Rogers RT/duroid 5880LZ High Frequency PCB - 10mil 20mil 50mil 100mil RT5880LZ PCB for Airborne and Radar Systems
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
The Rogers RT/duroid 5880LZ High Frequency PCBis a high-performance circuit board designed for demanding stripline and microstrip applications. Built on Rogers RT/duroid 5880LZ laminates, this PCB features a unique PTFE composite with a low-density, lightweight design, making it ideal for weight-sensitive and high-performance applications. With a dielectric constant (Dk) of 2.00 ± 0.04 and a low dissipation factor (Df) ranging from 0.0021 to 0.0027 at 10 GHz, the RT/duroid 5880LZ PCB ensures consistent electrical performance across a wide frequency range, extending its usefulness to Ku-band and beyond.
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Features
1.Lowest Dielectric Constant: 2.00 ± 0.04 for superior signal integrity.
2.Low Dissipation Factor: Ranges from 0.0021 to 0.0027 at 10 GHz, minimizing signal loss.
3.Low Z-Axis CTE: 40 ppm/°C, ensuring thermal stability.
4.Lightweight and Low Density: 1.4 g/cm³, ideal for weight-sensitive applications.
5.Uniform Electrical Properties: Consistent performance across a wide frequency range.
6.Chemical Resistance: Resistant to all solvents and reagents used in etching or plating.
Typical Applications
1.Airborne Antenna Systems
2.Lightweight Feed Networks
3.Radar Systems
4.Guidance Systems
5.Point-to-Point Digital Radio Antennas
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Our PCB Capability (RT/duroid 5880LZ)
| PCB Capability (RT/duroid 5880LZ) | |
| PCB Material: | Unique Filled PTFE Composites |
| Designation: | RT/Duroid 5880LZ |
| Dielectric constant: | 2 |
| Dissipation Factor | 0.0021 10GHz |
| Layer count: | Single Sided, Double Sided, Multilayer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Laminate thickness: | 10mil (0.254mm), 20mil (0.508mm), 50mil (1.270mm), 100mil (2.540mm ) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold plated etc.. |
Typical Values of RT/duroid 5880LZ
| Property | Typical Value RT/duroid® 5880LZ | Direction | Units | Condition | Test Method |
| Dielectric Constant er,Process | 2.00 ± 0.04 | Z | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| Dielectric Constant er,Design | 2.00 | Z | 8 GHz - 40 GHz | Differential Phase Length Method | |
| Dissipation Factor, tan | Typ: 0.0021 Max: 0.0027 | Z | 10GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| Thermal Coefficient of Dielectric Constant, er | +20 | Z | ppm/°C | -50°C to 150°C 10GHz | IPC-TM-650, 2.5.5.5 |
| Volume Resistivity | 1.74 X 10^7 | Mohm•cm | C-96/35/90 | IPC-TM-650, 2.5.17.1 | |
| Surface Resistivity | 2.08 X 10^6 | Mohm | C-96/35/90 | IPC-TM-650, 2.5.17.1 | |
| Electrical Strength | 40 | KV | D48/50 | IPC-TM-650, 2.5.6 | |
| Dimensional Stability | -0.38 | X,Y | % | IPC-TM-650, 2.4.39A | |
| Moisture Absorption | 0.31 | % | 24 hours/23°C | IPC-TM-650, 2.6.2.1 | |
| Thermal Conductivity | 0.33 | Z | W/m/°K | 80°C | ASTM C518 |
| Coefficient of Thermal Expansion | 54, 47 40 | X,Y Z | ppm/°C | 0 to 150°C | IPC-TM-650, 2.4.41 |
| Outgassing | |||||
| TML | 0.01 | % | ASTM E-595 | ||
| CVCM | 0.01 | ||||
| WVR | 0.01 | ||||
| Density | 1.4 | gm/cm^3 | ASTM D792 | ||
| Copper Peel | >4.0 | pli | IPC-TM-650, 2.4.8 | ||
| Flammability | V-O | UL 94 | |||
| Lead-Free Process Compatible | YES | ||||