Home > Rogers PCB > Rogers RO4350B High Frequency Printed Circuit Board with 10mil, 20mil, 30mil and 60mil thick Coating with Immersion Gold
Rogers RO4350B High Frequency Printed Circuit Board with 10mil, 20mil, 30mil and 60mil thick Coating with Immersion Gold

RO4350B is a premium high frequency printed circuit board (PCB) available in various thicknesses, including 10mil 20mil 30mil, and 60mil with immersion gold coating.


(PCBs are custom-made products, and the pictures and specifications provided are for reference only.)


Brief Introduction of RO4350B Laminates

Today, we're excited to discuss the exceptional high frequency PCB built using RO4350B laminates. This material is a woven glass cloth reinforced hydrocarbon resin ceramic-filled laminate, developed by Rogers Corporation. It shares similar electrical properties with PTFE/fabric glass cloth materials while being as easy to process as epoxy resin/glass cloth composites.


Why Choose RO4350B Laminates?

1.Superior High Frequency Performan

The RO4350B materials are designed to outperform traditional PTFE options, possessing exceptional high frequency capabilities.


2.Low Dielectric Loss

This low loss results in outstanding electrical performance, making it suitable for applications with high operating frequencies.


3.Stable Electrical Properties

The dielectric constant of RO4350B remains stable across a wide frequency range, making it ideal for RF microwave circuits, matching networks, and controlled impedance transmission lines.(Chart DK vs. frequency).


4. Low Thermal Coefficient of Dielectric Constant

The temperature coefficient of dielectric constant for RO4350B is one of the lowest among circuit board materials (refer to Chart DK vs. Temperature). This characteristic ensures exceptional dimensional stability, which is essential for constructing mixed dielectric multilayer PCBs and ensuring reliable plated through holes.


5.Cost-Effective Manufacturing

RO4350B laminates can be fabricated using standard FR-4 processes, eliminating the need for specialized via preparation. They can be processed with automated handling systems and scrubbing equipment typically used for copper surface preparation. These features enable cost-effective volume manufacturing, making them competitively priced.


Our PCB Capabilities with RO4350B

We offer double-sided circuit boards on RO435B in various thicknesses, suitable for both typical and non-traditional microwave/radio frequency applications. These applications include:


- Base station antennas

- Attenuators

- Power amplifiers

- RFID systems

- Radar and sensors


Click to expand/collapse the table

Our PCB Capability (RO4350B)

PCB Material:

Glass reinforced hydrocarbon ceramic laminates

Designator:

Rogers RO4350B

Dielectric constant:

3.48  ±0.05 (process)

 

3.65 (design)

Layer count:

Single Layer, Double Layer, Multi-layer, Hybrid Designs

Copper weight:

1oz (35µm), 2oz (70µm)

Laminate thickness:

4mil (0.102mm), 6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersion Silver, Immersion tin,  OSP, ENEPIG, Pure gold etc.


Multilayer PCB

The multilayer PCB is constructed using a core of RO4350B, with options like a 4-layer board on a 6.6mil or 20mil core, as well as a 4-layer board utilizing two cores of 10mil. This differs from multilayer PCBs made with FR-4, as the core thickness is fixed. This consistency is crucial for maintaining the electrical length of RF lines on the circuit board.


Hybrid PCB

To reduce production costs while minimizing signal loss in high-frequency environments, FR-4 glass fiber material is combined with RO4350B in multilayer circuit boards. The high-frequency material is utilized in the signal layers, while the FR-4 glass fiber is employed in the other layers.

The standard color of RO4350B PCB is white.


Get in Touch
We specialize in offering prototypes, small batch runs, and mass production services. If you have any specific requirements for this type of PCB, please don’t hesitate to reach out to us. Thank you for your attention!


Appendix: Typical Values for RO4350B

Click to expand/collapse the table

Property

RO4350B

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

3.48±0.05

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

3.66

Z

 

8 to 40 GHz

Differential Phase Length Method

Dissipation Factortan,δ

0.0037
0.0031

Z

 

10 GHz/23℃
2.5 GHz/23℃

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

+50

Z

ppm/℃

-50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

1.2 x 1010

 

MΩ.cm

COND A

IPC-TM-650 2.5.17.1

Surface Resistivity

5.7 x109

 

COND A

IPC-TM-650 2.5.17.1

Electrical Strength

31.2(780)

Z

Kv/mm(v/mil)

0.51mm(0.020")

IPC-TM-650 2.5.6.2

Tensile Modulus

16,767(2,432)
14,153(2,053)

X
Y

MPa(ksi)

RT

ASTM D 638

Tensile Strength

203(29.5)
130(18.9)

X
Y

MPa(ksi)

RT

ASTM D 638

Flexural Strength

255
(37)

 

MPa
(kpsi)

 

IPC-TM-650 2.4.4

Dimensional Stability

<0.5

X,Y

mm/m
(mil/inch)

after etch+E2/150℃

IPC-TM-650 2.4.39A

Coefficient of Thermal Expansion

10
12
32

X
Y
Z

ppm/℃

-55℃to288℃

IPC-TM-650 2.4.41

Tg

>280

 

℃ TMA

A

IPC-TM-650 2.4.24.3

Td

390

 

℃ TGA

 

ASTM D 3850

Thermal Conductivity

0.69

 

W/M/oK

80℃

ASTM C518

Moisture Absorption

0.06

 

%

48hrs immersion 0.060"
sample Temperature 50℃

ASTM D 570

Density

1.86

 

gm/cm3

23℃

ASTM D 792

Copper Peel Stength

0.88
(5.0)

 

N/mm
(pli)

after solder float 1 oz.
EDC Foil

IPC-TM-650 2.4.8

Flammability

(3)V-0

 

 

 

UL 94

Lead-free Process Compatible

Yes