RO4350B is a premium high frequency printed circuit board (PCB) available in various thicknesses, including 10mil 20mil 30mil, and 60mil with immersion gold coating.
(PCBs are custom-made products, and the pictures and specifications provided are for reference only.)
Brief Introduction of RO4350B Laminates
Today, we're excited to discuss the exceptional high frequency PCB built using RO4350B laminates. This material is a woven glass cloth reinforced hydrocarbon resin ceramic-filled laminate, developed by Rogers Corporation. It shares similar electrical properties with PTFE/fabric glass cloth materials while being as easy to process as epoxy resin/glass cloth composites.
Why Choose RO4350B Laminates?
1.Superior High Frequency Performan
The RO4350B materials are designed to outperform traditional PTFE options, possessing exceptional high frequency capabilities.
2.Low Dielectric Loss
This low loss results in outstanding electrical performance, making it suitable for applications with high operating frequencies.
3.Stable Electrical Properties
The dielectric constant of RO4350B remains stable across a wide frequency range, making it ideal for RF microwave circuits, matching networks, and controlled impedance transmission lines.(Chart DK vs. frequency).
4. Low Thermal Coefficient of Dielectric Constant
The temperature coefficient of dielectric constant for RO4350B is one of the lowest among circuit board materials (refer to Chart DK vs. Temperature). This characteristic ensures exceptional dimensional stability, which is essential for constructing mixed dielectric multilayer PCBs and ensuring reliable plated through holes.
5.Cost-Effective Manufacturing
RO4350B laminates can be fabricated using standard FR-4 processes, eliminating the need for specialized via preparation. They can be processed with automated handling systems and scrubbing equipment typically used for copper surface preparation. These features enable cost-effective volume manufacturing, making them competitively priced.
Our PCB Capabilities with RO4350B
We offer double-sided circuit boards on RO435B in various thicknesses, suitable for both typical and non-traditional microwave/radio frequency applications. These applications include:
- Base station antennas
- Attenuators
- Power amplifiers
- RFID systems
- Radar and sensors
Our PCB Capability (RO4350B) |
|
PCB Material: |
Glass reinforced hydrocarbon ceramic laminates |
Designator: |
Rogers RO4350B |
Dielectric constant: |
3.48 ±0.05 (process) |
|
3.65 (design) |
Layer count: |
Single Layer, Double Layer, Multi-layer, Hybrid Designs |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Laminate thickness: |
4mil (0.102mm), 6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion Silver, Immersion tin, OSP, ENEPIG, Pure gold etc. |
Multilayer PCB
The multilayer PCB is constructed using a core of RO4350B, with options like a 4-layer board on a 6.6mil or 20mil core, as well as a 4-layer board utilizing two cores of 10mil. This differs from multilayer PCBs made with FR-4, as the core thickness is fixed. This consistency is crucial for maintaining the electrical length of RF lines on the circuit board.
Hybrid PCB
To reduce production costs while minimizing signal loss in high-frequency environments, FR-4 glass fiber material is combined with RO4350B in multilayer circuit boards. The high-frequency material is utilized in the signal layers, while the FR-4 glass fiber is employed in the other layers.
The standard color of RO4350B PCB is white.
Get in Touch
We specialize in offering prototypes, small batch runs, and mass production services. If you have any specific requirements for this type of PCB, please don’t hesitate to reach out to us. Thank you for your attention!
Appendix: Typical Values for RO4350B
Property |
RO4350B |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.48±0.05 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
3.66 |
Z |
|
8 to 40 GHz |
Differential Phase Length Method |
Dissipation Factortan,δ |
0.0037 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
+50 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
1.2 x 1010 |
|
MΩ.cm |
COND A |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
5.7 x109 |
|
MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
31.2(780) |
Z |
Kv/mm(v/mil) |
0.51mm(0.020") |
IPC-TM-650 2.5.6.2 |
Tensile Modulus |
16,767(2,432) |
X |
MPa(ksi) |
RT |
ASTM D 638 |
Tensile Strength |
203(29.5) |
X |
MPa(ksi) |
RT |
ASTM D 638 |
Flexural Strength |
255 |
|
MPa |
|
IPC-TM-650 2.4.4 |
Dimensional Stability |
<0.5 |
X,Y |
mm/m |
after etch+E2/150℃ |
IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion |
10 |
X |
ppm/℃ |
-55℃to288℃ |
IPC-TM-650 2.4.41 |
Tg |
>280 |
|
℃ TMA |
A |
IPC-TM-650 2.4.24.3 |
Td |
390 |
|
℃ TGA |
|
ASTM D 3850 |
Thermal Conductivity |
0.69 |
|
W/M/oK |
80℃ |
ASTM C518 |
Moisture Absorption |
0.06 |
|
% |
48hrs immersion 0.060" |
ASTM D 570 |
Density |
1.86 |
|
gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
0.88 |
|
N/mm |
after solder float 1 oz. |
IPC-TM-650 2.4.8 |
Flammability |
(3)V-0 |
|
|
|
UL 94 |
Lead-free Process Compatible |
Yes |
|
|
|
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