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Rogers RO4003C 12mil 0.305mm High Frequency PCB Double-Sided RF PCB for Antennas

(Note: Printed Circuit Boards (PCBs) are custom-made products. The images and specifications provided are for reference purposes only.)


Overview of RO4003C Material

RO4003C hydrocarbon ceramic laminates are engineered to deliver outstanding high-frequency performance while ensuring cost-effective circuit fabrication. When operational frequencies reach 500 MHz and higher, the options for laminate materials available to designers become significantly limited. The RO4003C material has been specifically developed to meet the stringent requirements of RF microwave circuits, matching networks, and controlled impedance transmission lines. Its low dielectric loss makes it suitable for various applications where conventional circuit board materials fall short due to high-frequency limitations.



RO4300C PCB Characteristics


The temperature coefficient of dielectric constant for RO4003C is among the lowest available in circuit board materials. Additionally, the dielectric constant remains stable across a wide frequency spectrum. One of the key advantages of RO4003C is its thermal coefficient of expansion (CTE), which is comparable to that of copper, resulting in excellent dimensional stability. This property is essential for the construction of mixed-dielectric multi-layer boards. The low Z-axis CTE ensures reliable plated through-hole quality, even under extreme thermal shock conditions. With a glass transition temperature (Tg) exceeding 280°C, RO4003C maintains stable expansion characteristics throughout all PCB processing temperatures.


PCB Specifications

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Rogers 12mil 0.305mm RO4003C High Frequency PCB Double Sided RF PCB for Antennas

PCB SIZE

67 x 67mm=1up

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

NO

LAYER STACKUP

copper ------- 35um(1 oz)+plate TOP layer

RO4003C 0.305mm

copper ------- 35um(1oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

7.9 mil / 5.9 mil

Minimum / Maximum Holes:

0.4 mm / 0.4 mm

Number of Different Holes:

1

Number of Drill Holes:

3

Number of Milled Slots:

0

Number of Internal Cutouts:

0

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

RO4003C Tg280℃, er<3.48, Rogers Corp.

Final foil external:

1.5 oz

Final foil internal:

N/A

Final height of PCB:

0.4 mm ±0.1

PLATING AND COATING

 

Surface Finish

Immersion gold, 18%

Solder Mask Apply To:

N/A

Solder Mask Color:

N/A

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

N/A

Colour of Component Legend

N/A

Manufacturer Name or Logo:

N/A

VIA

Plated through hole(PTH), minimum size 0.4mm.

FLAMIBILITY RATING

N/A

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.


Typical Applications Include

.- Automotive Radar and Sensors
- Cellular Base Station Antennas
- Direct Broadcast Satellites
- Low Noise Block (LNB) Converters
- Power Amplifiers
- RFID Technology



Data Sheet for Rogers 4003C (RO4003C)

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RO4003C Typical Value

Property

RO4003C

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

3.38±0.05

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

3.55

Z

 

8 to 40 GHz

Differential Phase Length Method

Dissipation Factortan,δ

0.0027
0.0021

Z

 

10 GHz/23℃
2.5 GHz/23℃

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

+40

Z

ppm/℃

-50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

1.7 x 1010

 

MΩ.cm

COND A

IPC-TM-650 2.5.17.1

Surface Resistivity

4.2 x 109

 

MΩ

COND A

IPC-TM-650 2.5.17.1

Electrical Strength

31.2(780)

Z

Kv/mm(v/mil)

0.51mm(0.020")

IPC-TM-650 2.5.6.2

Tensile Modulus

19,650(2,850)
19,450(2,821)

X
Y

MPa(ksi)

RT

ASTM D 638

Tensile Strength

139(20.2)
100(14.5)

X
Y

MPa(ksi)

RT

ASTM D 638

Flexural Strength

276
(40)

 

MPa
(kpsi)

 

IPC-TM-650 2.4.4

Dimensional Stability

<0.3

X,Y

mm/m
(mil/inch)

after etch+E2/150℃

IPC-TM-650 2.4.39A

Coefficient of Thermal Expansion

11
14
46

X
Y
Z

ppm/℃

-55℃to288℃

IPC-TM-650 2.4.41

Tg

>280

 

℃ TMA

A

IPC-TM-650 2.4.24.3

Td

425

 

℃ TGA

 

ASTM D 3850

Thermal Conductivity

0.71

 

W/M/oK

80℃

ASTM C518

Moisture Absorption

0.06

 

%

48hrs immersion 0.060"
sample Temperature 50℃

ASTM D 570

Density

1.79

 

gm/cm3

23℃

ASTM D 792

Copper Peel Stength

1.05
(6.0)

 

N/mm
(pli)

after solder float 1 oz.
EDC Foil

IPC-TM-650 2.4.8

Flammability

N/A

 

 

 

UL 94

Lead-free Process Compatible

Yes

 

 

 



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