(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
The Shengyi SCGA-500 GF265 High Frequency PCB is a low-loss PTFE woven glass laminate designed for demanding RF and microwave applications. Manufactured by Shengyi Technology Co., Ltd (SYTECH), this material offers a controlled dielectric constant (Dk 2.55 ± 0.04) and a low dissipation factor (Df 0.0014) across a wide frequency range (1GHz to 20 GHz) and temperature range (-40°C to +125°C). SCGA-500 GF265 provides exceptional dimensional stability, chemical resistance, low moisture absorption, and high copper peel strength, making it an excellent choice for high-volume manufacturing where cost and performance are critical.
Features
1.Consistent and Stable Dk/Df: Maintains stable dielectric constant and dissipation factor across frequency and temperature.
2.Low Dielectric Loss Tangent: Ensures minimal signal loss for high-frequency applications.
3.Excellent Price-Performance Value: Balances cost and performance for high-volume production.
Typical Applications
Base Station Antennas
Power Amplifiers
Satellite Communications
DAS and CPE Antennas
Automotive Radar and Wireless Communications
PCB Capability (SCGA-500 GF265)
PCB Material: | PTFE Woven Glass |
Designation: | SCGA-500 GF265 |
Dielectric constant: | 2.65 (10 GHz) |
Dissipation factor | 0.0017 (10 GHz) |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 1oz (35µm), 2oz (70µm) |
Dielectric thickness | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 50mil (1.270mm), 60mil (1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Immersion gold ( ENIG), HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc.. |
Our Advantages
1.Certified Manufacturing: ISO9001, ISO14001, ISO13485, and UL certified.
2.Comprehensive PCB Capabilities: Supports R&D, sales, and marketing.
3.Any Layer HDI PCBs: Advanced technology for high-density interconnects.
4.Large Production Facility: 16,000㎡ workshop with a monthly output of 30,000㎡ and 8,000 types of PCBs.
5.19+ Years of Experience: Specializing in high-frequency PCB manufacturing.
6.Flexible Ordering:No minimum order quantity (MOQ); low-cost prototypes and small runs.
7.Prototype to Volume Production: Capable of handling both prototype and large-scale production.
8.High Reliability: On-time delivery rate >98%, customer complaint rate <1%.
9.Quality Standards: IPC Class 2 and IPC Class 3 compliant.
Appendix: Typical Values of RO4835
SCGA-500 General Properties | |||||||
Items | Typical Value GF220 | Typical Value GF255 | Typical Value GF265 | Typical Value GF300 | Unit | Method | Test Condition |
Dielectric Constant | 2.2±0.02 | 2.55±0.04 | 2.65±0.04 | 3.00±0.04 | - | IPC-TM-650 2.5.5.5 | 10GHz/23℃ |
Process Dk | |||||||
Dissipation factor (Loss Tangent) | 0.0009 | 0.0014 | 0.0017 | 0.0023 | - | IPC-TM-650 2.5.5.5 | 10GHz/23℃ |
TcDK | -110 | -70 | -60 | -25 | ppm/℃ | IEC 61189-2-721 | 10GHz (-40-150℃) |
CTE (X/Y/Z-axis) | 41/30/217 | 8.2/7.9/145 | 9.2/8.8/118 | 6.2/8.6/95 | ppm/℃ | IPC-TM-650 2.4.24 | TMA (30-260℃) |
Volume Resistivity | 1.5*108 | 1.5*108 | 1.2*108 | 1.3*108 | MΩ·cm | IPC-TM-650 2.5.17.1 | A |
Surface Resistivity | 8.8*107 | 1.6*108 | 1.3*108 | 1.4*108 | MΩ | IPC-TM-650 2.5.17.1 | A |
Peel Strength | 1.2 [6.86] | 1.2 [6.86] | 1.2 [6.86] | 1.2 [6.86] | N/mm [lb/in] | IPC-TM-650 2.4.8 | 288℃/10s |
Water Absorption | 0.007 | 0.007 | 0.007 | 0.01 | % | IPC-TM-650 2.6.2.1 | D-24/23 |
Thermal Conductivity | 0.27 | 0.29 | 0.28 | 0.28 | W/(m·K) | ASTM C518 | 100℃ |
Tensile Modulus (LW/CW) | 1.9/2.6 | 1.27/7.8 | 1.9/6.8 | 7.9/8.8 | GPa | IPC-TM-650 2.4.4 | A |
Tensile Strength (LW/CW) | 60/76 | 64/214 | 60/212 | 254/279 | MPa | IPC-TM-650 2.4.4 | A |
Density | 2.18 | 2.25 | 2.22 | 2.27 | g/cm3 | ASTM D792 | - |
Flammability | V-0 | V-0 | V-0 | V-0 | Rating | UL-94 | C-48/23/50 |