Rogers RT/Duroid 5870 High Frequency PCB 10mil (0.254mm) for Commercial Airline Broadband Antennas
(Printed Circuit Boards (PCBs) are custom-made products; the images and specifications provided are for reference only.)
Introduction to Rogers RT/Duroid 5870
Rogers RT/Duroid 5870 is a high frequency material composed of glass microfiber reinforced PTFE composites, specifically engineered for demanding stripline and microstrip circuit applications. The unique structure of randomly oriented microfibers ensures exceptional dielectric constant uniformity across panels, maintaining consistency over a wide frequency range.
Additionally, the low dissipation factor of RT/Duroid 5870 makes it suitable for use in Ku-band and higher applications. This material can be easily cut, sheared, and machined into various shapes, exhibiting resistance to solvents and reagents, whether hot or cold, typically used in etching printed circuits or plating edges and holes.
Typical Applications
- Commercial airline broadband antennas
- Microstrip circuits
- Stripline circuits
- Millimeter wave applications
- Military radar systems
- Missile guidance systems
- Point-to-point digital radio antennas
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PCB Specifications
RT/Duroid 5870 10mil 0.254mm High Frequency PCB for Commercial Aireline Broadband Antennas |
|
PCB SIZE |
100 x 68mm=1up |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 35um(1 oz)+plate TOP layer |
RT/duroid 5870 0.254mm |
|
copper ------- 35um(1oz) + plate BOT Layer |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
8.8 mil / 10.5mil |
Minimum / Maximum Holes: |
no |
Number of Different Holes: |
no |
Number of Drill Holes: |
no |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
RT/duroid 5870 0.254mm |
Final foil external: |
1oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.3 mm ±0.1 |
PLATING AND COATING |
|
Surface Finish |
OSP |
Solder Mask Apply To: |
N/A |
Solder Mask Color: |
N/A |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
N/A |
Colour of Component Legend |
N/A |
Manufacturer Name or Logo: |
N/A |
VIA |
NO |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
Data Sheet for Rogers RT/Duroid 5870
RT/duroid 5870 Typical Value |
||||||
Property |
RT/duroid 5870 |
Direction |
Units |
Condition |
Test Method |
|
Dielectric Constant,εProcess |
2.33 |
Z |
N/A |
C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 |
|
Dielectric Constant,εDesign |
2.33 |
Z |
N/A |
8GHz to 40 GHz |
Differential Phase Length Method |
|
Dissipation Factor,tanδ |
0.0005 |
Z |
N/A |
C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 |
|
Thermal Coefficient of ε |
-115 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
|
Volume Resistivity |
2 x 107 |
Z |
Mohm cm |
C/96/35/90 |
ASTM D 257 |
|
Surface Resistivity |
2 x 107 |
Z |
Mohm |
C/96/35/90 |
ASTM D 257 |
|
Specific Heat |
0.96(0.23) |
N/A |
j/g/k |
N/A |
Calculated |
|
Tensile Modulus |
Test at 23℃ |
Test at 100℃ |
N/A |
MPa(kpsi) |
A |
ASTM D 638 |
1300(189) |
490(71) |
X |
||||
1280(185) |
430(63) |
Y |
||||
Ultimate Stress |
50(7.3) |
34(4.8) |
X |
|||
42(6.1) |
34(4.8) |
Y |
||||
Ultimate Strain |
9.8 |
8.7 |
X |
% |
||
9.8 |
8.6 |
Y |
||||
Compressive Modulus |
1210(176) |
680(99） |
X |
MPa(kpsi) |
A |
ASTM D 695 |
1360(198) |
860(125) |
Y |
||||
803(120) |
520(76) |
Z |
||||
Ultimate Stress |
30(4.4) |
23(3.4） |
X |
|||
37(5.3) |
25(3.7) |
Y |
||||
54(7.8) |
37(5.3) |
Z |
||||
Ultimate Strain |
4 |
4.3 |
X |
% |
||
3.3 |
3.3 |
Y |
||||
8.7 |
8.5 |
Z |
||||
Moisture Absorption |
0.02 |
N/A |
% |
0.62"(1.6mm) D48/50 |
ASTM D 570 |
|
Thermal Conductivity |
0.22 |
Z |
W/m/k |
80℃ |
ASTM C 518 |
|
Coefficient of Thermal Expansion |
22 |
X |
ppm/℃ |
0-100℃ |
IPC-TM-650 2.4.41 |
|
Td |
500 |
N/A |
℃ TGA |
N/A |
ASTM D 3850 |
|
Density |
2.2 |
N/A |
gm/cm3 |
N/A |
ASTM D 792 |
|
Copper Peel |
27.2(4.8) |
N/A |
Pli(N/mm) |
1oz(35mm)EDC foil |
IPC-TM-650 2.4.8 |
|
Flammability |
V-0 |
N/A |
N/A |
N/A |
UL 94 |
|
Lead-free Process Compatible |
Yes |
N/A |
N/A |
N/A |
N/A |
|