Home > Rogers PCB > Rogers RO3003 High Frequency Printed Circuit Board Rogers DK3.0 GPS Antenna RF PCB 10mil, 20mil, 30mil and 60mil Thick Coating Immersion Gold
Rogers RO3003 High Frequency Printed Circuit Board Rogers DK3.0 GPS Antenna RF PCB 10mil, 20mil, 30mil and 60mil Thick Coating Immersion Gold

(PCB's are customized products, the pictures and parameters shown are for reference only)


Introduction to RO3003 High Frequency PCBs

The RO3003 high frequency circuit laminates are crafted from ceramic-filled PTFE composites, making them ideal for commercial microwave and RF applications. These materials deliver exceptional electrical performance and stable mechanical properties. Designers can confidently create multi-layer board designs without concerns about warpage or reliability issues.


Key Features and Applications

Features

  1. 1.Low Dielectric Loss: With a dissipation factor (DF) of 0.001, RO3003 can be utilized in applications up to 77 GHz.
  2. 2.Stable Dielectric Constant: This material maintains a consistent dielectric constant across temperature and frequency, making it perfect for band pass filters, microstrip patch antennas, and voltage-controlled oscillators.
  3. 3.Excellent Mechanical Properties: The RO3003 offers reliable performance for stripline and multi-layer board constructions at varying temperatures.
  4. 4.Uniform Mechanical Properties: Suitable for epoxy glass multi-layer board hybrid designs.
  5. 5.Low In-Plane Expansion: The match to copper ensures more reliable surface-mounted assemblies, ideal for temperature-sensitive applications with excellent dimensional stability.


PCB Capabilities (RO3003)

Click to expand/collapse the table

PCB Material

Ceramic-filled PTFE composite

Designator

RO3003

Dielectric Constant

3.0 ±0.04 (process), 3.0 (design)

Layer Count

1 Layer, 2 Layer, Multi-layer, Hybrid PCB

Copper Weight

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

PCB Thickness

10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)

PCB Size

≤ 400mm x 500mm

Solder Mask

Available in Green, Black, Blue, Yellow, Red, etc.

Surface Finish

Options include Bare Copper, HASL, ENIG, OSP, etc.

The RO3003 high frequency PCBs come in double-sided, multi-layer, and hybrid constructions, with copper weights ranging from 0.5oz to 2oz and thicknesses from 0.3mm to 1.6mm. The maximum size available is 400mm x 500mm, with surface finishes including bare copper, hot air leveling, and immersion gold.


Typical Applications

  • Automotive radar systems
  • GPS antennas
  • Power amplifiers and antennas
  • Patch antennas for wireless communication
  • Direct broadcast satellite systems

The basic color of the RO3003 PCB is white. Its manufacturing process is similar to standard PTFE PCBs, making it suitable for high-volume production, thus providing a competitive edge in the market.



Conclusion

If you have any questions or need further information, please don’t hesitate to contact us.


Thank you for reading!


Appendix: Data Sheet of RO3003

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 RO3003 Typical Value

Property

RO3003

Direction

Units

Condition

Test Method

Electrical Properties

 

 

 

 

 

Dielectric Constant,εProcess

3.0±0.04

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

3

Z

 

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.001

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

-3

Z

ppm/℃

10 GHz -50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

107

 

MΩ.cm

COND A

IPC 2.5.17.1

Surface Resistivity

107

 

COND A

IPC 2.5.17.1

Thermal Properties

 

 

 

 

 

Td

500

 

℃ TGA

 

ASTM D 3850

Coefficient of Thermal Expansion
(-55 to 288℃)

17
16
25

X
Y
Z

ppm/℃

23℃/50% RH

IPC-TM-650 2.4.4.1

Thermal Conductivity

0.5

 

W/M/K

50℃

ASTM D 5470

Mechanical Properties

 

 

 

 

 

Copper Peel Stength

12.7

 

Ib/in.

1oz,EDC After Solder Float

IPC-TM 2.4.8

Young's Modulus

930
823

X
Y

MPa

23℃

ASTM D 638

Dimensional Stability

-0.06
0.07

X
Y

mm/m

COND A

IPC-TM-650 2.2.4

Physical Properties

 

 

 

 

 

Flammability

V-0

 

 

 

UL 94

Moisture Absorption

0.04

 

%

D48/50

IPC-TM-650 2.6.2.1

Density

2.1

 

gm/cm3

23℃

ASTM D 792

Specific Heat

0.9

 

j/g/k

 

Calculated

Lead-free Process Compatible

Yes

 

 

 



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