Rogers TMM3 High Frequency Printed Circuit Board 15mil 30mil 60mil DK3.27 RF PCB With Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
Rogers' TMM3 high-frequency laminates are ceramic, hydrocarbon, thermoset polymer composites designed for high PTH reliability in stripline and microstrip applications. TMM3 has a dielectric constant of 3.27 and a dissipation factor of 0.002.
TMM3 features an exceptionally low thermal coefficient of dielectric constant. Its isotropic coefficients of thermal expansion closely match those of copper, resulting in the reliable production of plated-through holes and minimal etch shrinkage. Furthermore, the thermal conductivity of TMM3 is approximately twice that of traditional PTFE/ceramic laminates, facilitating effective heat removal.
Since TMM3 is based on thermoset resins, it does not soften when heated. This allows for wire bonding of component leads to circuit traces without concerns about pad lifting or substrate deformation.
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Typical Applications
1.Chip Testers
2.Dielectric Polarizers and Lenses
3.Filters and Couplers
4.Global Positioning Systems Antennas
5.Patch Antennas
6.Power Amplifiers and Combiners
7.RF and Microwave Circuitry
8.Satellite Communication Systems
Our PCB Capability (TMM3)
PCB Capability (TMM3) |
|
PCB Material: |
Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: |
TMM3 |
Dielectric constant: |
3.27 |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
PCB thickness: |
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold, ENEPIG etc.. |
Why Choose Us?
1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified
2.More than 18 years of high-frequency PCB experience
3.Small quantity orders available; no MOQ required
4.A team driven by passion, discipline, responsibility, and honesty
5.On-time delivery: >98%; Customer complaint rate: <1%
6.16,000㎡ workshop, 30,000㎡ output per month, and 8,000 types of PCBs monthly
7.Robust PCB capabilities to support your R&D, sales, and marketing efforts
8.IPC Class 2 / IPC Class 3
Typical Values of TMM3
TMM3 Typical Value |
||||||
Property |
TMM3 |
Direction |
Units |
Condition |
Test Method |
|
Dielectric Constant,εProcess |
3.27±0.032 |
Z |
|
10 GHz |
IPC-TM-650 2.5.5.5 |
|
Dielectric Constant,εDesign |
3.45 |
- |
- |
8GHz to 40 GHz |
Differential Phase Length Method |
|
Dissipation Factor (process) |
0.002 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
|
Thermal Coefficient of dielectric constant |
+37 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
|
Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
|
Volume Resistivity |
2 x 109 |
- |
Mohm.cm |
- |
ASTM D257 |
|
Surface Resistivity |
>9x 10^9 |
- |
Mohm |
- |
ASTM D257 |
|
Electrical Strength(dielectric strength) |
441 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
|
Thermal Properties |
||||||
Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
|
Coefficient of Thermal Expansion - x |
15 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Coefficient of Thermal Expansion - Y |
15 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Coefficient of Thermal Expansion - Z |
23 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Thermal Conductivity |
0.7 |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
|
Mechanical Properties |
||||||
Copper Peel Strength after Thermal Stress |
5.7 (1.0) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
|
Flexural Strength (MD/CMD) |
16.53 |
X,Y |
kpsi |
A |
ASTM D790 |
|
Flexural Modulus (MD/CMD) |
1.72 |
X,Y |
Mpsi |
A |
ASTM D790 |
|
Physical Properties |
||||||
Moisture Absorption (2X2) |
1.27mm (0.050") |
0.06 |
- |
% |
D/24/23 |
ASTM D570 |
3.18mm (0.125") |
0.12 |
|||||
Specific Gravity |
1.78 |
- |
- |
A |
ASTM D792 |
|
Specific Heat Capacity |
0.87 |
- |
J/g/K |
A |
Calculated |
|
Lead-Free Process Compatible |
YES |
- |
- |
- |
- |
|