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Rogers TMM13i High-Frequency PCB, 60mil 1.524mm, Higher DK12.85 RF PCB with Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


In the fast-paced world of electronics, high-frequency PCBs are essential for enabling advanced technologies. The Rogers TMM13i High-Frequency PCB, with a thickness of 60mil (1.524mm) and a high dielectric constant (DK) of 12.85, is a top choice for engineers and designers working on RF and microwave applications. This double-sided PCB, featuring immersion gold surface finish and a green solder mask, is designed to deliver exceptional performance in demanding environments.


Key Features of Rogers TMM13i PCB

1.High Dielectric Constant (DK12.85): The TMM13i material is optimized for high-frequency applications, ensuring minimal signal loss and superior performance in RF and microwave circuits. Its high DK makes it ideal for compact designs where space is at a premium.
2.Low Dissipation Factor: The TMM13i PCB ensures efficient signal transmission, making it suitable for applications that require high signal integrity, such as 5G and satellite communications.
3.Immersion Gold Surface Finish: The immersion gold finish provides excellent conductivity, corrosion resistance, and solderability, ensuring long-term reliability in harsh environments.
4.Customizable Copper Weight: The PCB features a transition from 0.5 oz to 1 oz copper, offering flexibility in design and application.
5.Green Solder Mask: The green solder mask on the top side enhances the board's durability and aesthetic appeal.
6.IPC Class 2 Standards: Manufactured according to IPC Class 2 standards, the TMM13i PCB ensures high quality and reliability.



Applications

The Rogers TMM13i PCB is well-suited for a variety of high-frequency and high-power applications, including:

1.RF and Microwave Circuitry: Ideal for high-frequency signal transmission with minimal loss.
2.Satellite Communication Systems: Ensures reliable performance in space and terrestrial communication systems.
3.Global Positioning Systems (GPS) Antennas: Provides stable signal integrity for navigation and tracking systems.
4.Patch Antennas: Suitable for compact and high-performance antenna designs.
5.Power Amplifiers and Combiners: Delivers efficient power handling and signal integrity.
6.Filters and Couplers: Ensures precise signal filtering and coupling in RF systems.
7.Dielectric Polarizers and Lenses: Used in advanced optical and RF applications.
8.Chip Testers: Provides reliable performance for testing high-frequency components.


PCB Specifications

Click to expand/collapse the table

PCB SIZE

100 x 100mm=1up

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

NO

LAYER STACKUP

copper ------- 17um(0.5 oz)+plate TOP layer

TMM13i 1.524mm

copper ------- 17um(0.5 oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

4 mil / 5 mil

Minimum / Maximum Holes:

0.35 mm / 2.0 mm

Number of Different Holes:

8

Number of Drill Holes:

1525

Number of Milled Slots:

3

Number of Internal Cutouts:

no

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

TMM13i 1.524mm

Final foil external:

1.0 oz

Final foil internal:

N/A

Final height of PCB:

1.6mm ±0.1

PLATING AND COATING

 

Surface Finish

Immersion gold, 67%

Solder Mask Apply To:

Top Layer

Solder Mask Color:

Green

Solder Mask Type:

LPI

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

Component Side

Colour of Component Legend

White

Manufacturer Name or Logo:

Kuangshun

VIA

Plated through hole(PTH), minimum size 0.35mm.

FLAMIBILITY RATING

94V-0

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.


Conclusion

The Rogers TMM13i High-Frequency PCB is a high-performance material designed to meet the demands of modern RF and microwave applications. With its high dielectric constant, low dissipation factor, and excellent thermal stability, it is an ideal choice for engineers working on advanced communication systems, satellite technology, and high-frequency circuitry.


Whether you're designing for 5G networks, satellite communications, or high-power RF systems, the TMM13i PCB offers the reliability and performance you need to bring your projects to life.



Our PCB Capability (TMM13i)

PCB Capability (TMM13i)

PCB Material:

Ceramic, Hydrocarbon, Thermoset Polymer Composites

Designation:

TMM13i

Dielectric constant:

12.85±0.35

Layer count:

Single Layer,Double Layer, Multilayer, Hybrid PCB

Copper weight:

1oz (35µm), 2oz (70µm)

Dielectric thickness:

15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm),  150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, OSP, Immersin tin, Immersion silver, ENEPIG, Pure gold etc..


Data Sheet of TMM13i

Click to expand/collapse the table

TMM13i Typical Value

Property

TMM13i

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

12.85±0.35

Z

 

10 GHz

IPC-TM-650 2.5.5.5

Dielectric Constant,εDesign

12.2

-

-

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor (process)

0.0019

Z

-

10 GHz

IPC-TM-650 2.5.5.5

Thermal Coefficient of dielectric constant

-70

-

ppm/°K

-55℃-125℃

IPC-TM-650 2.5.5.5

Insulation Resistance

>2000

-

Gohm

C/96/60/95

ASTM D257

Volume Resistivity

-

-

Mohm.cm

-

ASTM D257

Surface Resistivity

-

-

Mohm

-

ASTM D257

Electrical Strength(dielectric strength)

213

Z

V/mil

-

IPC-TM-650 method 2.5.6.2

Thermal Properties

Decompositioin Temperature(Td)

425

425

℃TGA

-

ASTM D3850

Coefficient of Thermal Expansion - x

19

X

ppm/K

0 to 140 ℃

ASTM E 831 IPC-TM-650, 2.4.41

Coefficient of Thermal Expansion - Y

19

Y

ppm/K

0 to 140 ℃

ASTM E 831 IPC-TM-650, 2.4.41

Coefficient of Thermal Expansion - Z

20

Z

ppm/K

0 to 140 ℃

ASTM E 831 IPC-TM-650, 2.4.41

Thermal Conductivity

-

Z

W/m/K

80 ℃

ASTM C518

Mechanical Properties

Copper Peel Strength after Thermal Stress

4.0 (0.7)

X,Y

lb/inch (N/mm)

after solder float 1 oz. EDC

IPC-TM-650 Method 2.4.8

Flexural Strength (MD/CMD)

-

X,Y

kpsi

A

ASTM D790

Flexural Modulus (MD/CMD)

-

X,Y

Mpsi

A

ASTM D790

Physical Properties

Moisture Absorption (2X2)

1.27mm (0.050")

0.16

-

%

D/24/23

ASTM D570

3.18mm (0.125")

0.13

Specific Gravity

3

-

-

A

ASTM D792

Specific Heat Capacity

-

-

J/g/K

A

Calculated

Lead-Free Process Compatible

YES

-

-

-

-



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