Rogers AD250C RF and Microwave PCB - 60mil (1.524mm) Substrate with Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
The Rogers AD250C RF and Microwave PCB is a double-layer high-frequency circuit board designed for demanding antenna and RF applications. Built on Rogers AD250C substrates with a dielectric constant of 2.50 ± 0.04 and a low dissipation factor of 0.0013, this PCB offers exceptional performance for high-frequency systems. The board is 60mil (1.524mm) thick with 1oz copper on both sides, featuring immersion gold on the pads for excellent solderability. Designed with a size of 90mm x 90mm, it is manufactured in compliance with IPC Class II standards and undergoes 100% electrical testing before shipment. Each order includes 25 boards vacuum-packed for secure delivery.
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PCB Specifications
| PCB SIZE | 90mm x 90mm=1 piece |
| BOARD TYPE | High Frequency PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | N/A |
| LAYER STACKUP | copper ------- 35um(1 oz)+plate top layer |
| AD250C 1.524mm | |
| copper ------- 35um(1 oz)+plate bot layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 80 mil |
| Minimum / Maximum Holes: | 1.0 mm / 2.8 mm |
| Number of Different Holes: | 2 |
| Number of Drill Holes: | 9 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | AD250C 1.524mm |
| Final foil external: | 2.0 oz |
| Final foil internal: | 2.0 oz |
| Final height of PCB: | 1.6 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold, 73.6% |
| Solder Mask Apply To: | Both sides |
| Solder Mask Color: | N/A |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | N/A |
| Colour of Component Legend | N/A |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated through hole(PTH), minimum size 1.0mm. |
| FLAMIBILITY RATING | 94V-0 |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Features & Benefits
1.Very Low Loss: PTFE and ceramic-filled composite with a loss tangent of 0.0014 at 10 GHz.
2.Controlled Dielectric Constant (Dk): 2.50 ± 0.04 for consistent signal integrity.
3.Low Profile Copper: Reduces conductive losses and improves antenna efficiency.
4.Low PIM Performance: Ideal for antenna applications, ensuring minimal signal distortion.
5.High Production Capacity: 16,000㎡ workshop with a monthly output of 30,000㎡ and 8,000 types of PCBs.
6.Certified Manufacturing: ISO9001, ISO14001, IATF16949, ISO13485, and UL certified.
7.High On-Time Delivery Rate: Over 98% on-time delivery.
8.Prototype to Volume Production: Capable of handling both prototype and large-scale production.
Typical Applications
1.Cellular Infrastructure Base Station Antennas
2.Automotive Telematics Antenna Systems
3.Commercial Satellite Radio Antennas
PCB Capability (2022)
| Parameter | Value |
| Layer Counts | 1-32 |
| Substrate Materials | RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; RT/duroid 5880LZ; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917; Nelco N4000, N9350, N9240; SCGA-500 GF220, SCGA-500 GF255, SCGA-500 GF265, SCGA-500 GF300; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc. |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t＜0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--350µm (1oz-10oz) |
| Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
| Drill Hole(Mechanical) | 0.0079" - 0.25" (0.2mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc. |