Rogers RT/Duroid 5880 High-Frequency PCB 10mil (0.254mm) for Microstrip and Stripline Circuits
(Note: Printed Circuit Boards (PCBs) are custom-made products; the images and specifications provided are for reference only.)
Overview of Rogers RT/Duroid 5880 Material
Rogers RT/Duroid 5880 is a high-frequency material made from glass microfiber reinforced PTFE composites, specifically engineered for demanding stripline and microstrip circuit applications. The unique design features randomly oriented microfibers that ensure exceptional dielectric constant uniformity. This dielectric constant remains consistent across panels and stable over a wide frequency range.
Key Benefits
- 1.Low Dissipation Factor: The low dissipation factor enhances the utility of RT/Duroid 5880 in Ku-band applications and beyond.
- 2.Machinability: The material can be easily cut, sheared, and machined into various shapes.
- 3.Chemical Resistance: It demonstrates resistance to all solvents and reagents, whether hot or cold, commonly used in etching printed circuits or plating edges and holes.
Typical Applications
RT/Duroid 5880 is widely used in various applications, including:
- a.Commercial airline broadband antennas
- b.Microstrip circuits
- c.Stripline circuits
- d.Millimeter wave applications
- e.Military radar systems
- f.Missile guidance systems
- g.Point-to-point digital radio antennas
PCB Specifications
Rogers RT/Duroid 5880 10mil 0.254mm High Frequency PCB for Microstrip and Stripline Circuits |
|
PCB SIZE |
130 x 100mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
RT/duroid 5880 0.254mm |
|
copper ------- 18um(0.5oz) + plate BOT Layer |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
5 mil / 4 mil |
Minimum / Maximum Holes: |
0.2 mm / 0.2mm |
Number of Different Holes: |
1 |
Number of Drill Holes: |
15 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
RT/duroid 5880 0.254mm |
Final foil external: |
1.0 oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.3 mm ±0.1 |
PLATING AND COATING |
|
Surface Finish |
Immersion gold |
Solder Mask Apply To: |
N/A |
Solder Mask Color: |
N/A |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
N/A |
Colour of Component Legend |
N/A |
Manufacturer Name or Logo: |
N/A |
VIA |
Plated through hole(PTH), minimum size 0.22mm. Via tented. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
Data Sheet for Rogers RT/Duroid 5880
RT/duroid 5880 Typical Value |
||||||
Property |
RT/duroid 5880 |
Direction |
Units |
Condition |
Test Method |
|
Dielectric Constant,εProcess |
2.20 |
Z |
N/A |
C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 |
|
Dielectric Constant,εDesign |
2.2 |
Z |
N/A |
8GHz to 40 GHz |
Differential Phase Length Method |
|
Dissipation Factor,tanδ |
0.0004 |
Z |
N/A |
C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 |
|
Thermal Coefficient of ε |
-125 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
|
Volume Resistivity |
2 x 107 |
Z |
Mohm cm |
C/96/35/90 |
ASTM D 257 |
|
Surface Resistivity |
3 x 107 |
Z |
Mohm |
C/96/35/90 |
ASTM D 257 |
|
Specific Heat |
0.96(0.23） |
N/A |
j/g/k |
N/A |
Calculated |
|
Tensile Modulus |
Test at 23℃ |
Test at 100℃ |
N/A |
MPa(kpsi) |
A |
ASTM D 638 |
1070(156) |
450(65) |
X |
||||
860(125) |
380(55) |
Y |
||||
Ultimate Stress |
29(4.2) |
20(2.9) |
X |
|||
27(3.9） |
18(2.6) |
Y |
||||
Ultimate Strain |
6 |
7.2 |
X |
% |
||
4.9 |
5.8 |
Y |
||||
Compressive Modulus |
710(103) |
500(73) |
X |
MPa(kpsi) |
A |
ASTM D 695 |
710(103) |
500(73) |
Y |
||||
940(136) |
670(97) |
Z |
||||
Ultimate Stress |
27(3.9) |
22(3.2) |
X |
|||
29(5.3) |
21(3.1) |
Y |
||||
52(7.5) |
43(6.3) |
Z |
||||
Ultimate Strain |
8.5 |
8.4 |
X |
% |
||
7.7 |
7.8 |
Y |
||||
12.5 |
17.6 |
Z |
||||
Moisture Absorption |
0.02 |
N/A |
% |
0.62"(1.6mm) D48/50 |
ASTM D 570 |
|
Thermal Conductivity |
0.2 |
Z |
W/m/k |
80℃ |
ASTM C 518 |
|
Coefficient of Thermal Expansion |
31 |
X |
ppm/℃ |
0-100℃ |
IPC-TM-650 2.4.41 |
|
Td |
500 |
N/A |
℃ TGA |
N/A |
ASTM D 3850 |
|
Density |
2.2 |
N/A |
gm/cm3 |
N/A |
ASTM D 792 |
|
Copper Peel |
31.2(5.5) |
N/A |
Pli(N/mm) |
1oz(35mm)EDC foil |
IPC-TM-650 2.4.8 |
|
Flammability |
V-0 |
N/A |
N/A |
N/A |
UL 94 |
|
Lead-free Process Compatible |
Yes |
N/A |
N/A |
N/A |
N/A |
|