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Rogers RT/Duroid 5870 31mil (0.787mm) High-Frequency PCB for Radar Systems

(Note: Printed Circuit Boards (PCBs) are custom-made products; the images and specifications provided are for reference only.)


Overview of Rogers RT/Duroid 5870

Rogers RT/Duroid 5870 is a high-frequency material composed of glass microfiber reinforced PTFE composites, specifically engineered for demanding stripline and microstrip circuit applications. This material showcases exceptional dielectric constant uniformity, achieved through its randomly oriented microfibers, ensuring consistent performance across panels and stability over a wide frequency range.


Key Benefits

  • Low Dissipation Factor: The low dissipation factor allows RT/Duroid 5870 to be effective in Ku-band applications and beyond.
  • Machinability: This material can be easily cut, sheared, and machined into various shapes.
  • Chemical Resistance: It is resistant to all solvents and reagents, whether hot or cold, typically used in the etching of printed circuits or in plating edges and holes.

  • Typical Applications

    • Commercial airline broadband antennas
    • Microstrip circuits
    • Stripline circuits
    • Millimeter wave applications
    • Military radar systems
    • Missile guidance systems
    • Point-to-point digital radio antennas


    PCB Specifications

    Click to expand/collapse the table

    Rogers RT/Duroid 5870 31mil 0.787mm High Frequency PCB for Radar Systems

    PCB SIZE

    110 x 72mm=1PCS

    BOARD TYPE

    Double sided PCB

    Number of Layers

    2 layers

    Surface Mount Components

    YES

    Through Hole Components

    YES

    LAYER STACKUP

    copper ------- 35um(1 oz)+plate TOP layer

    RT/duroid 5870 0.787mm

    copper ------- 35um(1oz) + plate  BOT Layer

    TECHNOLOGY

     

    Minimum Trace and Space:

    4.8 mil / 4.5 mil

    Minimum / Maximum Holes:

    0.3 mm / 4.6 mm

    Number of Different Holes:

    5

    Number of Drill Holes:

    87

    Number of Milled Slots:

    0

    Number of Internal Cutouts:

    1

    Impedance Control:

    no

    Number of Gold finger:

    0

    BOARD MATERIAL

     

    Glass Epoxy:

    RT/duroid 5870 0.787mm

    Final foil external:

    1.0 oz

    Final foil internal:

    N/A

    Final height of PCB:

    0.8 mm ±0.1

    PLATING AND COATING

     

    Surface Finish

    Immersion Gold

    Solder Mask Apply To:

    N/A

    Solder Mask Color:

    N/A

    Solder Mask Type:

    N/A

    CONTOUR/CUTTING

    Routing

    MARKING

     

    Side of Component Legend

    N/A

    Colour of Component Legend

    N/A

    Manufacturer Name or Logo:

    N/A

    VIA

    Plated through hole(PTH), minimum size 0.3mm. Solder mask uncovered

    FLAMIBILITY RATING

    UL 94-V0 Approval MIN.

    DIMENSION TOLERANCE

     

    Outline dimension:  

    0.0059"

    Board plating:

    0.0029"

    Drill tolerance:

    0.002"

    TEST

    100% Electrical Test prior shipment

    TYPE OF ARTWORK TO BE SUPPLIED

    email file, Gerber RS-274-X, PCBDOC etc

    SERVICE AREA

    Worldwide, Globally.



    Data Sheet for Rogers RT/Duroid 5870

    Click to expand/collapse the table

    RT/duroid 5870 Typical Value

    Property

    RT/duroid 5870

    Direction

    Units

    Condition

    Test Method

    Dielectric Constant,εProcess

    2.33
    2.33±0.02 spec.

    Z

    N/A

    C24/23/50
    C24/23/50

    1 MHz IPC-TM-650 2.5.5.3
    10 GHz IPC-TM 2.5.5.5

    Dielectric Constant,εDesign

    2.33

    Z

    N/A

    8GHz to 40 GHz

    Differential Phase Length Method

    Dissipation Factor,tanδ

    0.0005
    0.0012

    Z

    N/A

    C24/23/50
    C24/23/50

    1 MHz IPC-TM-650 2.5.5.3
    10 GHz IPC-TM 2.5.5.5

    Thermal Coefficient of ε

    -115

    Z

    ppm/℃

    -50℃to 150℃

    IPC-TM-650 2.5.5.5

    Volume Resistivity

    2 x 107

    Z

    Mohm cm

    C/96/35/90

    ASTM D 257

    Surface Resistivity

    2 x 107

    Z

    Mohm

    C/96/35/90

    ASTM D 257

    Specific Heat

    0.96(0.23)

    N/A

    j/g/k
    (cal/g/c)

    N/A

    Calculated

    Tensile Modulus

    Test at 23℃

    Test at 100℃

    N/A

    MPa(kpsi)

    A

    ASTM D 638

    1300(189)

    490(71)

    X

    1280(185)

    430(63)

    Y

    Ultimate Stress

    50(7.3)

    34(4.8)

    X

    42(6.1)

    34(4.8)

    Y

    Ultimate Strain

    9.8

    8.7

    X

    %

    9.8

    8.6

    Y

    Compressive Modulus

    1210(176)

    680(99）

    X

    MPa(kpsi)

    A

    ASTM D 695

    1360(198)

    860(125)

    Y

    803(120)

    520(76)

    Z

    Ultimate Stress

    30(4.4)

    23(3.4）

    X

    37(5.3)

    25(3.7)

    Y

    54(7.8)

    37(5.3)

    Z

    Ultimate Strain

    4

    4.3

    X

    %

    3.3

    3.3

    Y

    8.7

    8.5

    Z

    Moisture Absorption

    0.02

    N/A

    %

    0.62"(1.6mm) D48/50

    ASTM D 570

    Thermal Conductivity

    0.22

    Z

    W/m/k

    80℃

    ASTM C 518

    Coefficient of Thermal Expansion

    22
    28
    173

    X
    Y
    Z

    ppm/℃

    0-100℃

    IPC-TM-650 2.4.41

    Td

    500

    N/A

    ℃ TGA

    N/A

    ASTM D 3850

    Density

    2.2

    N/A

    gm/cm3

    N/A

    ASTM D 792

    Copper Peel

    27.2(4.8)

    N/A

    Pli(N/mm)

    1oz(35mm)EDC foil
    after solder float

    IPC-TM-650 2.4.8

    Flammability

    V-0

    N/A

    N/A

    N/A

    UL 94

    Lead-free Process Compatible

    Yes

    N/A

    N/A

    N/A

    N/A




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