Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers

(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)

Introduction

RO4360G2 laminates from Rogers Corporation are advanced materials designed for high-performance applications. With a dielectric constant (Dk) of 6.15 and low loss characteristics, these glass-reinforced, hydrocarbon ceramic-filled thermoset materials offer an ideal balance between performance and processing ease. RO4360G2 laminates enhance Rogers' portfolio by providing a lead-free process capable solution that improves rigidity for better processability in multi-layer board constructions, while also reducing material and fabrication costs.

RO4360G2 laminates process similarly to FR-4 and are compatible with automated assembly. They feature a low Z-axis coefficient of thermal expansion (CTE), offering design flexibility, and maintain a high glass transition temperature (Tg) consistent with the entire RO4000 product line. These laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminate in multi-layer designs.

With a Dk of 6.15 (Design Dk 6.4), RO4360G2 laminates enable designers to reduce circuit dimensions in cost-sensitive applications. They represent an excellent value choice for engineers working on power amplifiers, patch antennas, ground-based radar, and other RF applications.

Features and Benefits

Thermoset Resin System:
1.Formulated to meet 6.15 Dk
2.Ease of fabrication; processes similar to FR-4
3.Material repeatability
4.Low loss
5.High thermal conductivity
6.Lower total PCB cost compared to competing PTFE products

Low Z-axis CTE / High Tg:
1.Design flexibility
2.Plated through-hole reliability
3.Compatible with automated assembly

Environmentally Friendly:
1.Lead-free process compatible

Regional Finished Goods Inventory:
1.Short lead times and quick inventory turns
2.Efficient supply chain management

Typical Applications

Base Station Power Amplifiers
Small Cell Transceivers
Patch Antennas
Ground-Based Radar

PCB Specifications

PCB Capability (RO4360G2)
PCB Material:	Hydrocarbon Ceramic-filled Thermoset Materials
Designation:	RO4360G2
Dielectric constant:	6.15 ±0.15
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
PCB thickness:	8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold  etc..

Data Sheet of RO4360G2