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Shengyi SCGA-500 GF265 PTFE-High Frequency PCB with Glass Reinforced RF Circuit Materials

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Brief Introduction

The Shengyi SCGA-500 GF265 High Frequency PCB is a low-loss PTFE woven glass laminate designed for demanding RF and microwave applications. Manufactured by Shengyi Technology Co., Ltd (SYTECH), this material offers a controlled dielectric constant (Dk 2.55 ± 0.04) and a low dissipation factor (Df 0.0014) across a wide frequency range (1GHz to 20 GHz) and temperature range (-40°C to +125°C). SCGA-500 GF265 provides exceptional dimensional stability, chemical resistance, low moisture absorption, and high copper peel strength, making it an excellent choice for high-volume manufacturing where cost and performance are critical.



Features

1.Consistent and Stable Dk/Df: Maintains stable dielectric constant and dissipation factor across frequency and temperature.
2.Low Dielectric Loss Tangent: Ensures minimal signal loss for high-frequency applications. 3.Excellent Price-Performance Value: Balances cost and performance for high-volume production.


Typical Applications

Base Station Antennas
Power Amplifiers
Satellite Communications
DAS and CPE Antennas
Automotive Radar and Wireless Communications


PCB Capability (SCGA-500 GF265)

PCB Material: PTFE Woven Glass
Designation: SCGA-500 GF265
Dielectric constant: 2.65  (10 GHz)
Dissipation factor 0.0017 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm),  40mil (1.016mm), 50mil (1.270mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold ( ENIG), HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc..

Our Advantages

1.Certified Manufacturing: ISO9001, ISO14001, ISO13485, and UL certified.
2.Comprehensive PCB Capabilities: Supports R&D, sales, and marketing.
3.Any Layer HDI PCBs: Advanced technology for high-density interconnects.
4.Large Production Facility: 16,000㎡ workshop with a monthly output of 30,000㎡ and 8,000 types of PCBs.
5.19+ Years of Experience: Specializing in high-frequency PCB manufacturing.
6.Flexible Ordering:No minimum order quantity (MOQ); low-cost prototypes and small runs.
7.Prototype to Volume Production: Capable of handling both prototype and large-scale production.
8.High Reliability: On-time delivery rate >98%, customer complaint rate <1%.
9.Quality Standards: IPC Class 2 and IPC Class 3 compliant.


Appendix: Typical Values of RO4835

Click to expand/collapse the table

SCGA-500 General Properties
Items Typical Value GF220 Typical Value GF255 Typical Value GF265 Typical Value GF300 Unit Method Test Condition
Dielectric Constant 2.2±0.02 2.55±0.04 2.65±0.04 3.00±0.04 - IPC-TM-650 2.5.5.5 10GHz/23℃
Process Dk
Dissipation factor (Loss Tangent) 0.0009 0.0014 0.0017 0.0023 - IPC-TM-650 2.5.5.5 10GHz/23℃
TcDK -110 -70 -60 -25 ppm/℃ IEC 61189-2-721 10GHz (-40-150℃)
CTE (X/Y/Z-axis) 41/30/217 8.2/7.9/145 9.2/8.8/118 6.2/8.6/95 ppm/℃ IPC-TM-650 2.4.24 TMA (30-260℃)
Volume Resistivity 1.5*108 1.5*108 1.2*108 1.3*108 MΩ·cm IPC-TM-650 2.5.17.1 A
Surface Resistivity 8.8*107 1.6*108 1.3*108 1.4*108 IPC-TM-650 2.5.17.1 A
Peel Strength 1.2 [6.86] 1.2 [6.86] 1.2 [6.86] 1.2 [6.86] N/mm [lb/in] IPC-TM-650 2.4.8 288℃/10s
Water Absorption 0.007 0.007 0.007 0.01 % IPC-TM-650 2.6.2.1 D-24/23
Thermal Conductivity 0.27 0.29 0.28 0.28 W/(m·K) ASTM C518 100℃
Tensile Modulus (LW/CW) 1.9/2.6 1.27/7.8 1.9/6.8 7.9/8.8 GPa IPC-TM-650 2.4.4 A
Tensile Strength (LW/CW) 60/76 64/214 60/212 254/279 MPa IPC-TM-650 2.4.4 A
Density 2.18 2.25 2.22 2.27 g/cm3 ASTM D792 -
Flammability V-0 V-0 V-0 V-0 Rating UL-94 C-48/23/50


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