Rogers TMM6 Microwave PCB, 20mil 50mil 75mil, DK6.0 RF PCB with Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
We are thrilled to introduce our cutting-edge Rogers TMM6 Microwave PCB, available in 20mil, 50mil, and 75mil thicknesses, with a dielectric constant (DK) of 6.0 and immersion gold surface finish. Designed for high-frequency and high-power applications, this PCB delivers exceptional performance, thermal stability, and reliability, making it the perfect choice for advanced RF and microwave systems.
Key Features of Rogers TMM6 Microwave PCB
High Dielectric Constant (DK6.0): Optimized for high-frequency applications, ensuring minimal signal loss and superior performance in RF and microwave circuits. Low Dissipation Factor (0.0023): Provides efficient signal transmission, ideal for applications requiring high signal integrity. Excellent Thermal Stability: Features a low thermal coefficient of dielectric constant and thermal expansion coefficients that closely match copper, ensuring reliable plated-through holes and minimal etch shrinkage. High Thermal Conductivity (0.72 W/m/K): Facilitates effective heat removal, making it suitable for high-power applications. Immersion Gold Surface Finish: Offers excellent conductivity, corrosion resistance, and solderability, ensuring long-term reliability. Versatile Thickness Options: Available in 20mil (0.508mm), 50mil (1.27mm), and 75mil (1.905mm) thicknesses to meet your specific design requirements.
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Some Typical Applications
The Rogers TMM6 Microwave PCB is ideal for a wide range of high-frequency and high-power applications, including:
RF and Microwave Circuitry
Satellite Communication Systems
Global Positioning Systems (GPS) Antennas
Patch Antennas
Power Amplifiers and Combiners
Filters and Couplers
Dielectric Polarizers and Lenses
Chip Testers
Our PCB Capability (TMM6)
PCB Capability (TMM6) |
|
PCB Material: |
Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: |
TMM6 |
Dielectric constant: |
6 |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Laminate thickness: |
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated, ENEPIG etc.. |
Why Choose Us?
1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified
2.More than 18 years of high-frequency PCB experience
3.Small quantity orders available; no MOQ required
4.A team driven by passion, discipline, responsibility, and honesty
5.On-time delivery: >98%; Customer complaint rate: <1%
6.16,000㎡ workshop, 30,000㎡ output per month, and 8,000 types of PCBs monthly
7.Robust PCB capabilities to support your R&D, sales, and marketing efforts
Get Started Today!
If you're looking for a high-performance PCB solution for RF and microwave applications, ourRogers TMM6 Microwave PCB is the answer. Contact us today to learn more about how this innovative product can benefit your projects.
Data Sheet of TMM6
TMM6 Typical Value |
||||||
Property |
TMM6 |
Direction |
Units |
Condition |
Test Method |
|
Dielectric Constant,εProcess |
6.0±0.08 |
Z |
|
10 GHz |
IPC-TM-650 2.5.5.5 |
|
Dielectric Constant,εDesign |
6.3 |
- |
- |
8GHz to 40 GHz |
Differential Phase Length Method |
|
Dissipation Factor (process) |
0.0023 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
|
Thermal Coefficient of dielectric constant |
-11 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
|
Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
|
Volume Resistivity |
2 x 10^8 |
- |
Mohm.cm |
- |
ASTM D257 |
|
Surface Resistivity |
1 x 10^9 |
- |
Mohm |
- |
ASTM D257 |
|
Electrical Strength(dielectric strength) |
362 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
|
Thermal Properties |
||||||
Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
|
Coefficient of Thermal Expansion - x |
18 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Coefficient of Thermal Expansion - Y |
18 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Coefficient of Thermal Expansion - Z |
26 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
|
Thermal Conductivity |
0.72 |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
|
Mechanical Properties |
||||||
Copper Peel Strength after Thermal Stress |
5.7 (1.0) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
|
Flexural Strength (MD/CMD) |
15.02 |
X,Y |
kpsi |
A |
ASTM D790 |
|
Flexural Modulus (MD/CMD) |
1.75 |
X,Y |
Mpsi |
A |
ASTM D790 |
|
Physical Properties |
||||||
Moisture Absorption (2X2) |
1.27mm (0.050") |
0.06 |
- |
% |
D/24/23 |
ASTM D570 |
3.18mm (0.125") |
0.2 |
|||||
Specific Gravity |
2.37 |
- |
- |
A |
ASTM D792 |
|
Specific Heat Capacity |
0.78 |
- |
J/g/K |
A |
Calculated |
|
Lead-Free Process Compatible |
YES |
- |
- |
- |
- |
|