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Rogers RT/Duroid 5880 RF PCB Coatings Available in 10mil, 20mil, 31mil, and 62mil

(Note: PCBs are custom-made products; the images and specifications provided are for reference only.)


Introduction to RT/Duroid 5880

Hello everyone,


Today, we are pleased to introduce our high-frequency PCBs constructed from RT/Duroid 5880 laminates. This advanced material from Rogers is a glass microfiber reinforced PTFE composite, specifically designed for demanding stripline and microstrip circuit applications.


Why Choose RT/Duroid 5880?


PCB Capabilities of RT/Duroid 5880

Click to expand/collapse the table

PCB Material:

Glass microfiber reinforced PTFE composites

Designation:

RT/duroid 5880

Dielectric constant:

2.2  ±0.02 (process)

2.2 (design)

Layer count:

2 Layer, Multilayer, Hybrid type (Mixed)

Copper weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

PCB thickness:

10mil (0.254mm), 20mil (0.508mm)

31mil (0.787mm), 62mil (1.575mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, OSP, etc..

RT/Duroid 5880 can be fabricated into double-sided boards, multilayer boards, and hybrid types, available in thicknesses of 10mil, 20mil, 31mil, and 62mil.


Typical Applications

The typical applications for RT/Duroid 5880 include:




Additional Properties

The standard color of RT/Duroid 5880 PCBs is black. This material also offers low water absorption and excellent chemical resistance, making it ideal for various environments.


If you have any questions or need further information, please feel free to contact us.


Thank you for reading!


Appendix: Typical Values of Rogers 5880

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RT/duroid 5880 Typical Value

Property

RT/duroid 5880

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

2.20
2.20±0.02 spec.

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Dielectric Constant,εDesign

2.2

Z

N/A

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.0004
0.0009

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Thermal Coefficient of ε

-125

Z

ppm/℃

-50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

2 x 1077

Z

Mohm cm

C/96/35/90

ASTM D 257

Surface Resistivity

3 x 107

Z

Mohm

C/96/35/90

ASTM D 257

Specific Heat

0.96(0.23）

N/A

j/g/k
(cal/g/c)

N/A

Calculated

Tensile Modulus

Test at 23℃

Test at 100℃

N/A

MPa(kpsi)

A

ASTM D 638

1070(156)

450(65)

X

860(125)

380(55)

Y

Ultimate Stress

29(4.2)

20(2.9)

X

27(3.9）

18(2.6)

Y

Ultimate Strain

6

7.2

X

%

4.9

5.8

Y

Compressive Modulus

710(103)

500(73)

X

MPa(kpsi)

A

ASTM D 695

710(103)

500(73)

Y

940(136)

670(97)

Z

Ultimate Stress

27(3.9)

22(3.2)

X

29(5.3)

21(3.1)

Y

52(7.5)

43(6.3)

Z

Ultimate Strain

8.5

8.4

X

%

7.7

7.8

Y

12.5

17.6

Z

Moisture Absorption

0.02

N/A

%

0.62"(1.6mm) D48/50

ASTM D 570

Thermal Conductivity

0.2

Z

W/m/k

80℃

ASTM C 518

Coefficient of Thermal Expansion

31
48
237

X
Y
Z

ppm/℃

0-100℃

IPC-TM-650 2.4.41

Td

500

N/A

℃ TGA

N/A

ASTM D 3850

Density

2.2

N/A

gm/cm3

N/A

ASTM D 792

Copper Peel

31.2(5.5)

N/A

Pli(N/mm)

1oz(35mm)EDC foil
after solder float

IPC-TM-650 2.4.8

Flammability

V-0

N/A

N/A

N/A

UL 94

Lead-free Process Compatible

Yes

N/A

N/A

N/A

N/A



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