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Home > High Speed PCB > Rogers RO3003 High Frequency Printed Circuit Board 2-Layer Rogers 3003 30mil 0.762mm PCB with DK3.0 DF 0.001
Rogers RO3003 High Frequency Printed Circuit Board 2-Layer Rogers 3003 30mil 0.762mm PCB with DK3.0 DF 0.001

(Note: Printed Circuit Boards (PCBs) are custom-made products; images and specifications provided are for reference only.)


Overview of Rogers RO3003 High Frequency Materials

The Rogers RO3003 high frequency circuit materials are composed of ceramic-filled PTFE composites, specifically designed for commercial microwave and RF applications. This material is engineered to provide exceptional electrical and mechanical stability at competitive prices. Its consistent mechanical properties enable designers to create multi-layer board configurations without concerns about warpage or reliability issues.


The RO3003 materials feature a coefficient of thermal expansion (CTE) of 17 ppm/℃ in both the X and Y axes, closely matching that of copper. This compatibility ensures excellent dimensional stability, with typical etch shrinkage after processing being less than 0.5 mils per inch. Additionally, the Z-axis CTE is 24 ppm/℃, which guarantees reliable plated through-hole performance, even in challenging environments.


Typical Applications

  1. 1.Automotive radar systems
  2. 2.Cellular telecommunications networks
  3. 3.Datalink over cable systems
  4. 4.Direct broadcast satellite technology
  5. 5.Global Positioning System (GPS) antennas
  6. 6.Patch antennas for wireless communication
  7. 7.Power amplifiers and antennas
  8. 8.Power backplanes
  9. 9.Remote meter reading devices


PCB Specifications

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Rogers RO3003 30mil 0.762mm High Frequency PCB DK3.0 RF PCB for Cellular Telecommunications Systems

PCB SIZE

81 x 45mm=1PCS

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

NO

LAYER STACKUP

copper ------- 18um(0.5 oz)+plate TOP layer

RO3003 0.762mm

copper ------- 18um(0.5oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

5 mil / 5 mil

Minimum / Maximum Holes:

0.5mm / 2.0mm

Number of Different Holes:

1

Number of Drill Holes:

1

Number of Milled Slots:

0

Number of Internal Cutouts:

0

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

RO3003 0.762mm

Final foil external:

1oz

Final foil internal:

N/A

Final height of PCB:

0.8 mm ±0.1

PLATING AND COATING

 

Surface Finish

Immersion gold (31%)

Solder Mask Apply To:

NO

Solder Mask Color:

N/A

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

Top Side

Colour of Component Legend

Black

Manufacturer Name or Logo:

Marked on the board in a conductor and legend FREE AREA

VIA

N/A

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.



Data Sheet for Rogers 3003 (RO3003)

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 RO3003 Typical Value

Property

RO3003

Direction

Units

Condition

Test Method

Electrical Properties

 

 

 

 

 

Dielectric Constant,εProcess

3.0±0.04

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

3

Z

 

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.001

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

-3

Z

ppm/℃

10 GHz -50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

107

 

MΩ.cm

COND A

IPC 2.5.17.1

Surface Resistivity

107

 

MΩ

COND A

IPC 2.5.17.1

Thermal Properties

 

 

 

 

 

Td

500

 

℃ TGA

 

ASTM D 3850

Coefficient of Thermal Expansion
(-55 to 288℃)

17
16
25

X
Y
Z

ppm/℃

23℃/50% RH

IPC-TM-650 2.4.4.1

Thermal Conductivity

0.5

 

W/M/K

50℃

ASTM D 5470

Mechanical Properties

 

 

 

 

 

Copper Peel Stength

12.7

 

Ib/in.

1oz,EDC After Solder Float

IPC-TM 2.4.8

Young's Modulus

930
823

X
Y

MPa

23℃

ASTM D 638

Dimensional Stability

-0.06
0.07

X
Y

mm/m

COND A

IPC-TM-650 2.2.4

Physical Properties

 

 

 

 

 

Flammability

V-0

 

 

 

UL 94

Moisture Absorption

0.04

 

%

D48/50

IPC-TM-650 2.6.2.1

Density

2.1

 

gm/cm3

23℃

ASTM D 792

Specific Heat

0.9

 

j/g/k

 

Calculated

Lead-free Process Compatible

Yes

 

 

 



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