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Rogers RT/Duroid 5880 62mil 1.575mm High Frequency PCB for Commercial Aireline Broadband Antennas

(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)


Overview

Rogers RT/Duroid 5880 is a premium-quality printed circuit board (PCB) designed specifically for high-frequency applications, ideal for commercial airline broadband antennas.


Material Composition

The Rogers RT/Duroid 5880 is composed of glass microfiber-reinforced PTFE composites, expertly engineered for demanding microstrip and stripline circuit applications. Its remarkable dielectric constant uniformity is achieved through the use of randomly oriented microfibers. This ensures that the dielectric constant remains consistent across different panels and stable over a broad frequency range. Additionally, the low dissipation factor of RT/Duroid 5880 makes it suitable for use in Ku-band frequencies and beyond.


Key Features

1.Custom Machinability: RT/Duroid 5880 materials can be easily cut, sheared, and machined to fit various shapes.

2.Chemical Resistance: These PCBs are resistant to all solvents and reagents, whether hot or cold, commonly used in the etching of printed circuits or in plating processes.


Typical Applications

Rogers RT/Duroid 5880 is widely utilized in various applications, including:

  • Commercial airline broadband antennas
  • Microstrip and stripline circuits
  • Millimeter-wave applications
  • Military radar systems
  • Missile guidance systems
  • Point-to-point digital radio antennas


PCB Specifications

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Rogers RT/Duroid 5880 62mil 1.575mm High Frequency PCB for Commercial Aireline Broadband Antennas

 

 

PCB SIZE

135 x 95mm=1PCS

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

YES

LAYER STACKUP

copper ------- 35µm(1 oz)+plate TOP layer

RT/duroid 5880 1.575mm

copper ------- 35µm(1oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

8 mil / 7 mil

Minimum / Maximum Holes:

0.4 mm / 4.5 mm

Number of Different Holes:

4

Number of Drill Holes:

87

Number of Milled Slots:

0

Number of Internal Cutouts:

0

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

RT/duroid 5880 1.575mm

Final foil external:

1.0 oz

Final foil internal:

N/A

Final height of PCB:

1.6 mm ±0.16

PLATING AND COATING

 

Surface Finish

Immersion gold

Solder Mask Apply To:

N/A

Solder Mask Color:

N/A

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

N/A

Colour of Component Legend

N/A

Manufacturer Name or Logo:

N/A

VIA

Plated through hole(PTH), minimum size 0.4mm.

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.



Data Sheet of Rogers 5880 (RT/duroid 5880)

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RT/duroid 5880 Typical Value

Property

RT/duroid 5880

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

2.20
2.20±0.02 spec.

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Dielectric Constant,εDesign

2.2

Z

N/A

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.0004
0.0009

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Thermal Coefficient of ε

-125

Z

ppm/℃

-50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

2 x 107

Z

Mohm cm

C/96/35/90

ASTM D 257

Surface Resistivity

3 x 107

Z

Mohm

C/96/35/90

ASTM D 257

Specific Heat

0.96(0.23）

N/A

j/g/k
(cal/g/c)

N/A

Calculated

Tensile Modulus

Test at 23℃

Test at 100℃

N/A

MPa(kpsi)

A

ASTM D 638

1070(156)

450(65)

X

860(125)

380(55)

Y

Ultimate Stress

29(4.2)

20(2.9)

X

27(3.9）

18(2.6)

Y

Ultimate Strain

6

7.2

X

%

4.9

5.8

Y

Compressive Modulus

710(103)

500(73)

X

MPa(kpsi)

A

ASTM D 695

710(103)

500(73)

Y

940(136)

670(97)

Z

Ultimate Stress

27(3.9)

22(3.2)

X

29(5.3)

21(3.1)

Y

52(7.5)

43(6.3)

Z

Ultimate Strain

8.5

8.4

X

%

7.7

7.8

Y

12.5

17.6

Z

Moisture Absorption

0.02

N/A

%

0.62"(1.6mm) D48/50

ASTM D 570

Thermal Conductivity

0.2

Z

W/m/k

80℃

ASTM C 518

Coefficient of Thermal Expansion

31
48
237

X
Y
Z

ppm/℃

0-100℃

IPC-TM-650 2.4.41

Td

500

N/A

℃ TGA

N/A

ASTM D 3850

Density

2.2

N/A

gm/cm3

N/A

ASTM D 792

Copper Peel

31.2(5.5)

N/A

Pli(N/mm)

1oz(35mm)EDC foil
after solder float

IPC-TM-650 2.4.8

Flammability

V-0

N/A

N/A

N/A

UL 94

Lead-free Process Compatible

Yes

N/A

N/A

N/A

N/A