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TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 with Immersion Gold

(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)


TMM4 High-Frequency Printed Circuit Board Overview

General Description

This double-layer RF PCB is constructed on a 60 mil Rogers TMM4 substrate with a dielectric constant of 4.5. The board features one non-plated through-hole (NPTH) and is designed with a base copper weight of 0.5 oz, plated to 1 oz. The surface finish on the pads is immersion gold, and there is no solder mask or silkscreen printed. The top layer contains the track, while the entire bottom layer serves as copper shielding. All boards are fabricated according to IPC Class II standards and undergo 100% electrical testing before shipment. Every 25 boards are vacuum packed for delivery.


PCB Specifications

PCB SIZE

90 x 90mm=1up

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

NO

LAYER STACKUP

copper ------- 17um(0.5 oz)+plate TOP layer

TMM4 1.524mm

copper ------- 17um(0.5 oz) + plate  BOT Layer

TECHNOLOGY



Typical Applications

1.Chip testers
2.Dielectric polarizers and lenses
3.Filters and couplers
4.Global Positioning System (GPS) antennas
5.Patch antennas
6.Power amplifiers and combiners
7.RF and microwave circuitry
8.Satellite communication systems



Our Capability (TMM4)

PCB Material:

Composite of Ceramic, hydrocarbon and thermoset polymer

Designator:

TMM4

Dielectric constant:

4.5  ±0.045 (process);                                                               4.7 (design)

Layer count:

Single Sided, Double Sided, Multi-layer, Hybrid designs

Copper weight:

1oz (35µm), 2oz (70µm)

Laminate thickness:

15mil (0.381mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm), 150mil (3.810mm), 200mil (5.08mm), 250mil (6.35mm), 500mil (12.7mm)


Data Sheet of TMM4

Click to expand/collapse the table

TMM4 Typical Value

Property

TMM4

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

4.5±0.045

Z

 

10 GHz

IPC-TM-650 2.5.5.5

Dielectric Constant,εDesign

4.7

-

-

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor (process)

0.002

Z

-

10 GHz

IPC-TM-650 2.5.5.5

Thermal Coefficient of dielectric constant

+15

-

ppm/°K

-55℃-125℃

IPC-TM-650 2.5.5.5

Insulation Resistance

>2000

-

Gohm

C/96/60/95

ASTM D257

Volume Resistivity

6 x 108

-

Mohm.cm

-

ASTM D257

Surface Resistivity

1 x 109

-

Mohm

-

ASTM D257

Electrical Strength(dielectric strength)

371

Z

V/mil

-

IPC-TM-650 method 2.5.6.2

Thermal Properties

Decompositioin Temperature(Td)

425

425

℃TGA

-

ASTM D3850

Coefficient of Thermal Expansion - X

16

X

ppm/K

0 to 140 ℃

ASTM E 831 IPC-TM-650, 2.4.41

Coefficient of Thermal Expansion - Y

16

Y

ppm/K

0 to 140 ℃

ASTM E 831 IPC-TM-650, 2.4.41

Coefficient of Thermal Expansion - Z

21

Z

ppm/K

0 to 140 ℃

ASTM E 831 IPC-TM-650, 2.4.41

Thermal Conductivity

0.7

Z

W/m/K

80 ℃

ASTM C518

Mechanical Properties

Copper Peel Strength after Thermal Stress

5.7 (1.0)

X,Y

lb/inch (N/mm)

after solder float 1 oz. EDC

IPC-TM-650 Method 2.4.8

Flexural Strength (MD/CMD)

15.91

X,Y

kpsi

A

ASTM D790

Flexural Modulus (MD/CMD)

1.76

X,Y

Mpsi

A

ASTM D790

Physical Properties

Moisture Absorption (2X2)

1.27mm (0.050")

0.07

-

%

D/24/23

ASTM D570

3.18mm (0.125")

0.18

Specific Gravity

2.07

-

-

A

ASTM D792

Specific Heat Capacity

0.83

-

J/g/K

A

Calculated

Lead-Free Process Compatible

YES

-

-

-

-



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