Rogers RO3010 Microwave PCB Board 2-Layer Rogers 3010 25mil 0.635mm Circuit Board DK10.2 DF 0.0022 High Frequency PCB
(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)
Overview:
Rogers RO3010 high-frequency circuit materials are ceramic-filled PTFE composites specifically designed for commercial microwave and RF applications. These materials provide exceptional electrical performance and mechanical stability at competitive prices. Their consistent mechanical properties enable designers to create multi-layer board designs without facing warpage or reliability issues.
The RO3010 materials feature a coefficient of thermal expansion (CTE) of 17 ppm/℃ in both the X and Y axes, perfectly matched to that of copper. This compatibility ensures excellent dimensional stability, with typical etch shrinkage after etch and bake measuring less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, ensuring exceptional reliability for plated through-holes, even in extreme environments.
Typical Applications
Automotive radar
Cellular telecommunications systems
Datalink on cable systems
Direct broadcast satellites
Global positioning satellite antennas
Patch antennas for wireless communications
Power amplifiers and antennas
Power backplanes
Remote meter readers
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PCB Specifications:
Rogers RO3010 25mil 0.635mm High Frequency PCB RF PCB for Patch Antenna for Wireless Communications |
|
PCB SIZE |
100 x 100mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
RO3010 0.635mm |
|
copper ------- 18um(0.5 oz) + plate BOT Layer |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
6 mil / 6 mil |
Minimum / Maximum Holes: |
0.3mm / 1.5mm |
Number of Different Holes: |
n/a |
Number of Drill Holes: |
n/a |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
RO3010 0.635mm |
Final foil external: |
1oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.8 mm ±0.1mm |
PLATING AND COATING |
|
Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
Bottom, 12micron Minimum |
Solder Mask Color: |
Green, PSR-2000GT600D, Taiyo Supplied. |
Solder Mask Type: |
LPSM |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
Bottom |
Colour of Component Legend |
White, IJR-4000 MW300, Taiyo brand |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
N/A |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
For any inquiries or further information, please feel free to contact us.
Data Sheet of Rogers 3010 (RO3010)
RO3010 Typical Value |
|||||
Property |
RO3010 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
10.2±0.05 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
11.2 |
Z |
|
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.0022 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
-395 |
Z |
ppm/℃ |
10 GHz -50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Dimensional Stability |
0.35 |
X |
mm/m |
COND A |
IPC-TM-650 2.2.4 |
Volume Resistivity |
105 |
|
MΩ.cm |
COND A |
IPC 2.5.17.1 |
Surface Resistivity |
105 |
|
MΩ |
COND A |
IPC 2.5.17.1 |
Tensile Modulus |
1902 |
X |
MPa |
23℃ |
ASTM D 638 |
Moisture Absorption |
0.05 |
|
% |
D48/50 |
IPC-TM-650 2.6.2.1 |
Specific Heat |
0.8 |
|
j/g/k |
|
Calculated |
Thermal Conductivity |
0.95 |
|
W/M/K |
50℃ |
ASTM D 5470 |
Coefficient of Thermal Expansion |
13 |
X |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.4.1 |
Td |
500 |
|
℃ TGA |
|
ASTM D 3850 |
Density |
2.8 |
|
gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
9.4 |
|
Ib/in. |
1oz,EDC After Solder Float |
IPC-TM 2.4.8 |
Flammability |
V-0 |
|
|
|
UL 94 |
Lead-free Process Compatible |
Yes |
|
|
|
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