MHz IPC TM-650 2.5.5.3 C23/50 2.17, 2.20
Dissipation Factor @ 10 GHz IPC TM-650 2.5.5.5 C23/50 0.0009
Dissipation Factor @ 1 MHz IPC TM-650 2.5.5.3 C23/50 0.0008
Thermal Coefficient of Er (ppm/°C) IPC TM-650 2.5.5.5
Adapted
-10°C to +140°C -160
Peel Strength  (lbs.per inch) IPC TM-650 2.4.8 After Thermal Stress 14
Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 1.4 x 10 9
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 2.9 x 10 6
Arc Resistance ASTM D-495 D48/50 >180
Tensile Modulus (kpsi) ASTM D-638 A, 23°C 267, 202
Tensile Strength (kpsi) ASTM D-882 A, 23°C 8.1, 7.5
Compressive Modulus (kpsi) ASTM D-695 A, 23°C 237
Flexural Modulus (kpsi) ASTM D-790 A, 23°C 357
Dielectric Breakdown (kV) ASTM D-149 D48/50 >45
Density (g/cm3) ASTM D-792 Method A A, 23°C 2.23
Water Absorption (%) MIL-S-13949H 3.7.7
IPC TM-650 2.6.2.2
E1/105 + D24/23 0.02
Coefficient of Thermal IPC TM-650 2.4.24 0°C to 100°C
Expansion (ppm/°C) Mettler 3000
X  Axis Thermomechanical 25
Y Axis Analyzer 34
Z Axis 252
Thermal Conductivity (W/mK) ASTM E-1225 100°C 0.261
Outgassing NASA SP-R-0022A 125°C, ≤ 10-6 torr
Total Mass Loss (%) Maximum 1.00% 0.01
Collected Volatile Maximum 0.10% 0.01
Condensable Material (%)
Water Vapor Regain (%) 0.01
Visible Condensate (±) NO
Flammability UL File E 80166 UL 94 Vertical Burn IPC TM-650 2.3.10 C48/23/50, E24/125 Meets requirements of UL94-V0



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