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RT/Duroid 5880 20mil (0.508mm) Rogers High Frequency PCB for Radar Systems

(Note: Printed Circuit Boards are customized products. The images and specifications provided are for reference only.)


Overview of Rogers RT/Duroid 5880 Material

Rogers RT/Duroid 5880 is a high-frequency material made from glass microfiber reinforced PTFE composites, specifically designed for demanding stripline and microstrip circuit applications. The unique structure ensures exceptional dielectric constant uniformity due to randomly oriented microfibers. This dielectric constant remains consistent across panels and stable over a broad frequency range.


General Description

This is a double-sided RF PCB built on RT/Duroid 5880, specifically designed for radar system applications.


Key Benefits

1.Low Dissipation Factor: The low dissipation factor of RT/Duroid 5880 enhances its usability in Ku-band applications and beyond.
2.Machinability: The materials can be easily cut, sheared, and machined into various shapes.
3.Chemical Resistance: RT/Duroid 5880 is resistant to all solvents and reagents, hot or cold, typically used in etching printed circuits or plating edges and holes.



Basic Specifications

Basic Specifications Description
Base Material RT/Duroid 5880, 20mil (0.508mm)
Dielectric Constant 2.20 ± 0.02
Layer Count 2 layers
Type Through holes
Format 128mm x 62mm (1 type = 1 piece)
Surface Finish Immersion gold
Copper Weight Outer layer 35 μm
Solder Mask / Legend No / No
Final PCB Height 0.52 mm
Standard IPC 6012 Class 2
Packing 20 panels per shipment
Lead Time 7 working days
Shelf Life 6 months

Typical Applications

*Commercial airline broadband antennas
*Microstrip circuits
*Stripline circuits
*Millimeter wave applications
*Military radar systems
*Missile guidance systems
*Point-to-point digital radio antennas



Data Sheet for Rogers RT/Duroid 5880

Click to expand/collapse the table

RT/duroid 5880 Typical Value

Property

RT/duroid 5880

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

2.20
2.20±0.02 spec.

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Dielectric Constant,εDesign

2.2

Z

N/A

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.0004
0.0009

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Thermal Coefficient of ε

-125

Z

ppm/℃

-50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

2 x 107

Z

Mohm cm

C/96/35/90

ASTM D 257

Surface Resistivity

3 x 107

Z

Mohm

C/96/35/90

ASTM D 257

Specific Heat

0.96(0.23）

N/A

j/g/k
(cal/g/c)

N/A

Calculated

Tensile Modulus

Test at 23℃

Test at 100℃

N/A

MPa(kpsi)

A

ASTM D 638

1070(156)

450(65)

X

860(125)

380(55)

Y

Ultimate Stress

29(4.2)

20(2.9)

X

27(3.9）

18(2.6)

Y

Ultimate Strain

6

7.2

X

%

4.9

5.8

Y

Compressive Modulus

710(103)

500(73)

X

MPa(kpsi)

A

ASTM D 695

710(103)

500(73)

Y

940(136)

670(97)

Z

Ultimate Stress

27(3.9)

22(3.2)

X

29(5.3)

21(3.1)

Y

52(7.5)

43(6.3)

Z

Ultimate Strain

8.5

8.4

X

%

7.7

7.8

Y

12.5

17.6

Z

Moisture Absorption

0.02

N/A

%

0.62"(1.6mm) D48/50

ASTM D 570

Thermal Conductivity

0.2

Z

W/m/k

80℃

ASTM C 518

Coefficient of Thermal Expansion

31
48
237

X
Y
Z

ppm/℃

0-100℃

IPC-TM-650 2.4.41

Td

500

N/A

℃ TGA

N/A

ASTM D 3850

Density

2.2

N/A

gm/cm3

N/A

ASTM D 792

Copper Peel

31.2(5.5)

N/A

Pli(N/mm)

1oz(35mm)EDC foil
after solder float

IPC-TM-650 2.4.8

Flammability

V-0

N/A

N/A

N/A

UL 94

Lead-free Process Compatible

Yes

N/A

N/A

N/A

N/A



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