(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Overview of Rogers RO3006 High Frequency Circuit Materials
Rogers RO3006 is a microwave printed circuit board material featuring an immersion gold finish. This ceramic-filled PTFE composite is designed for commercial microwave and RF applications, delivering exceptional electrical and mechanical stability at competitive prices.
The Advantages of Rogers RO3006:
*Consistent mechanical properties, enabling reliable multi-layer board designs without warpages or reliability issues
*Coefficient of thermal expansion (CTE) in the X and Y axis matched to that of copper, providing excellent dimensional stability with typical etch shrinkage of less than 0.5 mils per inch
*Z-axis CTE of 24 ppm/°C, ensuring exceptional plated through-hole reliability even in severe environments
Versatile Applications for Your High-Frequency Needs:
1.Automotive radar
2.Cellular telecommunications systems
3.Datalink on cable systems
4.Direct broadcast satellites
5.Global positioning satellite antennas
6.Patch antennas for wireless communications
7.Power amplifiers and antennas
8.Power backplanes
9.Remote meter readers
PCB Specifications
Rogers RO3006 50mil 1.270mm High Frequency PCB DK6.15 RF PCB Board for Power Backplanes |
|
PCB SIZE |
98 x 98mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
RO3006 1.270mm |
|
copper ------- 18um(0.5 oz) + plate BOT Layer |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
4 mil / 4 mil |
Minimum / Maximum Holes: |
0.3mm / 2.2mm |
Number of Different Holes: |
n/a |
Number of Drill Holes: |
n/a |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
RO3006 1.270mm |
Final foil external: |
1 oz |
Final foil internal: |
N/A |
Final height of PCB: |
1.4 mm ±0.14mm |
PLATING AND COATING |
|
Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
Bottom, 12micron Minimum |
Solder Mask Color: |
Green, PSR-2000GT600D, Taiyo Supplied. |
Solder Mask Type: |
LPSM |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
Bottom |
Colour of Component Legend |
White, IJR-4000 MW300, Taiyo brand |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
N/A |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
Data Sheet for Rogers 3006 (RO3006)
RO3006 Typical Value |
|||||
Property |
RO3006 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
6.15±0.05 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
6.5 |
Z |
|
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.002 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
-262 |
Z |
ppm/℃ |
10 GHz -50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Dimensional Stability |
0.27 |
X |
mm/m |
COND A |
IPC-TM-650 2.2.4 |
Volume Resistivity |
105 |
|
MΩ.cm |
COND A |
IPC 2.5.17.1 |
Surface Resistivity |
105 |
|
MΩ |
COND A |
IPC 2.5.17.1 |
Tensile Modulus |
1498 |
X |
MPa |
23℃ |
ASTM D 638 |
Moisture Absorption |
0.02 |
|
% |
D48/50 |
IPC-TM-650 2.6.2.1 |
Specific Heat |
0.86 |
|
j/g/k |
|
Calculated |
Thermal Conductivity |
0.79 |
|
W/M/K |
50℃ |
ASTM D 5470 |
Coefficient of Thermal Expansion |
17 |
X |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.4.1 |
Td |
500 |
|
℃ TGA |
|
ASTM D 3850 |
Density |
2.6 |
|
gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
7.1 |
|
Ib/in. |
1oz,EDC After Solder Float |
IPC-TM 2.4.8 |
Flammability |
V-0 |
|
|
|
UL 94 |
Lead-free Process Compatible |
Yes |
|
|
|
|