Rogers RF PCB Built on RO3210 25mil (0.635mm) DK10.2 with Immersion Gold for Automotive Collision Avoidance Systems
(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)
Rogers RO3210 high-frequency circuit materials consist of ceramic-filled laminates reinforced with woven fiberglass. These materials are specifically engineered to provide outstanding electrical performance and mechanical stability. The RO3210 laminates feature the surface smoothness typically associated with non-woven PTFE laminates.
Due to their compatibility with standard PTFE circuit board processing techniques, these materials can be efficiently produced in mass quantities, resulting in competitive pricing in the marketplace. The RO3210 substrate has a dielectric constant of 10.2 and a low dissipation factor of 0.0027.
Typical Applications:
1.Automotive Collision Avoidance Systems
2.Automotive Global Positioning Satellite Antennas
3.Base Station Infrastructure
4.Datalink on Cable Systems
5.Direct Broadcast Satellite
6.LMDS and Wireless Broadband
7.Microstrip Patch Antennas for Wireless Communications
8.Power Backplanes
9.Remote Meter Readers
10.Wireless Telecommunications Systems
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Our PCB Capabilities:
Rogers RO3210 25mil 0.635mm High Frequency PCB for Automotive Collision Avoidance Systems |
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PCB SIZE |
35 x 77 mm=2 designs = 2PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
RO3210 0.635mm |
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copper ------- 18um(0.5 oz)+plate BOT layer |
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TECHNOLOGY |
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Minimum Trace and Space: |
6 mil / 6 mil |
Minimum / Maximum Holes: |
0.3 mm / 5.6 mm |
Number of Different Holes: |
2 |
Number of Drill Holes: |
182 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
RO3210 0.635mm |
Final foil external: |
1 oz |
Final foil internal: |
1 oz |
Final height of PCB: |
0.8 mm ±0.08 |
PLATING AND COATING |
|
Surface Finish |
Immersion gold (23.3% ) 0.05µm over 3µm nickel |
Solder Mask Apply To: |
TOP and Bottom, 12micron Minimum |
Solder Mask Color: |
Green, PSR-2000GT600D, Taiyo Supplied. |
Solder Mask Type: |
LPSM |
CONTOUR/CUTTING |
Routing, v-cut |
MARKING |
|
Side of Component Legend |
TOP and Bottom. |
Colour of Component Legend |
White, IJR-4000 MW300, Taiyo brand |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
Plated through hole(PTH), minimum size 0.3mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Data Sheet of RO3210
Property |
Typical Value RO3210 |
Direction |
Unit |
Condition |
Test Method |
Dielectric Constant, er Process |
10.2± 0.50 |
Z |
- |
10 GHz 23°C |
IPC-TM-650 2.5.5.5 |
Dielectric Constant, er Design |
10.8 |
Z |
- |
8 GHz - 40 GHz |
Differential Phase Length Method |
Dissipation Factor, tan d |
0.0027 |
Z |
- |
10 GHz 23°C |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of er |
-459 |
Z |
ppm/°C |
10 GHz 0-100°C |
IPC-TM-650 2.5.5.5 |
Dimensional Stability |
0.8 |
X,Y |
mm/m |
COND A |
ASTM D257 |
Volume Resistivity |
103 |
|
MW•cm |
COND A |
IPC 2.5.17.1 |
Surface Resistivity |
103 |
|
MW |
COND A |
IPC 2.5.17.1 |
Tensile Modulus |
579 |
MD CMD |
kpsi |
23°C |
ASTM D638 |
Water Absorption |
<0.1 |
- |
% |
D24/23 |
IPC-TM-650 2.6.2.1 |
Specific Heat |
0.79 |
|
J/g/K |
|
Calculated |
Thermal Conductivity |
0.81 |
- |
W/m/K |
80°C |
ASTM C518 |
Coefficient of Thermal Expansion (-55 to 288 °C) |
13 |
X,Y, Z |
ppm/°C |
23°C/50% RH |
IPC-TM-650 2.4.41 |
Td |
500 |
|
°C |
TGA |
ASTM D3850 |
Color |
Off White |
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|
|
Density |
3.0 |
|
gm/cm3 |
|
|
Copper Peel Strength |
11.0 |
|
pli |
1 oz. EDC |
IPC-TM-2.4.8 |
Flammability |
V-0 |
|
|
|
UL 94 |
Lead Free Process Compatible |
YES |
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