(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
In the fast-paced world of electronics, high-frequency PCBs are essential for enabling advanced technologies. The Rogers TMM13i High-Frequency PCB, with a thickness of 60mil (1.524mm) and a high dielectric constant (DK) of 12.85, is a top choice for engineers and designers working on RF and microwave applications. This double-sided PCB, featuring immersion gold surface finish and a green solder mask, is designed to deliver exceptional performance in demanding environments.
Key Features of Rogers TMM13i PCB
1.High Dielectric Constant (DK12.85): The TMM13i material is optimized for high-frequency applications, ensuring minimal signal loss and superior performance in RF and microwave circuits. Its high DK makes it ideal for compact designs where space is at a premium.
2.Low Dissipation Factor: The TMM13i PCB ensures efficient signal transmission, making it suitable for applications that require high signal integrity, such as 5G and satellite communications.
3.Immersion Gold Surface Finish: The immersion gold finish provides excellent conductivity, corrosion resistance, and solderability, ensuring long-term reliability in harsh environments.
4.Customizable Copper Weight: The PCB features a transition from 0.5 oz to 1 oz copper, offering flexibility in design and application.
5.Green Solder Mask: The green solder mask on the top side enhances the board's durability and aesthetic appeal.
6.IPC Class 2 Standards: Manufactured according to IPC Class 2 standards, the TMM13i PCB ensures high quality and reliability.
Applications
The Rogers TMM13i PCB is well-suited for a variety of high-frequency and high-power applications, including:
1.RF and Microwave Circuitry: Ideal for high-frequency signal transmission with minimal loss.
2.Satellite Communication Systems: Ensures reliable performance in space and terrestrial communication systems.
3.Global Positioning Systems (GPS) Antennas: Provides stable signal integrity for navigation and tracking systems.
4.Patch Antennas: Suitable for compact and high-performance antenna designs.
5.Power Amplifiers and Combiners: Delivers efficient power handling and signal integrity.
6.Filters and Couplers: Ensures precise signal filtering and coupling in RF systems.
7.Dielectric Polarizers and Lenses: Used in advanced optical and RF applications.
8.Chip Testers: Provides reliable performance for testing high-frequency components.
PCB Specifications
PCB SIZE |
100 x 100mm=1up |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 17um(0.5 oz)+plate TOP layer |
TMM13i 1.524mm |
|
copper ------- 17um(0.5 oz) + plate BOT Layer |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
4 mil / 5 mil |
Minimum / Maximum Holes: |
0.35 mm / 2.0 mm |
Number of Different Holes: |
8 |
Number of Drill Holes: |
1525 |
Number of Milled Slots: |
3 |
Number of Internal Cutouts: |
no |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
TMM13i 1.524mm |
Final foil external: |
1.0 oz |
Final foil internal: |
N/A |
Final height of PCB: |
1.6mm ±0.1 |
PLATING AND COATING |
|
Surface Finish |
Immersion gold, 67% |
Solder Mask Apply To: |
Top Layer |
Solder Mask Color: |
Green |
Solder Mask Type: |
LPI |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
Component Side |
Colour of Component Legend |
White |
Manufacturer Name or Logo: |
Kuangshun |
VIA |
Plated through hole(PTH), minimum size 0.35mm. |
FLAMIBILITY RATING |
94V-0 |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
Conclusion
The Rogers TMM13i High-Frequency PCB is a high-performance material designed to meet the demands of modern RF and microwave applications. With its high dielectric constant, low dissipation factor, and excellent thermal stability, it is an ideal choice for engineers working on advanced communication systems, satellite technology, and high-frequency circuitry.
Whether you're designing for 5G networks, satellite communications, or high-power RF systems, the TMM13i PCB offers the reliability and performance you need to bring your projects to life.
Our PCB Capability (TMM13i)
PCB Capability (TMM13i) |
|
PCB Material: |
Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: |
TMM13i |
Dielectric constant: |
12.85±0.35 |
Layer count: |
Single Layer,Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Dielectric thickness: |
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersin tin, Immersion silver, ENEPIG, Pure gold etc.. |
Data Sheet of TMM13i
TMM13i Typical Value |
||||||
Property |
TMM13i |
Direction |
Units |
Condition |
Test Method |
|
Dielectric Constant,εProcess |
12.85±0.35 |
Z |
|
10 GHz |
IPC-TM-650 2.5.5.5 |
|
Dielectric Constant,εDesign |
12.2 |
- |
- |
8GHz to 40 GHz |
Differential Phase Length Method |
|
Dissipation Factor (process) |
0.0019 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
|
Thermal Coefficient of dielectric constant |
-70 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
|
Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
|
Volume Resistivity |
- |
- |
Mohm.cm |
- |
ASTM D257 |
|
Surface Resistivity |
- |
- |
Mohm |
- |
ASTM D257 |
|
Electrical Strength(dielectric strength) |
213 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
|
Thermal Properties |
||||||
Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
|
Coefficient of Thermal Expansion - x |
19 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Coefficient of Thermal Expansion - Y |
19 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Coefficient of Thermal Expansion - Z |
20 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Thermal Conductivity |
- |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
|
Mechanical Properties |
||||||
Copper Peel Strength after Thermal Stress |
4.0 (0.7) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
|
Flexural Strength (MD/CMD) |
- |
X,Y |
kpsi |
A |
ASTM D790 |
|
Flexural Modulus (MD/CMD) |
- |
X,Y |
Mpsi |
A |
ASTM D790 |
|
Physical Properties |
||||||
Moisture Absorption (2X2) |
1.27mm (0.050") |
0.16 |
- |
% |
D/24/23 |
ASTM D570 |
3.18mm (0.125") |
0.13 |
|||||
Specific Gravity |
3 |
- |
- |
A |
ASTM D792 |
|
Specific Heat Capacity |
- |
- |
J/g/K |
A |
Calculated |
|
Lead-Free Process Compatible |
YES |
- |
- |
- |
- |