(Printed Circuit Boards are custom-made products; the images and parameters shown are for reference only)
Introduction
RO4360G2 laminates from Rogers Corporation are advanced materials featuring a dielectric constant (Dk) of 6.15 and low loss characteristics. These glass-reinforced, hydrocarbon ceramic-filled thermoset materials provide an optimal balance of performance and processing ease. The RO4360G2 laminates expand Rogers' high-performance materials portfolio, offering a lead-free process capable solution that enhances rigidity for improved manufacturability in multi-layer board constructions while reducing material and fabrication costs.
These laminates process similarly to FR-4 and are compatible with automated assembly. They exhibit a low Z-axis coefficient of thermal expansion (CTE), which provides design flexibility, and share a high glass transition temperature (Tg) with the entire RO4000 product line. Additionally, RO4360G2 laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminates for multi-layer designs.
With a Dk of 6.15 (Design Dk 6.4), RO4360G2 laminates enable designers to minimize circuit dimensions in applications where size and cost are critical. They are an excellent value choice for engineers developing power amplifiers, patch antennas, ground-based radar, and various other RF applications.
Features and Benefits
Thermoset Resin System
1.Specifically formulated to achieve 6.15 Dk
2.Easy fabrication; processes similar to FR-4
3.Consistent material performance
4.Low loss characteristics
5.High thermal conductivity
6.More cost-effective PCB solution compared to competing PTFE productsB
Low Z-axis CTE / High Tg
1.Enhanced design flexibility
2.Reliable plated through-hole performance
3.Compatible with automated assembly processes
Environmentally Friendly
1.Compatible with lead-free processing
Regional Finished Goods Inventory
1.Short lead times and rapid inventory turnover
2.Efficient supply chain management
Typical Applications
Base Station Power Amplifiers
Small Cell Transceivers
Patch Antennas
Ground-Based Radar
PCB Capability (RO4360G2)
PCB Capability (RO4360G2) |
|
PCB Material: |
Hydrocarbon Ceramic-filled Thermoset Materials |
Designation: |
RO4360G2 |
Dielectric constant: |
6.15 ±0.15 |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: |
8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP etc.. |
Data Sheet of RO4360G2
RO4360G2 Typical Value |
|||||
Property |
RO4360G2 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
6.15±0.15 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
2.5 GHz/23℃ |
|||||
Dissipation Factor,tanδ |
0.0038 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Conductivity |
0.75 |
|
W/mK |
50℃ |
ASTM D-5470 |
Volume Resistivity |
4.0 X 1013 |
|
Ω.cm |
Elevated T |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
9.0 X 1012 |
|
Ω |
Elevated T |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
784 |
Z |
V/mil |
|
IPC-TM-650 2.5.6.2 |
Tensile Strength |
131 (19) 97(14) |
X Y |
MPa (kpsi) |
40 hrs 50%RH/23 |
ASTM D638 |
Flexural Strength |
213(31) 145(21) |
X Y |
Mpa (kpsi) |
40 hrs 50%RH/23 |
IPC-TM-650, 2.4.4 |
Coefficient of Thermal Expansion |
13 14 28 |
X Y Z |
ppm/℃ |
-50 ℃to 288℃ After Replicated Heat Cycle |
IPC-TM-650, 2.1.41 |
Tg |
>280 |
|
℃ TMA |
|
IPC-TM-650 2.4.24.3 |
Td |
407 |
|
℃ |
|
ASTM D3850 using TGA |
T288 |
>30 |
Z |
min |
30 min / 125℃ Prebake |
IPC-TM-650 2.2.24.1 |
Moisure Absorption |
0.08 |
|
% |
50℃/48hr |
IPC-TM-650 2.6.2.1 ASTM D570 |
Thermal Coefficient of er |
-131 @10 GHz |
Z |
ppm/℃ |
-50℃ to 150 ℃ |
IPC-TM-650, 2.5.5.5 |
Density |
2.16 |
|
gm/cm3 |
RT |
ASTM D792 |
Copper Peel Stength |
5.2 (0.91) |
|
pli (N/mm) |
Condtion B |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
|
|
|
UL 94 File QMTS2. E102765 |