Home > Low Loss PCB > Rogers RO3006 RF Printed Circuit Board 2-Layer Rogers 3006 50mil 1.27mm Microwave PCB with Immersion Gold
Rogers RO3006 RF Printed Circuit Board 2-Layer Rogers 3006 50mil 1.27mm Microwave PCB with Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Overview of Rogers RO3006 High Frequency Circuit Materials

Rogers RO3006 is a microwave printed circuit board material featuring an immersion gold finish. This ceramic-filled PTFE composite is designed for commercial microwave and RF applications, delivering exceptional electrical and mechanical stability at competitive prices.


The Advantages of Rogers RO3006:

*Consistent mechanical properties, enabling reliable multi-layer board designs without warpages or reliability issues
*Coefficient of thermal expansion (CTE) in the X and Y axis matched to that of copper, providing excellent dimensional stability with typical etch shrinkage of less than 0.5 mils per inch
*Z-axis CTE of 24 ppm/°C, ensuring exceptional plated through-hole reliability even in severe environments


Versatile Applications for Your High-Frequency Needs:

1.Automotive radar
2.Cellular telecommunications systems
3.Datalink on cable systems
4.Direct broadcast satellites
5.Global positioning satellite antennas
6.Patch antennas for wireless communications
7.Power amplifiers and antennas
8.Power backplanes
9.Remote meter readers



PCB Specifications

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Rogers RO3006 50mil 1.270mm High Frequency PCB DK6.15 RF PCB Board for Power Backplanes

PCB SIZE

98 x 98mm=1PCS

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

YES

LAYER STACKUP

copper ------- 18um(0.5 oz)+plate TOP layer

RO3006 1.270mm

copper ------- 18um(0.5 oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

4 mil / 4 mil

Minimum / Maximum Holes:

0.3mm / 2.2mm

Number of Different Holes:

n/a

Number of Drill Holes:

n/a

Number of Milled Slots:

0

Number of Internal Cutouts:

0

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

RO3006 1.270mm

Final foil external:

1 oz

Final foil internal:

N/A

Final height of PCB:

1.4 mm ±0.14mm

PLATING AND COATING

 

Surface Finish

Immersion Gold

Solder Mask Apply To:

Bottom, 12micron Minimum

Solder Mask Color:

Green, PSR-2000GT600D, Taiyo Supplied.

Solder Mask Type:

LPSM

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

Bottom

Colour of Component Legend

White, IJR-4000 MW300, Taiyo brand

Manufacturer Name or Logo:

Marked on the board in a conductor and leged FREE AREA

VIA

N/A

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.



Data Sheet for Rogers 3006 (RO3006)

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RO3006 Typical Value

Property

RO3006

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

6.15±0.05

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

6.5

Z

 

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.002

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

-262

Z

ppm/℃

10 GHz -50℃to 150℃

IPC-TM-650 2.5.5.5

Dimensional Stability

0.27
0.15

X
Y

mm/m

COND A

IPC-TM-650 2.2.4

Volume Resistivity

105

 

MΩ.cm

COND A

IPC 2.5.17.1

Surface Resistivity

105

 

COND A

IPC 2.5.17.1

Tensile Modulus

1498
1293

X
Y

MPa

23℃

ASTM D 638

Moisture Absorption

0.02

 

%

D48/50

IPC-TM-650 2.6.2.1

Specific Heat

0.86

 

j/g/k

 

Calculated

Thermal Conductivity

0.79

 

W/M/K

50℃

ASTM D 5470

Coefficient of Thermal Expansion
(-55 to 288℃)

17
17
24

X
Y
Z

ppm/℃

23℃/50% RH

IPC-TM-650 2.4.4.1

Td

500

 

℃ TGA

 

ASTM D 3850

Density

2.6

 

gm/cm3

23℃

ASTM D 792

Copper Peel Stength

7.1

 

Ib/in.

1oz,EDC After Solder Float

IPC-TM 2.4.8

Flammability

V-0

 

 

 

UL 94

Lead-free Process Compatible

Yes

 

 

 



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