Rogers RO4360 RF Circuit Board 32mil Double Sided High Frequency PCB With Immersion Gold for Power Amplifiers

(Printed Circuit Boards are custom-made products; the images and parameters shown are for reference only)

Introduction

RO4360G2 laminates from Rogers Corporation are high-performance materials featuring a dielectric constant (Dk) of 6.15 and low loss characteristics. These glass-reinforced, hydrocarbon ceramic-filled thermoset materials strike an ideal balance between performance and ease of processing. The RO4360G2 laminates enhance Rogers' lineup of advanced materials by offering a lead-free process solution that improves rigidity for better manufacturability in multi-layer board constructions, all while reducing material and fabrication costs.

These laminates process similarly to FR-4 and are compatible with automated assembly. They possess a low Z-axis coefficient of thermal expansion (CTE), which provides design flexibility, and share a high glass transition temperature (Tg) with the entire RO4000 product line. Additionally, RO4360G2 laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminates for multi-layer designs.

With a Dk of 6.15 (Design Dk 6.4), RO4360G2 laminates enable designers to minimize circuit dimensions in applications where size and cost are critical. They are an excellent choice for engineers developing power amplifiers, patch antennas, ground-based radar systems, and various other RF applications.

Features and Benefits

Thermoset Resin System
1.Specifically formulated to achieve 6.15 Dk
2.Easy fabrication; processes similar to FR-4
3.Consistent material performance
4.Low loss characteristics
5.High thermal conductivity
6.More cost-effective PCB solution compared to competing PTFE productsB

Low Z-axis CTE / High Tg
1.Enhanced design flexibility
2.Reliable plated through-hole performance
3.Compatible with automated assembly processes

Environmentally Friendly 1.Compatible with lead-free processing

Regional Finished Goods Inventory 1.Short lead times and rapid inventory turnover
2.Efficient supply chain management

Typical Applications

Base Station Power Amplifiers
Small Cell Transceivers
Patch Antennas
Ground-Based Radar

PCB Capability

PCB Capability (RO4360G2)
PCB Material:	Hydrocarbon Ceramic-filled Thermoset Materials
Designation:	RO4360G2
Dielectric constant:	6.15 ±0.15
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP etc..

Data Sheet of RO4360G2